JPWO2023145396A5 - - Google Patents

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Publication number
JPWO2023145396A5
JPWO2023145396A5 JP2023576737A JP2023576737A JPWO2023145396A5 JP WO2023145396 A5 JPWO2023145396 A5 JP WO2023145396A5 JP 2023576737 A JP2023576737 A JP 2023576737A JP 2023576737 A JP2023576737 A JP 2023576737A JP WO2023145396 A5 JPWO2023145396 A5 JP WO2023145396A5
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JP
Japan
Prior art keywords
spreading device
wall
heat spreading
wall surface
end portion
Prior art date
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Application number
JP2023576737A
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English (en)
Japanese (ja)
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JP7521710B2 (ja
JPWO2023145396A1 (https=
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Priority claimed from PCT/JP2023/000092 external-priority patent/WO2023145396A1/ja
Publication of JPWO2023145396A1 publication Critical patent/JPWO2023145396A1/ja
Publication of JPWO2023145396A5 publication Critical patent/JPWO2023145396A5/ja
Application granted granted Critical
Publication of JP7521710B2 publication Critical patent/JP7521710B2/ja
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JP2023576737A 2022-01-25 2023-01-05 熱拡散デバイス及び電子機器 Active JP7521710B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022009467 2022-01-25
JP2022009467 2022-01-25
PCT/JP2023/000092 WO2023145396A1 (ja) 2022-01-25 2023-01-05 熱拡散デバイス及び電子機器

Publications (3)

Publication Number Publication Date
JPWO2023145396A1 JPWO2023145396A1 (https=) 2023-08-03
JPWO2023145396A5 true JPWO2023145396A5 (https=) 2024-07-17
JP7521710B2 JP7521710B2 (ja) 2024-07-24

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ID=85165960

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023576737A Active JP7521710B2 (ja) 2022-01-25 2023-01-05 熱拡散デバイス及び電子機器

Country Status (5)

Country Link
US (1) US20240361084A1 (https=)
JP (1) JP7521710B2 (https=)
CN (2) CN218483134U (https=)
TW (1) TWI878772B (https=)
WO (1) WO2023145396A1 (https=)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6056044A (en) * 1996-01-29 2000-05-02 Sandia Corporation Heat pipe with improved wick structures
TWM382478U (en) * 2010-01-08 2010-06-11 Cooler Master Co Ltd Heat dissipation plate
JP2014214985A (ja) * 2013-04-26 2014-11-17 富士通株式会社 蒸発器、冷却装置及び電子装置
JP6799503B2 (ja) * 2016-12-14 2020-12-16 新光電気工業株式会社 ヒートパイプ及びその製造方法
TW201924512A (zh) * 2017-11-06 2019-06-16 日商大日本印刷股份有限公司 蒸氣腔、電子機器、蒸氣腔用片材以及蒸氣腔用片材及蒸氣腔之製造方法
US10822096B2 (en) * 2018-03-30 2020-11-03 Ge Aviation Systems Llc Avionics cooling module
CN111712681B (zh) * 2018-07-31 2021-12-14 株式会社村田制作所 均热板
US10962298B2 (en) * 2018-09-28 2021-03-30 Microsoft Technology Licensing, Llc Two-phase thermodynamic system having a porous microstructure sheet to increase an aggregate thin-film evaporation area of a working fluid
CN217236573U (zh) * 2018-11-16 2022-08-19 株式会社村田制作所 均热板
JP2021032539A (ja) * 2019-08-28 2021-03-01 京セラ株式会社 熱輸送プレートおよび熱輸送プレートの製造方法
CN115136302B (zh) * 2020-02-26 2025-12-23 京瓷株式会社 散热构件
CN219037720U (zh) * 2020-05-15 2023-05-16 株式会社村田制作所 均热板

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