JPWO2023119601A1 - - Google Patents
Info
- Publication number
- JPWO2023119601A1 JPWO2023119601A1 JP2022539446A JP2022539446A JPWO2023119601A1 JP WO2023119601 A1 JPWO2023119601 A1 JP WO2023119601A1 JP 2022539446 A JP2022539446 A JP 2022539446A JP 2022539446 A JP2022539446 A JP 2022539446A JP WO2023119601 A1 JPWO2023119601 A1 JP WO2023119601A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2021/048052 WO2023119601A1 (ja) | 2021-12-23 | 2021-12-23 | ヒータ |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2023119601A1 true JPWO2023119601A1 (ja) | 2023-06-29 |
JPWO2023119601A5 JPWO2023119601A5 (ja) | 2023-11-21 |
JP7391294B2 JP7391294B2 (ja) | 2023-12-05 |
Family
ID=86901805
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022539446A Active JP7391294B2 (ja) | 2021-12-23 | 2021-12-23 | ヒータ |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP7391294B2 (ja) |
WO (1) | WO2023119601A1 (ja) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4386606B2 (ja) | 2001-11-08 | 2009-12-16 | 日本碍子株式会社 | 支持装置の製造方法 |
JP4061220B2 (ja) | 2003-03-20 | 2008-03-12 | 株式会社日立製作所 | ナノプリント装置、及び微細構造転写方法 |
KR102523850B1 (ko) | 2016-07-11 | 2023-04-21 | 주식회사 미코세라믹스 | 척 구조물 및 척 구조물을 갖는 칩 분리 장치 |
US11049755B2 (en) | 2018-09-14 | 2021-06-29 | Applied Materials, Inc. | Semiconductor substrate supports with embedded RF shield |
JP7248465B2 (ja) | 2019-03-19 | 2023-03-29 | 株式会社Screenホールディングス | 基板処理装置のスピンチャック |
JP2022054764A (ja) | 2020-09-28 | 2022-04-07 | 日本特殊陶業株式会社 | 保持装置 |
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2021
- 2021-12-23 WO PCT/JP2021/048052 patent/WO2023119601A1/ja active Application Filing
- 2021-12-23 JP JP2022539446A patent/JP7391294B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
WO2023119601A1 (ja) | 2023-06-29 |
JP7391294B2 (ja) | 2023-12-05 |
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