JPWO2023223588A1 - - Google Patents
Info
- Publication number
- JPWO2023223588A1 JPWO2023223588A1 JP2024521548A JP2024521548A JPWO2023223588A1 JP WO2023223588 A1 JPWO2023223588 A1 JP WO2023223588A1 JP 2024521548 A JP2024521548 A JP 2024521548A JP 2024521548 A JP2024521548 A JP 2024521548A JP WO2023223588 A1 JPWO2023223588 A1 JP WO2023223588A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/149—Source or drain regions of field-effect devices
- H10D62/151—Source or drain regions of field-effect devices of IGFETs
- H10D62/156—Drain regions of DMOS transistors
- H10D62/157—Impurity concentrations or distributions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
- H10D30/668—Vertical DMOS [VDMOS] FETs having trench gate electrodes, e.g. UMOS transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
- H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
- H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]
- H10D62/106—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions
- H10D62/107—Buried supplementary regions, e.g. buried guard rings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
- H10D62/126—Top-view geometrical layouts of the regions or the junctions
- H10D62/127—Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
- H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
- H10D62/8325—Silicon carbide
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022082047 | 2022-05-19 | ||
| PCT/JP2022/046591 WO2023223588A1 (ja) | 2022-05-19 | 2022-12-19 | 半導体チップ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023223588A1 true JPWO2023223588A1 (https=) | 2023-11-23 |
Family
ID=88835148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024521548A Pending JPWO2023223588A1 (https=) | 2022-05-19 | 2022-12-19 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2023223588A1 (https=) |
| CN (1) | CN118872069A (https=) |
| DE (1) | DE112022007247T5 (https=) |
| WO (1) | WO2023223588A1 (https=) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5630114B2 (ja) | 2010-07-16 | 2014-11-26 | トヨタ自動車株式会社 | 炭化珪素半導体装置 |
| JP6115678B1 (ja) * | 2016-02-01 | 2017-04-19 | 富士電機株式会社 | 炭化珪素半導体装置および炭化珪素半導体装置の製造方法 |
| JP2019096631A (ja) * | 2016-04-07 | 2019-06-20 | 三菱電機株式会社 | 半導体装置および電力変換装置 |
| WO2019155783A1 (ja) * | 2018-02-06 | 2019-08-15 | 住友電気工業株式会社 | 炭化珪素半導体装置 |
| DE102018103849B4 (de) * | 2018-02-21 | 2022-09-01 | Infineon Technologies Ag | Siliziumcarbid-Halbleiterbauelement mit einer in einer Grabenstruktur ausgebildeten Gateelektrode |
| JP7180402B2 (ja) * | 2019-01-21 | 2022-11-30 | 株式会社デンソー | 半導体装置 |
| JP2021114496A (ja) * | 2020-01-16 | 2021-08-05 | 信一郎 高谷 | 縦型窒化物半導体トランジスタ装置 |
| JP2022082047A (ja) | 2020-11-20 | 2022-06-01 | 住友ゴム工業株式会社 | 搬送台車、及び搬送方法 |
-
2022
- 2022-12-19 WO PCT/JP2022/046591 patent/WO2023223588A1/ja not_active Ceased
- 2022-12-19 JP JP2024521548A patent/JPWO2023223588A1/ja active Pending
- 2022-12-19 DE DE112022007247.4T patent/DE112022007247T5/de active Pending
- 2022-12-19 CN CN202280094397.8A patent/CN118872069A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE112022007247T5 (de) | 2025-03-06 |
| WO2023223588A1 (ja) | 2023-11-23 |
| CN118872069A (zh) | 2024-10-29 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251121 |
|
| A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20260407 |