JPWO2023218801A1 - - Google Patents

Info

Publication number
JPWO2023218801A1
JPWO2023218801A1 JP2024520293A JP2024520293A JPWO2023218801A1 JP WO2023218801 A1 JPWO2023218801 A1 JP WO2023218801A1 JP 2024520293 A JP2024520293 A JP 2024520293A JP 2024520293 A JP2024520293 A JP 2024520293A JP WO2023218801 A1 JPWO2023218801 A1 JP WO2023218801A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024520293A
Other languages
Japanese (ja)
Other versions
JP7732589B2 (ja
JPWO2023218801A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023218801A1 publication Critical patent/JPWO2023218801A1/ja
Publication of JPWO2023218801A5 publication Critical patent/JPWO2023218801A5/ja
Priority to JP2025086319A priority Critical patent/JP2025119022A/ja
Application granted granted Critical
Publication of JP7732589B2 publication Critical patent/JP7732589B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H01G9/10—Sealing, e.g. of lead-in wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/06—Mounting in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/07—Dielectric layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/15—Solid electrolytic capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2024520293A 2022-05-13 2023-04-04 コンデンサ Active JP7732589B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025086319A JP2025119022A (ja) 2022-05-13 2025-05-23 コンデンサ

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022079550 2022-05-13
JP2022079550 2022-05-13
PCT/JP2023/013955 WO2023218801A1 (ja) 2022-05-13 2023-04-04 コンデンサ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025086319A Division JP2025119022A (ja) 2022-05-13 2025-05-23 コンデンサ

Publications (3)

Publication Number Publication Date
JPWO2023218801A1 true JPWO2023218801A1 (https=) 2023-11-16
JPWO2023218801A5 JPWO2023218801A5 (https=) 2024-12-19
JP7732589B2 JP7732589B2 (ja) 2025-09-02

Family

ID=88729998

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2024520293A Active JP7732589B2 (ja) 2022-05-13 2023-04-04 コンデンサ
JP2025086319A Pending JP2025119022A (ja) 2022-05-13 2025-05-23 コンデンサ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025086319A Pending JP2025119022A (ja) 2022-05-13 2025-05-23 コンデンサ

Country Status (5)

Country Link
US (1) US20250054705A1 (https=)
JP (2) JP7732589B2 (https=)
CN (1) CN119173972A (https=)
TW (1) TWI852528B (https=)
WO (1) WO2023218801A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI885959B (zh) * 2023-07-28 2025-06-01 日商村田製作所股份有限公司 內建電容器之基板
TWI912156B (zh) * 2024-04-01 2026-01-11 日商村田製作所股份有限公司 電容器內設基板
WO2026048937A1 (ja) * 2024-09-02 2026-03-05 株式会社村田製作所 コンデンサ素子

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56100494A (en) * 1980-01-16 1981-08-12 Fujitsu Ltd Method of manufacturing printed circuit board
JPH07221458A (ja) * 1994-01-27 1995-08-18 Cmk Corp 多層プリント配線板
JPH10189873A (ja) * 1996-12-20 1998-07-21 Internatl Business Mach Corp <Ibm> 半導体集積回路
JP2001320171A (ja) * 2000-05-08 2001-11-16 Shinko Electric Ind Co Ltd 多層配線基板及び半導体装置
JP2008098487A (ja) * 2006-10-13 2008-04-24 Matsushita Electric Ind Co Ltd 固体電解コンデンサおよび固体電解コンデンサ内蔵基板と、それらの製造方法
JP2009064869A (ja) * 2007-09-05 2009-03-26 Toppan Printing Co Ltd 多層配線板及びその製造方法
US20090161298A1 (en) * 2007-12-21 2009-06-25 Industrial Technology Research Institute Hybrid capacitor
US20120168217A1 (en) * 2010-12-29 2012-07-05 Industrial Technology Research Institute Embedded capacitor substrate module
WO2017154167A1 (ja) * 2016-03-10 2017-09-14 三井金属鉱業株式会社 多層積層板及びこれを用いた多層プリント配線板の製造方法
US20200137889A1 (en) * 2018-10-25 2020-04-30 Korea Electronics Technology Institute Capacitor having through hole structure and manufacturing method therefor
JP2020167361A (ja) * 2019-03-29 2020-10-08 株式会社村田製作所 コンデンサアレイ、及び、複合電子部品

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6565730B2 (en) * 1999-12-29 2003-05-20 Intel Corporation Self-aligned coaxial via capacitors
CN101673619B (zh) * 2009-08-21 2012-10-03 上海宏力半导体制造有限公司 柱状电容器、堆叠型同轴柱状电容器及其制造方法
TWI780668B (zh) * 2020-05-28 2022-10-11 日商村田製作所股份有限公司 用於半導體複合裝置之模組

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56100494A (en) * 1980-01-16 1981-08-12 Fujitsu Ltd Method of manufacturing printed circuit board
JPH07221458A (ja) * 1994-01-27 1995-08-18 Cmk Corp 多層プリント配線板
JPH10189873A (ja) * 1996-12-20 1998-07-21 Internatl Business Mach Corp <Ibm> 半導体集積回路
JP2001320171A (ja) * 2000-05-08 2001-11-16 Shinko Electric Ind Co Ltd 多層配線基板及び半導体装置
JP2008098487A (ja) * 2006-10-13 2008-04-24 Matsushita Electric Ind Co Ltd 固体電解コンデンサおよび固体電解コンデンサ内蔵基板と、それらの製造方法
JP2009064869A (ja) * 2007-09-05 2009-03-26 Toppan Printing Co Ltd 多層配線板及びその製造方法
US20090161298A1 (en) * 2007-12-21 2009-06-25 Industrial Technology Research Institute Hybrid capacitor
US20120168217A1 (en) * 2010-12-29 2012-07-05 Industrial Technology Research Institute Embedded capacitor substrate module
WO2017154167A1 (ja) * 2016-03-10 2017-09-14 三井金属鉱業株式会社 多層積層板及びこれを用いた多層プリント配線板の製造方法
US20200137889A1 (en) * 2018-10-25 2020-04-30 Korea Electronics Technology Institute Capacitor having through hole structure and manufacturing method therefor
JP2020167361A (ja) * 2019-03-29 2020-10-08 株式会社村田製作所 コンデンサアレイ、及び、複合電子部品

Also Published As

Publication number Publication date
WO2023218801A1 (ja) 2023-11-16
TWI852528B (zh) 2024-08-11
JP7732589B2 (ja) 2025-09-02
TW202347378A (zh) 2023-12-01
US20250054705A1 (en) 2025-02-13
JP2025119022A (ja) 2025-08-13
CN119173972A (zh) 2024-12-20

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