JPWO2023100612A1 - - Google Patents

Info

Publication number
JPWO2023100612A1
JPWO2023100612A1 JP2023564841A JP2023564841A JPWO2023100612A1 JP WO2023100612 A1 JPWO2023100612 A1 JP WO2023100612A1 JP 2023564841 A JP2023564841 A JP 2023564841A JP 2023564841 A JP2023564841 A JP 2023564841A JP WO2023100612 A1 JPWO2023100612 A1 JP WO2023100612A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023564841A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023100612A1 publication Critical patent/JPWO2023100612A1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/56Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/10Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
    • H04N25/17Colour separation based on photon absorption depth, e.g. full colour resolution obtained simultaneously at each pixel location
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/50Control of the SSIS exposure
    • H04N25/53Control of the integration time
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/50Control of the SSIS exposure
    • H04N25/53Control of the integration time
    • H04N25/533Control of the integration time by using differing integration times for different sensor regions
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/50Control of the SSIS exposure
    • H04N25/57Control of the dynamic range
    • H04N25/58Control of the dynamic range involving two or more exposures
    • H04N25/581Control of the dynamic range involving two or more exposures acquired simultaneously
    • H04N25/585Control of the dynamic range involving two or more exposures acquired simultaneously with pixels having different sensitivities within the sensor, e.g. fast or slow pixels or pixels having different sizes
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60Noise processing, e.g. detecting, correcting, reducing or removing noise
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/617Noise processing, e.g. detecting, correcting, reducing or removing noise for reducing electromagnetic interference, e.g. clocking noise
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/182Colour image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/182Colour image sensors
    • H10F39/1825Multicolour image sensors having stacked structure, e.g. NPN, NPNPN or multiple quantum well [MQW] structures

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP2023564841A 2021-12-02 2022-11-09 Pending JPWO2023100612A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021196518 2021-12-02
JP2022131133 2022-08-19
PCT/JP2022/041783 WO2023100612A1 (ja) 2021-12-02 2022-11-09 撮像装置およびカメラシステム

Publications (1)

Publication Number Publication Date
JPWO2023100612A1 true JPWO2023100612A1 (https=) 2023-06-08

Family

ID=86611985

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023564841A Pending JPWO2023100612A1 (https=) 2021-12-02 2022-11-09

Country Status (4)

Country Link
US (1) US20240298096A1 (https=)
EP (1) EP4443896A4 (https=)
JP (1) JPWO2023100612A1 (https=)
WO (1) WO2023100612A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7713649B2 (ja) * 2020-12-11 2025-07-28 パナソニックIpマネジメント株式会社 撮像装置および駆動方法
US12615448B2 (en) * 2024-04-17 2026-04-28 Himax Imaging Limited White-infra-red image sensor having unit pixel with vertically stacked arrangement of photoelectric conversion regions

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100787938B1 (ko) 2005-07-15 2007-12-24 삼성전자주식회사 공유 능동 화소 센서 구조의 씨모스 이미지 센서 및 그구동 방법
JP2010232410A (ja) 2009-03-27 2010-10-14 Toyo Ink Mfg Co Ltd 有機光電変換素子
US20120204960A1 (en) 2009-10-30 2012-08-16 Takehito Kato Organic photovoltaic cell and method for manufacturing the same
JP5533046B2 (ja) * 2010-03-05 2014-06-25 ソニー株式会社 固体撮像装置、固体撮像装置の製造方法、固体撮像装置の駆動方法、及び電子機器
KR102065633B1 (ko) 2013-08-12 2020-01-13 삼성전자 주식회사 이미지 센서, 이의 동작 방법, 및 이를 포함하는 시스템
CN112929586B (zh) * 2015-12-03 2024-12-06 松下知识产权经营株式会社 摄像装置
JP7308440B2 (ja) * 2017-09-28 2023-07-14 パナソニックIpマネジメント株式会社 撮像装置、およびカメラシステム
JP2019186738A (ja) 2018-04-10 2019-10-24 キヤノン株式会社 撮像装置
WO2020170703A1 (ja) * 2019-02-20 2020-08-27 パナソニックIpマネジメント株式会社 撮像装置およびその駆動方法
JP7599156B2 (ja) * 2019-04-26 2024-12-13 パナソニックIpマネジメント株式会社 撮像素子

Also Published As

Publication number Publication date
EP4443896A4 (en) 2025-01-22
US20240298096A1 (en) 2024-09-05
WO2023100612A1 (ja) 2023-06-08
EP4443896A1 (en) 2024-10-09

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