JPWO2023176377A1 - - Google Patents

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Publication number
JPWO2023176377A1
JPWO2023176377A1 JP2023556515A JP2023556515A JPWO2023176377A1 JP WO2023176377 A1 JPWO2023176377 A1 JP WO2023176377A1 JP 2023556515 A JP2023556515 A JP 2023556515A JP 2023556515 A JP2023556515 A JP 2023556515A JP WO2023176377 A1 JPWO2023176377 A1 JP WO2023176377A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023556515A
Other versions
JPWO2023176377A5 (ja
JP7431388B1 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2023176377A1 publication Critical patent/JPWO2023176377A1/ja
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Publication of JP7431388B1 publication Critical patent/JP7431388B1/ja
Publication of JPWO2023176377A5 publication Critical patent/JPWO2023176377A5/ja
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Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2023556515A 2022-03-16 2023-02-24 セラミック複合基板、及びセラミック複合基板の製造方法 Active JP7431388B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022041689 2022-03-16
JP2022041689 2022-03-16
PCT/JP2023/006812 WO2023176377A1 (ja) 2022-03-16 2023-02-24 セラミック複合基板、及びセラミック複合基板の製造方法

Publications (3)

Publication Number Publication Date
JPWO2023176377A1 true JPWO2023176377A1 (ja) 2023-09-21
JP7431388B1 JP7431388B1 (ja) 2024-02-14
JPWO2023176377A5 JPWO2023176377A5 (ja) 2024-02-22

Family

ID=88023488

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023556515A Active JP7431388B1 (ja) 2022-03-16 2023-02-24 セラミック複合基板、及びセラミック複合基板の製造方法

Country Status (2)

Country Link
JP (1) JP7431388B1 (ja)
WO (1) WO2023176377A1 (ja)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3648189B2 (ja) 2001-09-28 2005-05-18 同和鉱業株式会社 金属−セラミックス回路基板
JP3714557B2 (ja) 2003-04-21 2005-11-09 日立金属株式会社 セラミックス基板用ろう材及びこれを用いたセラミックス回路基板、パワー半導体モジュール
JP4765110B2 (ja) 2005-03-31 2011-09-07 Ｄｏｗａメタルテック株式会社 金属−セラミックス接合基板およびその製造方法
JP6400422B2 (ja) * 2014-10-07 2018-10-03 Ｄｏｗａメタルテック株式会社 金属−セラミックス回路基板およびその製造方法
US10872841B2 (en) 2015-07-09 2020-12-22 Kabushiki Kaisha Toshiba Ceramic metal circuit board and semiconductor device using the same
JP6799479B2 (ja) * 2017-03-03 2020-12-16 Ｄｏｗａメタルテック株式会社 金属−セラミックス回路基板の製造方法

Also Published As

Publication number Publication date
JP7431388B1 (ja) 2024-02-14
WO2023176377A1 (ja) 2023-09-21

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