JPWO2023089899A1 - - Google Patents
Info
- Publication number
- JPWO2023089899A1 JPWO2023089899A1 JP2023562147A JP2023562147A JPWO2023089899A1 JP WO2023089899 A1 JPWO2023089899 A1 JP WO2023089899A1 JP 2023562147 A JP2023562147 A JP 2023562147A JP 2023562147 A JP2023562147 A JP 2023562147A JP WO2023089899 A1 JPWO2023089899 A1 JP WO2023089899A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/028—Housing; Enclosing; Embedding; Filling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
- H01C1/142—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C13/00—Resistors not provided for elsewhere
- H01C13/02—Structural combinations of resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Details Of Resistors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021187678 | 2021-11-18 | ||
| PCT/JP2022/032394 WO2023089899A1 (ja) | 2021-11-18 | 2022-08-29 | チップ抵抗器モジュール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023089899A1 true JPWO2023089899A1 (https=) | 2023-05-25 |
| JPWO2023089899A5 JPWO2023089899A5 (https=) | 2024-08-02 |
Family
ID=86396640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023562147A Pending JPWO2023089899A1 (https=) | 2021-11-18 | 2022-08-29 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20240212888A1 (https=) |
| JP (1) | JPWO2023089899A1 (https=) |
| CN (1) | CN118266044A (https=) |
| WO (1) | WO2023089899A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI876614B (zh) * | 2023-10-24 | 2025-03-11 | 天二科技股份有限公司 | 晶片電阻及其製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0963805A (ja) * | 1995-08-28 | 1997-03-07 | Matsushita Electric Ind Co Ltd | 角形チップ抵抗器 |
| JP2002075702A (ja) * | 2000-08-25 | 2002-03-15 | K-Tech Devices Corp | 面実装型ネットワーク電子部品及びその製造法 |
| JP5094797B2 (ja) * | 2009-08-07 | 2012-12-12 | 日立オートモティブシステムズ株式会社 | 直流電源平滑用コンデンサーの放電回路 |
| JP7336636B2 (ja) * | 2017-12-11 | 2023-09-01 | パナソニックＩｐマネジメント株式会社 | チップ抵抗器 |
-
2022
- 2022-08-29 JP JP2023562147A patent/JPWO2023089899A1/ja active Pending
- 2022-08-29 WO PCT/JP2022/032394 patent/WO2023089899A1/ja not_active Ceased
- 2022-08-29 CN CN202280076382.9A patent/CN118266044A/zh active Pending
-
2024
- 2024-03-07 US US18/598,969 patent/US20240212888A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20240212888A1 (en) | 2024-06-27 |
| WO2023089899A1 (ja) | 2023-05-25 |
| CN118266044A (zh) | 2024-06-28 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240322 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250822 |