JPWO2023127091A1 - - Google Patents

Info

Publication number
JPWO2023127091A1
JPWO2023127091A1 JP2022537860A JP2022537860A JPWO2023127091A1 JP WO2023127091 A1 JPWO2023127091 A1 JP WO2023127091A1 JP 2022537860 A JP2022537860 A JP 2022537860A JP 2022537860 A JP2022537860 A JP 2022537860A JP WO2023127091 A1 JPWO2023127091 A1 JP WO2023127091A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022537860A
Other languages
Japanese (ja)
Other versions
JPWO2023127091A5 (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023127091A1 publication Critical patent/JPWO2023127091A1/ja
Publication of JPWO2023127091A5 publication Critical patent/JPWO2023127091A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2022537860A 2021-12-28 2021-12-28 Pending JPWO2023127091A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/048775 WO2023127091A1 (ja) 2021-12-28 2021-12-28 半導体装置及び空中線

Publications (2)

Publication Number Publication Date
JPWO2023127091A1 true JPWO2023127091A1 (zh) 2023-07-06
JPWO2023127091A5 JPWO2023127091A5 (zh) 2023-11-29

Family

ID=86998409

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022537860A Pending JPWO2023127091A1 (zh) 2021-12-28 2021-12-28

Country Status (2)

Country Link
JP (1) JPWO2023127091A1 (zh)
WO (1) WO2023127091A1 (zh)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011040030A1 (ja) * 2009-10-01 2011-04-07 パナソニック株式会社 モジュールとその製造方法
JP2011124366A (ja) * 2009-12-10 2011-06-23 Renesas Electronics Corp 半導体装置およびその製造方法
WO2016204208A1 (ja) * 2015-06-19 2016-12-22 株式会社村田製作所 モジュールおよびその製造方法
WO2017170535A1 (ja) * 2016-03-31 2017-10-05 株式会社村田製作所 回路モジュール
JP2019145536A (ja) * 2018-02-15 2019-08-29 三菱電機株式会社 高周波デバイスおよび空中線
JP6821008B2 (ja) * 2017-03-13 2021-01-27 三菱電機株式会社 マイクロ波デバイス及び空中線

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011040030A1 (ja) * 2009-10-01 2011-04-07 パナソニック株式会社 モジュールとその製造方法
JP2011124366A (ja) * 2009-12-10 2011-06-23 Renesas Electronics Corp 半導体装置およびその製造方法
WO2016204208A1 (ja) * 2015-06-19 2016-12-22 株式会社村田製作所 モジュールおよびその製造方法
WO2017170535A1 (ja) * 2016-03-31 2017-10-05 株式会社村田製作所 回路モジュール
JP6821008B2 (ja) * 2017-03-13 2021-01-27 三菱電機株式会社 マイクロ波デバイス及び空中線
JP2019145536A (ja) * 2018-02-15 2019-08-29 三菱電機株式会社 高周波デバイスおよび空中線

Also Published As

Publication number Publication date
WO2023127091A1 (ja) 2023-07-06

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