JPWO2023218809A1 - - Google Patents

Info

Publication number
JPWO2023218809A1
JPWO2023218809A1 JP2024520296A JP2024520296A JPWO2023218809A1 JP WO2023218809 A1 JPWO2023218809 A1 JP WO2023218809A1 JP 2024520296 A JP2024520296 A JP 2024520296A JP 2024520296 A JP2024520296 A JP 2024520296A JP WO2023218809 A1 JPWO2023218809 A1 JP WO2023218809A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024520296A
Other languages
Japanese (ja)
Other versions
JPWO2023218809A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023218809A1 publication Critical patent/JPWO2023218809A1/ja
Publication of JPWO2023218809A5 publication Critical patent/JPWO2023218809A5/ja
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/36Carbides
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
JP2024520296A 2022-05-11 2023-04-05 Pending JPWO2023218809A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022078328 2022-05-11
PCT/JP2023/014085 WO2023218809A1 (ja) 2022-05-11 2023-04-05 炭化珪素基板、炭化珪素エピタキシャル基板、炭化珪素基板の製造方法および炭化珪素半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2023218809A1 true JPWO2023218809A1 (https=) 2023-11-16
JPWO2023218809A5 JPWO2023218809A5 (https=) 2025-01-22

Family

ID=88730044

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024520296A Pending JPWO2023218809A1 (https=) 2022-05-11 2023-04-05

Country Status (2)

Country Link
JP (1) JPWO2023218809A1 (https=)
WO (1) WO2023218809A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103782370A (zh) * 2011-09-05 2014-05-07 旭硝子株式会社 研磨剂及研磨方法
JPWO2013088928A1 (ja) * 2011-12-14 2015-04-27 旭硝子株式会社 洗浄剤、および炭化ケイ素単結晶基板の製造方法
JP6493690B2 (ja) * 2016-08-31 2019-04-03 昭和電工株式会社 SiCエピタキシャルウェハ及びその製造方法、並びに、ラージピット欠陥検出方法、欠陥識別方法
JP7135531B2 (ja) * 2018-07-20 2022-09-13 株式会社デンソー 炭化珪素半導体装置の製造方法
WO2020235205A1 (ja) * 2019-05-17 2020-11-26 住友電気工業株式会社 炭化珪素基板

Also Published As

Publication number Publication date
WO2023218809A1 (ja) 2023-11-16

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