JPWO2023223588A1 - - Google Patents

Info

Publication number
JPWO2023223588A1
JPWO2023223588A1 JP2024521548A JP2024521548A JPWO2023223588A1 JP WO2023223588 A1 JPWO2023223588 A1 JP WO2023223588A1 JP 2024521548 A JP2024521548 A JP 2024521548A JP 2024521548 A JP2024521548 A JP 2024521548A JP WO2023223588 A1 JPWO2023223588 A1 JP WO2023223588A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024521548A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023223588A1 publication Critical patent/JPWO2023223588A1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/149Source or drain regions of field-effect devices
    • H10D62/151Source or drain regions of field-effect devices of IGFETs 
    • H10D62/156Drain regions of DMOS transistors
    • H10D62/157Impurity concentrations or distributions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66Vertical DMOS [VDMOS] FETs
    • H10D30/668Vertical DMOS [VDMOS] FETs having trench gate electrodes, e.g. UMOS transistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/105Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] 
    • H10D62/106Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]  having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions
    • H10D62/107Buried supplementary regions, e.g. buried guard rings 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126Top-view geometrical layouts of the regions or the junctions
    • H10D62/127Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00Diodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325Silicon carbide
JP2024521548A 2022-05-19 2022-12-19 Pending JPWO2023223588A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022082047 2022-05-19
PCT/JP2022/046591 WO2023223588A1 (ja) 2022-05-19 2022-12-19 半導体チップ

Publications (1)

Publication Number Publication Date
JPWO2023223588A1 true JPWO2023223588A1 (https=) 2023-11-23

Family

ID=88835148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024521548A Pending JPWO2023223588A1 (https=) 2022-05-19 2022-12-19

Country Status (4)

Country Link
JP (1) JPWO2023223588A1 (https=)
CN (1) CN118872069A (https=)
DE (1) DE112022007247T5 (https=)
WO (1) WO2023223588A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5630114B2 (ja) 2010-07-16 2014-11-26 トヨタ自動車株式会社 炭化珪素半導体装置
JP6115678B1 (ja) * 2016-02-01 2017-04-19 富士電機株式会社 炭化珪素半導体装置および炭化珪素半導体装置の製造方法
JP2019096631A (ja) * 2016-04-07 2019-06-20 三菱電機株式会社 半導体装置および電力変換装置
WO2019155783A1 (ja) * 2018-02-06 2019-08-15 住友電気工業株式会社 炭化珪素半導体装置
DE102018103849B4 (de) * 2018-02-21 2022-09-01 Infineon Technologies Ag Siliziumcarbid-Halbleiterbauelement mit einer in einer Grabenstruktur ausgebildeten Gateelektrode
JP7180402B2 (ja) * 2019-01-21 2022-11-30 株式会社デンソー 半導体装置
JP2021114496A (ja) * 2020-01-16 2021-08-05 信一郎 高谷 縦型窒化物半導体トランジスタ装置
JP2022082047A (ja) 2020-11-20 2022-06-01 住友ゴム工業株式会社 搬送台車、及び搬送方法

Also Published As

Publication number Publication date
DE112022007247T5 (de) 2025-03-06
WO2023223588A1 (ja) 2023-11-23
CN118872069A (zh) 2024-10-29

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