CN118786089A - 球状二氧化硅粉末 - Google Patents

球状二氧化硅粉末 Download PDF

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Publication number
CN118786089A
CN118786089A CN202380020957.XA CN202380020957A CN118786089A CN 118786089 A CN118786089 A CN 118786089A CN 202380020957 A CN202380020957 A CN 202380020957A CN 118786089 A CN118786089 A CN 118786089A
Authority
CN
China
Prior art keywords
particle size
sphericity
silica powder
spherical silica
cup
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380020957.XA
Other languages
English (en)
Chinese (zh)
Inventor
南川孝明
盐月宏幸
狩野源太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd filed Critical Denka Co Ltd
Publication of CN118786089A publication Critical patent/CN118786089A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/30—Particle morphology extending in three dimensions
    • C01P2004/32—Spheres
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/016—Additives defined by their aspect ratio

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Silicon Compounds (AREA)
CN202380020957.XA 2022-02-09 2023-02-06 球状二氧化硅粉末 Pending CN118786089A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022018509 2022-02-09
JP2022-018509 2022-02-09
PCT/JP2023/003768 WO2023153357A1 (ja) 2022-02-09 2023-02-06 球状シリカ粉末

Publications (1)

Publication Number Publication Date
CN118786089A true CN118786089A (zh) 2024-10-15

Family

ID=87564424

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380020957.XA Pending CN118786089A (zh) 2022-02-09 2023-02-06 球状二氧化硅粉末

Country Status (6)

Country Link
US (1) US20250136454A1 (https=)
EP (1) EP4464663A1 (https=)
JP (1) JP7804705B2 (https=)
KR (1) KR20240144979A (https=)
CN (1) CN118786089A (https=)
WO (1) WO2023153357A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4313924B2 (ja) 2000-03-16 2009-08-12 電気化学工業株式会社 球状シリカ粉末及びその製造方法
WO2007108437A1 (ja) * 2006-03-17 2007-09-27 Denki Kagaku Kogyo Kabushiki Kaisha シリカ粉末及びその用途
JP6980467B2 (ja) * 2017-09-13 2021-12-15 デンカ株式会社 球状シリカフィラー用粉末及びその製造方法
WO2020241902A1 (ja) * 2019-05-31 2020-12-03 日鉄ケミカル＆マテリアル株式会社 球状結晶性シリカ粒子、球状シリカ粒子混合物およびコンポジット材料
JP7338396B2 (ja) * 2019-10-18 2023-09-05 株式会社リコー トナー、トナーの製造方法、現像剤、トナー収容ユニット、画像形成装置並びに画像形成方法
JP2021066831A (ja) * 2019-10-25 2021-04-30 帝人株式会社 ポリカーボネート樹脂組成物
EP4129912A4 (en) * 2020-03-31 2023-10-11 Denka Company Limited ALUMINUM OXIDE POWDER, RESIN COMPOSITION AND HEAT DISSIPATION COMPONENT
JP2021161005A (ja) * 2020-04-01 2021-10-11 株式会社アドマテックス 粒子材料、その製造方法、フィラー材料及び熱伝導物質
JP7438046B2 (ja) 2020-07-15 2024-02-26 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法

Also Published As

Publication number Publication date
US20250136454A1 (en) 2025-05-01
WO2023153357A1 (ja) 2023-08-17
JP7804705B2 (ja) 2026-01-22
KR20240144979A (ko) 2024-10-04
JPWO2023153357A1 (https=) 2023-08-17
EP4464663A1 (en) 2024-11-20

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