JPWO2023190602A1 - - Google Patents
Info
- Publication number
- JPWO2023190602A1 JPWO2023190602A1 JP2024512618A JP2024512618A JPWO2023190602A1 JP WO2023190602 A1 JPWO2023190602 A1 JP WO2023190602A1 JP 2024512618 A JP2024512618 A JP 2024512618A JP 2024512618 A JP2024512618 A JP 2024512618A JP WO2023190602 A1 JPWO2023190602 A1 JP WO2023190602A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
- C08F212/06—Hydrocarbons
- C08F212/08—Styrene
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F210/00—Copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond
- C08F210/02—Ethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/34—Monomers containing two or more unsaturated aliphatic radicals
- C08F212/36—Divinylbenzene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/07—Aldehydes; Ketones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
- C08K5/175—Amines; Quaternary ammonium compounds containing COOH-groups; Esters or salts thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022052522 | 2022-03-28 | ||
| JP2022052522 | 2022-03-28 | ||
| PCT/JP2023/012676 WO2023190602A1 (ja) | 2022-03-28 | 2023-03-28 | 組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023190602A1 true JPWO2023190602A1 (https=) | 2023-10-05 |
| JPWO2023190602A5 JPWO2023190602A5 (https=) | 2024-10-08 |
| JP7780002B2 JP7780002B2 (ja) | 2025-12-03 |
Family
ID=88201808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024512618A Active JP7780002B2 (ja) | 2022-03-28 | 2023-03-28 | 組成物 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP4502054A1 (https=) |
| JP (1) | JP7780002B2 (https=) |
| KR (1) | KR20240152385A (https=) |
| CN (1) | CN118900889A (https=) |
| TW (1) | TWI895714B (https=) |
| WO (1) | WO2023190602A1 (https=) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0940709A (ja) * | 1995-07-31 | 1997-02-10 | Denki Kagaku Kogyo Kk | エチレン−芳香族ビニル化合物共重合体の製造方法 |
| JP2000001577A (ja) * | 1998-06-16 | 2000-01-07 | Mitsui Chemicals Inc | オレフィン重合体組成物およびフィルムの製造方法 |
| JP2009161743A (ja) * | 2007-12-10 | 2009-07-23 | Denki Kagaku Kogyo Kk | 後硬化性樹脂組成物及びそれを用いた高周波用電気絶縁材料 |
| JP2010280771A (ja) * | 2009-06-03 | 2010-12-16 | Denki Kagaku Kogyo Kk | 後硬化性樹脂組成物及びそれを用いた電気絶縁材料 |
| JP2011162673A (ja) * | 2010-02-10 | 2011-08-25 | Tosoh Corp | 樹脂組成物 |
| JP2021054981A (ja) * | 2019-09-30 | 2021-04-08 | 味の素株式会社 | 封止用樹脂組成物 |
| WO2021112088A1 (ja) * | 2019-12-03 | 2021-06-10 | デンカ株式会社 | 硬化性組成物及びその硬化体 |
| WO2022054885A1 (ja) * | 2020-09-11 | 2022-03-17 | デンカ株式会社 | 組成物及びその硬化体 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3371118B2 (ja) | 1991-11-30 | 2003-01-27 | バーゼル・ポリオレフィン・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング | 配位子としてベンゼン融合したインデニル誘導体を持つメタロセン、その製造方法および触媒としてのその用途 |
| JP3659760B2 (ja) | 1996-03-19 | 2005-06-15 | 電気化学工業株式会社 | エチレン−芳香族ビニル化合物共重合体及びその製造方法 |
