JPWO2023181957A1 - - Google Patents
Info
- Publication number
- JPWO2023181957A1 JPWO2023181957A1 JP2024509979A JP2024509979A JPWO2023181957A1 JP WO2023181957 A1 JPWO2023181957 A1 JP WO2023181957A1 JP 2024509979 A JP2024509979 A JP 2024509979A JP 2024509979 A JP2024509979 A JP 2024509979A JP WO2023181957 A1 JPWO2023181957 A1 JP WO2023181957A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022048678 | 2022-03-24 | ||
| PCT/JP2023/008997 WO2023181957A1 (ja) | 2022-03-24 | 2023-03-09 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023181957A1 true JPWO2023181957A1 (https=) | 2023-09-28 |
| JPWO2023181957A5 JPWO2023181957A5 (https=) | 2024-12-03 |
Family
ID=88101218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024509979A Pending JPWO2023181957A1 (https=) | 2022-03-24 | 2023-03-09 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2023181957A1 (https=) |
| WO (1) | WO2023181957A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8035221B2 (en) * | 2007-11-08 | 2011-10-11 | Intersil Americas, Inc. | Clip mount for integrated circuit leadframes |
| JP2015144188A (ja) * | 2014-01-31 | 2015-08-06 | 株式会社東芝 | 半導体装置及びその製造方法 |
| JP2017073406A (ja) * | 2014-02-24 | 2017-04-13 | 三菱電機株式会社 | 電極リードおよび半導体装置 |
| JP7043225B2 (ja) * | 2017-11-08 | 2022-03-29 | 株式会社東芝 | 半導体装置 |
| JP7271381B2 (ja) * | 2019-09-20 | 2023-05-11 | 株式会社東芝 | 半導体装置 |
-
2023
- 2023-03-09 JP JP2024509979A patent/JPWO2023181957A1/ja active Pending
- 2023-03-09 WO PCT/JP2023/008997 patent/WO2023181957A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023181957A1 (ja) | 2023-09-28 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240912 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260303 |