JPWO2023120111A1 - - Google Patents

Info

Publication number
JPWO2023120111A1
JPWO2023120111A1 JP2023569250A JP2023569250A JPWO2023120111A1 JP WO2023120111 A1 JPWO2023120111 A1 JP WO2023120111A1 JP 2023569250 A JP2023569250 A JP 2023569250A JP 2023569250 A JP2023569250 A JP 2023569250A JP WO2023120111 A1 JPWO2023120111 A1 JP WO2023120111A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023569250A
Other languages
Japanese (ja)
Other versions
JPWO2023120111A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023120111A1 publication Critical patent/JPWO2023120111A1/ja
Publication of JPWO2023120111A5 publication Critical patent/JPWO2023120111A5/ja
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9515Objects of complex shape, e.g. examined with use of a surface follower device
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/20Metals
    • G01N33/207Welded or soldered joints; Solderability
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00Machine learning
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00Features of devices classified in G01N21/00
    • G01N2201/10Scanning
    • G01N2201/101Scanning measuring head
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/20Special algorithmic details
    • G06T2207/20081Training; Learning
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection
    • G06T2207/30136Metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Food Science & Technology (AREA)
  • Medicinal Chemistry (AREA)
  • Signal Processing (AREA)
  • Software Systems (AREA)
  • Artificial Intelligence (AREA)
  • Data Mining & Analysis (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Mechanical Engineering (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2023569250A 2021-12-24 2022-12-02 Pending JPWO2023120111A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021210114 2021-12-24
PCT/JP2022/044533 WO2023120111A1 (ja) 2021-12-24 2022-12-02 外見検査装置、溶接システム及び溶接箇所の外観検査方法

Publications (2)

Publication Number Publication Date
JPWO2023120111A1 true JPWO2023120111A1 (https=) 2023-06-29
JPWO2023120111A5 JPWO2023120111A5 (https=) 2024-09-05

Family

ID=86902130

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023569250A Pending JPWO2023120111A1 (https=) 2021-12-24 2022-12-02

Country Status (4)

Country Link
US (1) US12571742B2 (https=)
JP (1) JPWO2023120111A1 (https=)
CN (1) CN118414541A (https=)
WO (1) WO2023120111A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023120111A1 (ja) * 2021-12-24 2023-06-29 パナソニックIpマネジメント株式会社 外見検査装置、溶接システム及び溶接箇所の外観検査方法

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* Cited by examiner, † Cited by third party
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US9468988B2 (en) * 2009-11-13 2016-10-18 Lincoln Global, Inc. Systems, methods, and apparatuses for monitoring weld quality
JP6221661B2 (ja) * 2013-11-12 2017-11-01 株式会社リコー 検査装置、検査システムおよび検査方法、ならびに、印刷システム
US20160193680A1 (en) * 2015-01-07 2016-07-07 Illinois Tool Works Inc. Automated welding translation platform
US10427239B2 (en) * 2015-04-02 2019-10-01 Illinois Tool Works Inc. Systems and methods for tracking weld training arc parameters
US11347191B2 (en) * 2015-07-29 2022-05-31 Illinois Tool Works Inc. System and method to facilitate welding software as a service
JP6602688B2 (ja) 2016-02-22 2019-11-06 株式会社東芝 軌道データ生成装置および軌道データ生成方法
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JP2018205024A (ja) * 2017-05-31 2018-12-27 株式会社キーエンス 画像検査装置、画像検査方法、画像検査プログラム及びコンピュータで読み取り可能な記録媒体並びに記録した機器
WO2019065578A1 (ja) * 2017-09-29 2019-04-04 富士フイルム株式会社 画像解析装置、印刷装置、画像解析方法、及びプログラム
JP6743084B2 (ja) 2018-04-25 2020-08-19 株式会社小松製作所 溶接システム、方法、溶接判定装置、及び学習済みモデルの構築方法
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JP7116006B2 (ja) * 2019-05-08 2022-08-09 三菱重工業株式会社 溶接制御装置、溶接制御方法、および溶接制御プログラム
JP6835151B2 (ja) 2019-06-28 2021-02-24 株式会社安川電機 評価装置、評価方法、評価システムおよび評価プログラム
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JP7111666B2 (ja) * 2019-08-07 2022-08-02 株式会社神戸製鋼所 可搬型溶接ロボットの溶接制御方法、溶接制御装置、可搬型溶接ロボット及び溶接システム
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US20240316670A1 (en) * 2021-02-10 2024-09-26 Newfrey Llc Computer modeling for detection of discontinuities in welded structures
JP7665145B2 (ja) * 2021-07-30 2025-04-21 国立大学法人大阪大学 溶接検査装置、溶接システム、及び溶接検査方法
JP7326401B2 (ja) * 2021-10-28 2023-08-15 株式会社安川電機 異常推定システム、異常推定方法、及びプログラム
CN118891521A (zh) * 2021-12-22 2024-11-01 卡文迪什核电有限公司 焊接和质量控制的改进以及与其相关的改进
WO2023120111A1 (ja) * 2021-12-24 2023-06-29 パナソニックIpマネジメント株式会社 外見検査装置、溶接システム及び溶接箇所の外観検査方法
JP7702659B2 (ja) * 2022-03-29 2025-07-04 パナソニックIpマネジメント株式会社 画像生成システム、画像生成方法及びプログラム
JP7810599B2 (ja) * 2022-04-22 2026-02-03 株式会社神戸製鋼所 制御方法、制御装置、溶接システム、制御プログラム、及び溶接方法
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KR20250110505A (ko) * 2024-01-12 2025-07-21 삼성에스디아이 주식회사 용접부 불량 검사를 위한 광학 장치 및 기계학습 모델을 학습시키는 방법
CN118023923B (zh) * 2024-03-30 2024-08-02 重庆科技大学 机器人焊接装配机构及其在环形焊缝检测与焊后热处理中的应用

Also Published As

Publication number Publication date
US20240337608A1 (en) 2024-10-10
US12571742B2 (en) 2026-03-10
WO2023120111A1 (ja) 2023-06-29
CN118414541A (zh) 2024-07-30

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