JPWO2023079956A1 - - Google Patents

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Publication number
JPWO2023079956A1
JPWO2023079956A1 JP2023557937A JP2023557937A JPWO2023079956A1 JP WO2023079956 A1 JPWO2023079956 A1 JP WO2023079956A1 JP 2023557937 A JP2023557937 A JP 2023557937A JP 2023557937 A JP2023557937 A JP 2023557937A JP WO2023079956 A1 JPWO2023079956 A1 JP WO2023079956A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023557937A
Other languages
Japanese (ja)
Other versions
JPWO2023079956A5 (https=
JP7784443B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023079956A1 publication Critical patent/JPWO2023079956A1/ja
Publication of JPWO2023079956A5 publication Critical patent/JPWO2023079956A5/ja
Priority to JP2025210279A priority Critical patent/JP2026048725A/ja
Application granted granted Critical
Publication of JP7784443B2 publication Critical patent/JP7784443B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/11—Region-based segmentation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P10/00—Bonding of wafers, substrates or parts of devices
    • H10P10/12—Bonding of semiconductor wafers or semiconductor substrates to semiconductor wafers or semiconductor substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/128—Preparing bulk and homogeneous wafers by edge treatment, e.g. chamfering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20021—Dividing image into blocks, subimages or windows
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Quality & Reliability (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Laser Beam Processing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2023557937A 2021-11-02 2022-10-19 処理方法及び処理システム Active JP7784443B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025210279A JP2026048725A (ja) 2021-11-02 2025-12-01 処理方法及び処理システム

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021179529 2021-11-02
JP2021179529 2021-11-02
PCT/JP2022/038885 WO2023079956A1 (ja) 2021-11-02 2022-10-19 処理方法及び処理システム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025210279A Division JP2026048725A (ja) 2021-11-02 2025-12-01 処理方法及び処理システム

Publications (3)

Publication Number Publication Date
JPWO2023079956A1 true JPWO2023079956A1 (https=) 2023-05-11
JPWO2023079956A5 JPWO2023079956A5 (https=) 2024-07-08
JP7784443B2 JP7784443B2 (ja) 2025-12-11

Family

ID=86240952

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023557937A Active JP7784443B2 (ja) 2021-11-02 2022-10-19 処理方法及び処理システム
JP2025210279A Pending JP2026048725A (ja) 2021-11-02 2025-12-01 処理方法及び処理システム

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025210279A Pending JP2026048725A (ja) 2021-11-02 2025-12-01 処理方法及び処理システム

Country Status (6)

Country Link
US (1) US20240416450A1 (https=)
JP (2) JP7784443B2 (https=)
KR (1) KR20240107142A (https=)
CN (1) CN118160072A (https=)
TW (1) TW202331793A (https=)
WO (1) WO2023079956A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024060329A (ja) * 2022-10-19 2024-05-02 シンフォニアテクノロジー株式会社 マッピング装置及び基板収容状態判定方法
WO2025079432A1 (ja) * 2023-10-10 2025-04-17 東京エレクトロン株式会社 処理方法、処理システム及び検査装置
TWI876690B (zh) * 2023-11-23 2025-03-11 聚嶸科技股份有限公司 晶片接合設備以及晶片接合方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020136448A (ja) * 2019-02-19 2020-08-31 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP2020136442A (ja) * 2019-02-18 2020-08-31 東京エレクトロン株式会社 レーザー加工装置の設定方法、レーザー加工方法、レーザー加工装置、薄化システム、および基板処理方法
WO2020184179A1 (ja) * 2019-03-08 2020-09-17 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP2021068867A (ja) * 2019-10-28 2021-04-30 東京エレクトロン株式会社 基板処理方法及び基板処理システム
JP2021103725A (ja) * 2019-12-25 2021-07-15 東京エレクトロン株式会社 基板処理方法及び基板処理システム

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118263105A (zh) 2018-03-14 2024-06-28 东京毅力科创株式会社 基板处理系统、基板处理方法以及计算机存储介质

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020136442A (ja) * 2019-02-18 2020-08-31 東京エレクトロン株式会社 レーザー加工装置の設定方法、レーザー加工方法、レーザー加工装置、薄化システム、および基板処理方法
JP2020136448A (ja) * 2019-02-19 2020-08-31 東京エレクトロン株式会社 基板処理装置及び基板処理方法
WO2020184179A1 (ja) * 2019-03-08 2020-09-17 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP2021068867A (ja) * 2019-10-28 2021-04-30 東京エレクトロン株式会社 基板処理方法及び基板処理システム
JP2021103725A (ja) * 2019-12-25 2021-07-15 東京エレクトロン株式会社 基板処理方法及び基板処理システム

Also Published As

Publication number Publication date
WO2023079956A1 (ja) 2023-05-11
US20240416450A1 (en) 2024-12-19
CN118160072A (zh) 2024-06-07
JP2026048725A (ja) 2026-03-17
JP7784443B2 (ja) 2025-12-11
KR20240107142A (ko) 2024-07-08
TW202331793A (zh) 2023-08-01

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