JPWO2023100439A1 - - Google Patents
Info
- Publication number
- JPWO2023100439A1 JPWO2023100439A1 JP2023564745A JP2023564745A JPWO2023100439A1 JP WO2023100439 A1 JPWO2023100439 A1 JP WO2023100439A1 JP 2023564745 A JP2023564745 A JP 2023564745A JP 2023564745 A JP2023564745 A JP 2023564745A JP WO2023100439 A1 JPWO2023100439 A1 JP WO2023100439A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021196756 | 2021-12-03 | ||
| PCT/JP2022/034308 WO2023100439A1 (ja) | 2021-12-03 | 2022-09-14 | 樹脂封止装置及び樹脂封止方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023100439A1 true JPWO2023100439A1 (https=) | 2023-06-08 |
Family
ID=86611909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023564745A Pending JPWO2023100439A1 (https=) | 2021-12-03 | 2022-09-14 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023100439A1 (https=) |
| TW (1) | TWI820948B (https=) |
| WO (1) | WO2023100439A1 (https=) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019145548A (ja) * | 2018-02-16 | 2019-08-29 | アピックヤマダ株式会社 | 樹脂モールド装置及び樹脂モールド方法 |
| WO2020137386A1 (ja) * | 2018-12-27 | 2020-07-02 | アピックヤマダ株式会社 | 樹脂モールド装置 |
| JP2021133592A (ja) * | 2020-02-26 | 2021-09-13 | Ｉ−Ｐｅｘ株式会社 | 樹脂封止装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4927653B2 (ja) * | 2007-07-10 | 2012-05-09 | 住友重機械工業株式会社 | 樹脂封止装置 |
| CN202962899U (zh) * | 2012-11-02 | 2013-06-05 | 苏州富士胶片映像机器有限公司 | 一种注塑用树脂的自动分检系统 |
| TWI787411B (zh) * | 2018-02-16 | 2022-12-21 | 日商山田尖端科技股份有限公司 | 樹脂模製裝置 |
-
2022
- 2022-09-14 JP JP2023564745A patent/JPWO2023100439A1/ja active Pending
- 2022-09-14 WO PCT/JP2022/034308 patent/WO2023100439A1/ja not_active Ceased
- 2022-10-04 TW TW111137614A patent/TWI820948B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019145548A (ja) * | 2018-02-16 | 2019-08-29 | アピックヤマダ株式会社 | 樹脂モールド装置及び樹脂モールド方法 |
| WO2020137386A1 (ja) * | 2018-12-27 | 2020-07-02 | アピックヤマダ株式会社 | 樹脂モールド装置 |
| JP2021133592A (ja) * | 2020-02-26 | 2021-09-13 | Ｉ−Ｐｅｘ株式会社 | 樹脂封止装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI820948B (zh) | 2023-11-01 |
| TW202323061A (zh) | 2023-06-16 |
| WO2023100439A1 (ja) | 2023-06-08 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240328 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20241204 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20250421 |