JPWO2023218943A1 - - Google Patents
Info
- Publication number
- JPWO2023218943A1 JPWO2023218943A1 JP2024520368A JP2024520368A JPWO2023218943A1 JP WO2023218943 A1 JPWO2023218943 A1 JP WO2023218943A1 JP 2024520368 A JP2024520368 A JP 2024520368A JP 2024520368 A JP2024520368 A JP 2024520368A JP WO2023218943 A1 JPWO2023218943 A1 JP WO2023218943A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022076900 | 2022-05-09 | ||
| PCT/JP2023/016282 WO2023218943A1 (ja) | 2022-05-09 | 2023-04-25 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023218943A1 true JPWO2023218943A1 (https=) | 2023-11-16 |
| JPWO2023218943A5 JPWO2023218943A5 (https=) | 2025-01-22 |
Family
ID=88730305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024520368A Pending JPWO2023218943A1 (https=) | 2022-05-09 | 2023-04-25 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2023218943A1 (https=) |
| WO (1) | WO2023218943A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000091493A (ja) * | 1998-09-16 | 2000-03-31 | Mitsui High Tec Inc | 表面実装型半導体装置 |
| JP5591211B2 (ja) * | 2011-11-17 | 2014-09-17 | 三菱電機株式会社 | 電力変換装置 |
| JP2014033060A (ja) * | 2012-08-03 | 2014-02-20 | Mitsubishi Electric Corp | 電力用半導体装置モジュール |
| WO2018043535A1 (ja) * | 2016-09-02 | 2018-03-08 | ローム株式会社 | パワーモジュール、駆動回路付パワーモジュール、および産業機器、電気自動車またはハイブリッドカー |
-
2023
- 2023-04-25 WO PCT/JP2023/016282 patent/WO2023218943A1/ja not_active Ceased
- 2023-04-25 JP JP2024520368A patent/JPWO2023218943A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023218943A1 (ja) | 2023-11-16 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241011 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260417 |