JPWO2023145439A1 - - Google Patents

Info

Publication number
JPWO2023145439A1
JPWO2023145439A1 JP2023520473A JP2023520473A JPWO2023145439A1 JP WO2023145439 A1 JPWO2023145439 A1 JP WO2023145439A1 JP 2023520473 A JP2023520473 A JP 2023520473A JP 2023520473 A JP2023520473 A JP 2023520473A JP WO2023145439 A1 JPWO2023145439 A1 JP WO2023145439A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023520473A
Other versions
JP7364123B1 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023145439A1 publication Critical patent/JPWO2023145439A1/ja
Application granted granted Critical
Publication of JP7364123B1 publication Critical patent/JP7364123B1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
JP2023520473A 2022-01-25 2023-01-12 銅張積層板およびそれを用いた回路基板 Active JP7364123B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022009296 2022-01-25
JP2022009296 2022-01-25
PCT/JP2023/000508 WO2023145439A1 (ja) 2022-01-25 2023-01-12 銅張積層板およびそれを用いた回路基板

Publications (2)

Publication Number Publication Date
JPWO2023145439A1 true JPWO2023145439A1 (ja) 2023-08-03
JP7364123B1 JP7364123B1 (ja) 2023-10-18

Family

ID=87471226

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023520473A Active JP7364123B1 (ja) 2022-01-25 2023-01-12 銅張積層板およびそれを用いた回路基板

Country Status (4)

Country Link
JP (1) JP7364123B1 (ja)
CN (1) CN118201773A (ja)
TW (1) TW202342277A (ja)
WO (1) WO2023145439A1 (ja)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE602006021155D1 (de) 2005-02-03 2011-05-19 Asahi Kasei Chemicals Corp Harzzusammensetzung für elektronische und elektrische bauteile von hochfrequenzanwendungen und geformtes produkt daraus
JP2011253958A (ja) 2010-06-02 2011-12-15 Asahi Kasei Chemicals Corp 高周波回路基材用フィルム及び高周波回路基材
EP3981825A4 (en) 2019-06-04 2023-01-11 DIC Corporation POLYARYLENE SULPHIDE RESIN COMPOSITION, MOLDED ARTICLE OBTAINED BY MOLDING THEREOF, LAMINATE AND METHOD FOR PRODUCTION THEREOF
WO2021100277A1 (ja) 2019-11-19 2021-05-27 Dic株式会社 二軸延伸積層フィルム、積層体およびそれらの製造方法
JP7207605B2 (ja) * 2021-01-07 2023-01-18 Dic株式会社 ポリアリーレンスルフィド樹脂組成物、並びこれを用いた二軸延伸フィルムおよび積層体

Also Published As

Publication number Publication date
WO2023145439A1 (ja) 2023-08-03
TW202342277A (zh) 2023-11-01
CN118201773A (zh) 2024-06-14
JP7364123B1 (ja) 2023-10-18

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