JPWO2023145396A5 - - Google Patents
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- Publication number
- JPWO2023145396A5 JPWO2023145396A5 JP2023576737A JP2023576737A JPWO2023145396A5 JP WO2023145396 A5 JPWO2023145396 A5 JP WO2023145396A5 JP 2023576737 A JP2023576737 A JP 2023576737A JP 2023576737 A JP2023576737 A JP 2023576737A JP WO2023145396 A5 JPWO2023145396 A5 JP WO2023145396A5
- Authority
- JP
- Japan
- Prior art keywords
- spreading device
- wall
- heat spreading
- wall surface
- end portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009792 diffusion process Methods 0.000 claims 2
- 230000000149 penetrating effect Effects 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022009467 | 2022-01-25 | ||
| JP2022009467 | 2022-01-25 | ||
| PCT/JP2023/000092 WO2023145396A1 (ja) | 2022-01-25 | 2023-01-05 | 熱拡散デバイス及び電子機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023145396A1 JPWO2023145396A1 (https=) | 2023-08-03 |
| JPWO2023145396A5 true JPWO2023145396A5 (https=) | 2024-07-17 |
| JP7521710B2 JP7521710B2 (ja) | 2024-07-24 |
Family
ID=85165960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023576737A Active JP7521710B2 (ja) | 2022-01-25 | 2023-01-05 | 熱拡散デバイス及び電子機器 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240361084A1 (https=) |
| JP (1) | JP7521710B2 (https=) |
| CN (2) | CN218483134U (https=) |
| TW (1) | TWI878772B (https=) |
| WO (1) | WO2023145396A1 (https=) |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6056044A (en) * | 1996-01-29 | 2000-05-02 | Sandia Corporation | Heat pipe with improved wick structures |
| TWM382478U (en) * | 2010-01-08 | 2010-06-11 | Cooler Master Co Ltd | Heat dissipation plate |
| JP2014214985A (ja) * | 2013-04-26 | 2014-11-17 | 富士通株式会社 | 蒸発器、冷却装置及び電子装置 |
| JP6799503B2 (ja) * | 2016-12-14 | 2020-12-16 | 新光電気工業株式会社 | ヒートパイプ及びその製造方法 |
| TW201924512A (zh) * | 2017-11-06 | 2019-06-16 | 日商大日本印刷股份有限公司 | 蒸氣腔、電子機器、蒸氣腔用片材以及蒸氣腔用片材及蒸氣腔之製造方法 |
| US10822096B2 (en) * | 2018-03-30 | 2020-11-03 | Ge Aviation Systems Llc | Avionics cooling module |
| CN111712681B (zh) * | 2018-07-31 | 2021-12-14 | 株式会社村田制作所 | 均热板 |
| US10962298B2 (en) * | 2018-09-28 | 2021-03-30 | Microsoft Technology Licensing, Llc | Two-phase thermodynamic system having a porous microstructure sheet to increase an aggregate thin-film evaporation area of a working fluid |
| CN217236573U (zh) * | 2018-11-16 | 2022-08-19 | 株式会社村田制作所 | 均热板 |
| JP2021032539A (ja) * | 2019-08-28 | 2021-03-01 | 京セラ株式会社 | 熱輸送プレートおよび熱輸送プレートの製造方法 |
| CN115136302B (zh) * | 2020-02-26 | 2025-12-23 | 京瓷株式会社 | 散热构件 |
| CN219037720U (zh) * | 2020-05-15 | 2023-05-16 | 株式会社村田制作所 | 均热板 |
-
2022
- 2022-08-31 CN CN202222325543.3U patent/CN218483134U/zh active Active
-
2023
- 2023-01-05 WO PCT/JP2023/000092 patent/WO2023145396A1/ja not_active Ceased
- 2023-01-05 JP JP2023576737A patent/JP7521710B2/ja active Active
- 2023-01-05 CN CN202520051987.3U patent/CN224004271U/zh active Active
- 2023-01-06 TW TW112100545A patent/TWI878772B/zh active
-
2024
- 2024-07-09 US US18/767,159 patent/US20240361084A1/en active Pending
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