JPWO2023145156A1 - - Google Patents

Info

Publication number
JPWO2023145156A1
JPWO2023145156A1 JP2023576618A JP2023576618A JPWO2023145156A1 JP WO2023145156 A1 JPWO2023145156 A1 JP WO2023145156A1 JP 2023576618 A JP2023576618 A JP 2023576618A JP 2023576618 A JP2023576618 A JP 2023576618A JP WO2023145156 A1 JPWO2023145156 A1 JP WO2023145156A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2023576618A
Other languages
Japanese (ja)
Other versions
JPWO2023145156A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023145156A1 publication Critical patent/JPWO2023145156A1/ja
Publication of JPWO2023145156A5 publication Critical patent/JPWO2023145156A5/ja
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2023576618A 2022-01-28 2022-10-17 Abandoned JPWO2023145156A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022012230 2022-01-28
PCT/JP2022/038636 WO2023145156A1 (ja) 2022-01-28 2022-10-17 転写フィルム及び導体パターン形成方法

Publications (2)

Publication Number Publication Date
JPWO2023145156A1 true JPWO2023145156A1 (https=) 2023-08-03
JPWO2023145156A5 JPWO2023145156A5 (https=) 2024-10-16

Family

ID=87471080

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023576618A Abandoned JPWO2023145156A1 (https=) 2022-01-28 2022-10-17

Country Status (4)

Country Link
JP (1) JPWO2023145156A1 (https=)
CN (1) CN118542078A (https=)
TW (1) TW202330287A (https=)
WO (1) WO2023145156A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102770266B1 (ko) * 2023-08-09 2025-02-21 (주)코아링크 단색 또는 다색 구현이 가능한 컬러 로고 마스크 제조방법 및 그로부터 제조되는 컬러 로고 마스크

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6028160B2 (ja) * 1981-12-07 1985-07-03 三井東圧化学株式会社 導電回路の形成方法
JP2002341525A (ja) * 2001-05-14 2002-11-27 Fuji Photo Film Co Ltd ポジ型フォトレジスト転写材料およびそれを用いた基板表面の加工方法
JP2003309337A (ja) * 2002-04-16 2003-10-31 Fujikura Ltd プリント回路基板
JP2004230729A (ja) * 2003-01-30 2004-08-19 Mitsubishi Plastics Ind Ltd 金属薄膜転写用フィルム
JP2010056179A (ja) * 2008-08-26 2010-03-11 Panasonic Electric Works Co Ltd 導体形成シート及び導体形成シートを用いた配線板の製造方法
JP2014027211A (ja) * 2012-07-30 2014-02-06 Jsr Corp 配線基板の製造方法およびシード層形成用組成物
JP7769468B2 (ja) * 2019-12-13 2025-11-13 旭化成株式会社 感光性樹脂組成物、感光性樹脂組成物を用いた転写フィルム

Also Published As

Publication number Publication date
CN118542078A (zh) 2024-08-23
TW202330287A (zh) 2023-08-01
WO2023145156A1 (ja) 2023-08-03

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Legal Events

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A521 Request for written amendment filed

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Effective date: 20240712

A621 Written request for application examination

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Effective date: 20250710

A762 Written abandonment of application

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Effective date: 20260330