JPWO2023153357A1 - - Google Patents

Info

Publication number
JPWO2023153357A1
JPWO2023153357A1 JP2023580234A JP2023580234A JPWO2023153357A1 JP WO2023153357 A1 JPWO2023153357 A1 JP WO2023153357A1 JP 2023580234 A JP2023580234 A JP 2023580234A JP 2023580234 A JP2023580234 A JP 2023580234A JP WO2023153357 A1 JPWO2023153357 A1 JP WO2023153357A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023580234A
Other languages
Japanese (ja)
Other versions
JPWO2023153357A5 (https=
JP7804705B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023153357A1 publication Critical patent/JPWO2023153357A1/ja
Publication of JPWO2023153357A5 publication Critical patent/JPWO2023153357A5/ja
Application granted granted Critical
Publication of JP7804705B2 publication Critical patent/JP7804705B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/30—Particle morphology extending in three dimensions
    • C01P2004/32—Spheres
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/016—Additives defined by their aspect ratio

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Silicon Compounds (AREA)
JP2023580234A 2022-02-09 2023-02-06 球状シリカ粉末 Active JP7804705B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022018509 2022-02-09
JP2022018509 2022-02-09
PCT/JP2023/003768 WO2023153357A1 (ja) 2022-02-09 2023-02-06 球状シリカ粉末

Publications (3)

Publication Number Publication Date
JPWO2023153357A1 true JPWO2023153357A1 (https=) 2023-08-17
JPWO2023153357A5 JPWO2023153357A5 (https=) 2024-10-04
JP7804705B2 JP7804705B2 (ja) 2026-01-22

Family

ID=87564424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023580234A Active JP7804705B2 (ja) 2022-02-09 2023-02-06 球状シリカ粉末

Country Status (6)

Country Link
US (1) US20250136454A1 (https=)
EP (1) EP4464663A1 (https=)
JP (1) JP7804705B2 (https=)
KR (1) KR20240144979A (https=)
CN (1) CN118786089A (https=)
WO (1) WO2023153357A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007108437A1 (ja) * 2006-03-17 2007-09-27 Denki Kagaku Kogyo Kabushiki Kaisha シリカ粉末及びその用途
JP2019052051A (ja) * 2017-09-13 2019-04-04 デンカ株式会社 球状シリカフィラー用粉末及びその製造方法
WO2020241902A1 (ja) * 2019-05-31 2020-12-03 日鉄ケミカル＆マテリアル株式会社 球状結晶性シリカ粒子、球状シリカ粒子混合物およびコンポジット材料
JP2021067737A (ja) * 2019-10-18 2021-04-30 株式会社リコー トナー、トナーの製造方法、現像剤、トナー収容ユニット、画像形成装置並びに画像形成方法
JP2021066831A (ja) * 2019-10-25 2021-04-30 帝人株式会社 ポリカーボネート樹脂組成物
WO2021200491A1 (ja) * 2020-03-31 2021-10-07 デンカ株式会社 アルミナ粉末、樹脂組成物、及び放熱部品
JP2021161005A (ja) * 2020-04-01 2021-10-11 株式会社アドマテックス 粒子材料、その製造方法、フィラー材料及び熱伝導物質

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4313924B2 (ja) 2000-03-16 2009-08-12 電気化学工業株式会社 球状シリカ粉末及びその製造方法
JP7438046B2 (ja) 2020-07-15 2024-02-26 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007108437A1 (ja) * 2006-03-17 2007-09-27 Denki Kagaku Kogyo Kabushiki Kaisha シリカ粉末及びその用途
JP2019052051A (ja) * 2017-09-13 2019-04-04 デンカ株式会社 球状シリカフィラー用粉末及びその製造方法
WO2020241902A1 (ja) * 2019-05-31 2020-12-03 日鉄ケミカル＆マテリアル株式会社 球状結晶性シリカ粒子、球状シリカ粒子混合物およびコンポジット材料
JP2021067737A (ja) * 2019-10-18 2021-04-30 株式会社リコー トナー、トナーの製造方法、現像剤、トナー収容ユニット、画像形成装置並びに画像形成方法
JP2021066831A (ja) * 2019-10-25 2021-04-30 帝人株式会社 ポリカーボネート樹脂組成物
WO2021200491A1 (ja) * 2020-03-31 2021-10-07 デンカ株式会社 アルミナ粉末、樹脂組成物、及び放熱部品
JP2021161005A (ja) * 2020-04-01 2021-10-11 株式会社アドマテックス 粒子材料、その製造方法、フィラー材料及び熱伝導物質

Also Published As

Publication number Publication date
US20250136454A1 (en) 2025-05-01
WO2023153357A1 (ja) 2023-08-17
CN118786089A (zh) 2024-10-15
JP7804705B2 (ja) 2026-01-22
KR20240144979A (ko) 2024-10-04
EP4464663A1 (en) 2024-11-20

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