JPWO2023149168A5 - - Google Patents

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Publication number
JPWO2023149168A5
JPWO2023149168A5 JP2023578433A JP2023578433A JPWO2023149168A5 JP WO2023149168 A5 JPWO2023149168 A5 JP WO2023149168A5 JP 2023578433 A JP2023578433 A JP 2023578433A JP 2023578433 A JP2023578433 A JP 2023578433A JP WO2023149168 A5 JPWO2023149168 A5 JP WO2023149168A5
Authority
JP
Japan
Prior art keywords
wiring
layer
insulating layer
thickness direction
circuit component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023578433A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023149168A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/000779 external-priority patent/WO2023149168A1/ja
Publication of JPWO2023149168A1 publication Critical patent/JPWO2023149168A1/ja
Publication of JPWO2023149168A5 publication Critical patent/JPWO2023149168A5/ja
Pending legal-status Critical Current

Links

JP2023578433A 2022-02-03 2023-01-13 Pending JPWO2023149168A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022015681 2022-02-03
PCT/JP2023/000779 WO2023149168A1 (ja) 2022-02-03 2023-01-13 回路部品、電子装置および回路部品の製造方法

Publications (2)

Publication Number Publication Date
JPWO2023149168A1 JPWO2023149168A1 (https=) 2023-08-10
JPWO2023149168A5 true JPWO2023149168A5 (https=) 2024-10-15

Family

ID=87552314

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023578433A Pending JPWO2023149168A1 (https=) 2022-02-03 2023-01-13

Country Status (3)

Country Link
US (1) US20240379281A1 (https=)
JP (1) JPWO2023149168A1 (https=)
WO (1) WO2023149168A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002344106A (ja) * 2001-05-16 2002-11-29 Matsushita Electric Ind Co Ltd 回路部品内蔵基板とその製造方法
JP4535126B2 (ja) * 2005-05-18 2010-09-01 株式会社村田製作所 電子部品
JP6062691B2 (ja) * 2012-04-25 2017-01-18 Ｎｅｃトーキン株式会社 シート状インダクタ、積層基板内蔵型インダクタ及びそれらの製造方法
CN106068542B (zh) * 2014-03-04 2018-04-17 株式会社村田制作所 线圈部件、线圈模块以及线圈部件的制造方法
WO2016111282A1 (ja) * 2015-01-07 2016-07-14 株式会社村田製作所 コイル部品
JP2017103360A (ja) * 2015-12-02 2017-06-08 Tdk株式会社 コイル部品及び電源回路ユニット
CN113628857B (zh) * 2016-02-01 2024-03-08 株式会社村田制作所 线圈部件及其制造方法
JP6562158B2 (ja) * 2016-09-09 2019-08-21 株式会社村田製作所 積層トロイダルコイルおよびその製造方法
JP2019204835A (ja) * 2018-05-22 2019-11-28 Tdk株式会社 コイル部品及びその製造方法

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