| EP0872492B1 (en) | 1997-04-17 | 2003-12-03 | Denki Kagaku Kogyo Kabushiki Kaisha | Transition metal compound as catalyst component for polymerization, aromatic vinyl compound-olefin copolymer having stereoregularity and method for its preparation by means of the transition metal compound as catalyst component |
| EP0985689A1 (en) | 1998-09-07 | 2000-03-15 | Denki Kagaku Kogyo Kabushiki Kaisha | Aromatic vinyl compound-ethylene copolymer and method for producing the same |
| CN1192033C (zh) | 1998-10-08 | 2005-03-09 | 陶氏化学公司 | 桥连的金属配合物 |
| US6559234B1 (en) | 1998-12-22 | 2003-05-06 | Denki Kagaku Kogyo Kabushiki Kaisha | Cross-copolymerized olefin/styrene/diene copolymer, process for the production of the same and uses thereof |
| JP3938500B2 (ja) | 2002-01-21 | 2007-06-27 | 株式会社日立製作所 | 低誘電正接化方法及びそれを用いた低誘電正接樹脂組成物及び電気部品 |
| JP3985633B2 (ja) | 2002-08-26 | 2007-10-03 | 株式会社日立製作所 | 低誘電正接絶縁材料を用いた高周波用電子部品 |
| JP5104507B2 (ja) | 2007-04-26 | 2012-12-19 | 日立化成工業株式会社 | セミipn型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板 |
| KR101832684B1 (ko) | 2015-01-13 | 2018-02-26 | 히타치가세이가부시끼가이샤 | 플렉시블 프린트 배선판용 수지 필름, 수지 부착 금속박, 커버 레이 필름, 본딩 시트 및 플렉시블 프린트 배선판 |
| JP6833723B2 (ja) | 2015-12-28 | 2021-02-24 | 日鉄ケミカル&マテリアル株式会社 | 可溶性多官能ビニル芳香族共重合体、その製造方法及び硬化性組成物 |
| KR102537249B1 (ko) | 2017-03-30 | 2023-05-26 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | 가용성 다관능 비닐 방향족 공중합체, 그 제조 방법, 경화성 수지 조성물 및 그 경화물 |
-
2023
- 2023-03-28 TW TW112111766A patent/TWI895714B/zh active
- 2023-03-28 EP EP23780611.2A patent/EP4502054A1/en not_active Withdrawn
- 2023-03-28 KR KR1020247031782A patent/KR20240152385A/ko active Pending
- 2023-03-28 JP JP2024512618A patent/JP7780002B2/ja active Active
- 2023-03-28 CN CN202380028528.7A patent/CN118900889A/zh active Pending
- 2023-03-28 WO PCT/JP2023/012676 patent/WO2023190602A1/ja not_active Ceased
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0940709A (ja) * | 1995-07-31 | 1997-02-10 | Denki Kagaku Kogyo Kk | エチレン−芳香族ビニル化合物共重合体の製造方法 |
| JP2000001577A (ja) * | 1998-06-16 | 2000-01-07 | Mitsui Chemicals Inc | オレフィン重合体組成物およびフィルムの製造方法 |
| JP2009161743A (ja) * | 2007-12-10 | 2009-07-23 | Denki Kagaku Kogyo Kk | 後硬化性樹脂組成物及びそれを用いた高周波用電気絶縁材料 |
| JP2010280771A (ja) * | 2009-06-03 | 2010-12-16 | Denki Kagaku Kogyo Kk | 後硬化性樹脂組成物及びそれを用いた電気絶縁材料 |
| JP2011162673A (ja) * | 2010-02-10 | 2011-08-25 | Tosoh Corp | 樹脂組成物 |
| JP2021054981A (ja) * | 2019-09-30 | 2021-04-08 | 味の素株式会社 | 封止用樹脂組成物 |
| WO2021112088A1 (ja) * | 2019-12-03 | 2021-06-10 | デンカ株式会社 | 硬化性組成物及びその硬化体 |
| WO2021112087A1 (ja) * | 2019-12-03 | 2021-06-10 | デンカ株式会社 | 共重合体及びこれを含む積層体 |
| WO2022054885A1 (ja) * | 2020-09-11 | 2022-03-17 | デンカ株式会社 | 組成物及びその硬化体 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20240152385A (ko) | 2024-10-21 |
| JP7780002B2 (ja) | 2025-12-03 |
| TW202348707A (zh) | 2023-12-16 |
| EP4502054A1 (en) | 2025-02-05 |
| WO2023190602A1 (ja) | 2023-10-05 |
| CN118900889A (zh) | 2024-11-05 |
| TWI895714B (zh) | 2025-09-01 |
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