JPWO2023112573A1 - - Google Patents

Info

Publication number
JPWO2023112573A1
JPWO2023112573A1 JP2023567620A JP2023567620A JPWO2023112573A1 JP WO2023112573 A1 JPWO2023112573 A1 JP WO2023112573A1 JP 2023567620 A JP2023567620 A JP 2023567620A JP 2023567620 A JP2023567620 A JP 2023567620A JP WO2023112573 A1 JPWO2023112573 A1 JP WO2023112573A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2023567620A
Other languages
Japanese (ja)
Other versions
JPWO2023112573A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023112573A1 publication Critical patent/JPWO2023112573A1/ja
Publication of JPWO2023112573A5 publication Critical patent/JPWO2023112573A5/ja
Abandoned legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/30Imagewise removal using liquid means
    • G03F7/32Liquid compositions therefor, e.g. developers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2023567620A 2021-12-14 2022-11-14 Abandoned JPWO2023112573A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021202173 2021-12-14
PCT/JP2022/042180 WO2023112573A1 (ja) 2021-12-14 2022-11-14 硬化物の製造方法、積層体の製造方法、及び、半導体デバイスの製造方法、並びに、処理液

Publications (2)

Publication Number Publication Date
JPWO2023112573A1 true JPWO2023112573A1 (https=) 2023-06-22
JPWO2023112573A5 JPWO2023112573A5 (https=) 2024-08-27

Family

ID=86774090

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023567620A Abandoned JPWO2023112573A1 (https=) 2021-12-14 2022-11-14

Country Status (3)

Country Link
JP (1) JPWO2023112573A1 (https=)
TW (1) TW202323511A (https=)
WO (1) WO2023112573A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025253920A1 (ja) * 2024-06-07 2025-12-11 住友化学株式会社 感光性樹脂組成物、その硬化膜、及び該硬化膜を含む半導体パッケージ

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014157299A (ja) * 2013-02-18 2014-08-28 Shin Etsu Chem Co Ltd パターン形成方法及びパターン反転膜材料
WO2018025738A1 (ja) * 2016-08-01 2018-02-08 富士フイルム株式会社 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、積層体の製造方法および半導体デバイス
WO2021157643A1 (ja) * 2020-02-04 2021-08-12 富士フイルム株式会社 樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014157299A (ja) * 2013-02-18 2014-08-28 Shin Etsu Chem Co Ltd パターン形成方法及びパターン反転膜材料
WO2018025738A1 (ja) * 2016-08-01 2018-02-08 富士フイルム株式会社 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、積層体の製造方法および半導体デバイス
WO2021157643A1 (ja) * 2020-02-04 2021-08-12 富士フイルム株式会社 樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス

Also Published As

Publication number Publication date
TW202323511A (zh) 2023-06-16
WO2023112573A1 (ja) 2023-06-22

Similar Documents

Publication Publication Date Title
JPWO2021157643A1 (https=)
CN306279357S (https=)
CN305754009S (https=)
CN305537668S (https=)
CN305539849S (https=)
CN305542019S (https=)
CN305543886S (https=)
CN305545381S (https=)
CN305546169S (https=)
CN305547037S (https=)
CN305527091S (https=)
CN305551469S (https=)
CN305552245S (https=)
CN305552607S (https=)
CN305679478S (https=)
CN305680176S (https=)
CN305684597S (https=)
CN305698676S (https=)
CN305701662S (https=)
CN305703898S (https=)
CN305707683S (https=)
CN305708891S (https=)
CN305710140S (https=)
CN305711672S (https=)
CN305713021S (https=)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240604

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20251002

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20260217

A762 Written abandonment of application

Free format text: JAPANESE INTERMEDIATE CODE: A762

Effective date: 20260402