JPWO2023190471A1 - - Google Patents

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Publication number
JPWO2023190471A1
JPWO2023190471A1 JP2023547056A JP2023547056A JPWO2023190471A1 JP WO2023190471 A1 JPWO2023190471 A1 JP WO2023190471A1 JP 2023547056 A JP2023547056 A JP 2023547056A JP 2023547056 A JP2023547056 A JP 2023547056A JP WO2023190471 A1 JPWO2023190471 A1 JP WO2023190471A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023547056A
Other versions
JPWO2023190471A5 (ja
JP7392905B1 (ja
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Publication of JPWO2023190471A1 publication Critical patent/JPWO2023190471A1/ja
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Publication of JP7392905B1 publication Critical patent/JP7392905B1/ja
Publication of JPWO2023190471A5 publication Critical patent/JPWO2023190471A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102Metallic powder coated with organic material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00Making metallic powder or suspensions thereof
JP2023547056A 2022-03-31 2023-03-28 経時安定性に優れた抗微生物性を有する金属微粒子含有分散液 Active JP7392905B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022059323 2022-03-31
JP2022059323 2022-03-31
PCT/JP2023/012418 WO2023190471A1 (ja) 2022-03-31 2023-03-28 経時安定性に優れた抗微生物性を有する金属微粒子含有分散液

Publications (3)

Publication Number Publication Date
JPWO2023190471A1 true JPWO2023190471A1 (ja) 2023-10-05
JP7392905B1 JP7392905B1 (ja) 2023-12-06
JPWO2023190471A5 JPWO2023190471A5 (ja) 2024-03-08

Family

ID=88202499

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023547056A Active JP7392905B1 (ja) 2022-03-31 2023-03-28 経時安定性に優れた抗微生物性を有する金属微粒子含有分散液

Country Status (2)

Country Link
JP (1) JP7392905B1 (ja)
WO (1) WO2023190471A1 (ja)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5139848B2 (ja) * 2008-03-14 2013-02-06 Dowaエレクトロニクス株式会社 没食子酸の誘導体に被覆された銀ナノ粒子
JP5927745B2 (ja) * 2012-06-27 2016-06-01 三菱マテリアル株式会社 SnAgCu系はんだ粉末及びこの粉末を用いたはんだ用ペースト
JP6103126B1 (ja) * 2016-01-29 2017-03-29 東洋インキScホールディングス株式会社 導電性組成物、その製造方法、および導電性材料
JP7361464B2 (ja) * 2018-10-18 2023-10-16 株式会社ノリタケカンパニーリミテド AgPdコアシェル粒子およびその利用
JP2020147840A (ja) * 2019-03-16 2020-09-17 学校法人智香寺学園埼玉工業大学 ナノコロイド充填防錆金属材料、ナノコロイド混合防錆塗料及びナノコロイド粒子を用いた防錆方法
JP2020169387A (ja) * 2019-04-03 2020-10-15 東洋製罐グループホールディングス株式会社 金属銅微粒子粉末及びその製造方法
JP7465747B2 (ja) * 2020-07-31 2024-04-11 京セラ株式会社 被覆銅粒子、被覆銅粒子の製造方法、銅ペースト、銅ペーストの製造方法、及び半導体装置

Also Published As

Publication number Publication date
WO2023190471A1 (ja) 2023-10-05
JP7392905B1 (ja) 2023-12-06

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