JPWO2023233894A1 - - Google Patents

Info

Publication number
JPWO2023233894A1
JPWO2023233894A1 JP2024524252A JP2024524252A JPWO2023233894A1 JP WO2023233894 A1 JPWO2023233894 A1 JP WO2023233894A1 JP 2024524252 A JP2024524252 A JP 2024524252A JP 2024524252 A JP2024524252 A JP 2024524252A JP WO2023233894 A1 JPWO2023233894 A1 JP WO2023233894A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024524252A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023233894A1 publication Critical patent/JPWO2023233894A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/32—Inkjet printing inks characterised by colouring agents
    • C09D11/322—Pigment inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/32—Inkjet printing inks characterised by colouring agents
    • C09D11/324—Inkjet printing inks characterised by colouring agents containing carbon black
    • C09D11/326—Inkjet printing inks characterised by colouring agents containing carbon black characterised by the pigment dispersant
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0568—Resist used for applying paste, ink or powder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
JP2024524252A 2022-05-30 2023-04-28 Pending JPWO2023233894A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022087986 2022-05-30
PCT/JP2023/016799 WO2023233894A1 (ja) 2022-05-30 2023-04-28 活性線硬化型インクジェットレジストインク、硬化膜形成方法、硬化膜、プリント配線基板、および電子機器

Publications (1)

Publication Number Publication Date
JPWO2023233894A1 true JPWO2023233894A1 (https=) 2023-12-07

Family

ID=89026319

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024524252A Pending JPWO2023233894A1 (https=) 2022-05-30 2023-04-28

Country Status (5)

Country Link
US (1) US20250368843A1 (https=)
EP (1) EP4534616A4 (https=)
JP (1) JPWO2023233894A1 (https=)
CN (1) CN119301204A (https=)
WO (1) WO2023233894A1 (https=)

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4502427B2 (ja) * 1998-12-09 2010-07-14 互応化学工業株式会社 フォトソルダーレジストインク
JP3824128B2 (ja) * 2000-06-21 2006-09-20 東京応化工業株式会社 光重合性組成物
JP4456833B2 (ja) * 2003-07-24 2010-04-28 太陽インキ製造株式会社 インクジェット用一液型レジスト組成物及びそれを用いたレジストパターンの形成方法
DE602005008977D1 (de) 2004-05-06 2008-09-25 Agfa Graphics Nv Strahlungshärtbare Bindemittel für Tintenstrahldruckverfahren
JP2006321868A (ja) * 2005-05-18 2006-11-30 Fujifilm Holdings Corp インク組成物、インクジェット記録方法、印刷物、平版印刷版の製造方法、及び、平版印刷版
JP2008221468A (ja) * 2007-03-08 2008-09-25 Konica Minolta Holdings Inc インクジェット記録方法
JP4663679B2 (ja) * 2007-05-08 2011-04-06 太陽ホールディングス株式会社 光硬化性樹脂組成物、ドライフィルム、硬化物、及びプリント配線板
JP2009169218A (ja) * 2008-01-18 2009-07-30 Seiko Epson Corp カラーフィルター用インクセット、カラーフィルター、画像表示装置、および、電子機器
WO2013094198A1 (ja) * 2011-12-19 2013-06-27 コニカミノルタ株式会社 活性光線硬化型インクジェットインク及びそれを用いた画像形成方法
JP2013148850A (ja) * 2011-12-22 2013-08-01 Toyo Ink Sc Holdings Co Ltd 撮像素子用着色膜、着色膜セット、カラーフィルタ、及び撮像素子
JP5766671B2 (ja) * 2012-09-05 2015-08-19 株式会社タムラ製作所 黒色硬化性樹脂組成物およびそれを用いたプリント配線基板
JP5526248B2 (ja) 2013-02-13 2014-06-18 太陽ホールディングス株式会社 光硬化性樹脂組成物およびその硬化物
US9744779B2 (en) * 2014-04-10 2017-08-29 Konica Minolta, Inc. Active-light-ray-curable inkjet white ink and image forming method
JP6790829B2 (ja) * 2014-12-15 2020-11-25 コニカミノルタ株式会社 活性光線硬化型インクジェットインク、インクジェット画像形成方法およびインクジェットインクを用いて画像が形成された記録媒体
JP6185943B2 (ja) * 2015-02-10 2017-08-23 互応化学工業株式会社 ソルダーレジスト組成物、被覆プリント配線板
JP6232168B2 (ja) * 2015-06-24 2017-11-15 互応化学工業株式会社 ソルダーレジスト組成物、被膜、被覆プリント配線板、被膜の製造方法、及び被覆プリント配線板の製造方法
JP7255182B2 (ja) * 2017-10-31 2023-04-11 東レ株式会社 ネガ型感光性樹脂組成物、硬化膜、並びに有機ｅｌディスプレイ及びその製造方法
JP7020349B2 (ja) * 2018-09-04 2022-02-16 コニカミノルタ株式会社 レジスト用インクジェットインク
JP7740251B2 (ja) * 2020-09-18 2025-09-17 コニカミノルタ株式会社 硬化性組成物、ソルダーレジスト用インク及びプリント回路基板
JP7107593B2 (ja) 2020-12-02 2022-07-27 Ｎｅｃプラットフォームズ株式会社 電子機器

Also Published As

Publication number Publication date
EP4534616A4 (en) 2025-10-08
US20250368843A1 (en) 2025-12-04
CN119301204A (zh) 2025-01-10
EP4534616A1 (en) 2025-04-09
WO2023233894A1 (ja) 2023-12-07

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Legal Events

Date Code Title Description
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Effective date: 20260311