JPWO2023074137A1 - - Google Patents
Info
- Publication number
- JPWO2023074137A1 JPWO2023074137A1 JP2023556164A JP2023556164A JPWO2023074137A1 JP WO2023074137 A1 JPWO2023074137 A1 JP WO2023074137A1 JP 2023556164 A JP2023556164 A JP 2023556164A JP 2023556164 A JP2023556164 A JP 2023556164A JP WO2023074137 A1 JPWO2023074137 A1 JP WO2023074137A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
- H01F27/36—Electric or magnetic shields or screens
- H01F27/363—Electric or magnetic shields or screens made of electrically conductive material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/288—Shielding
- H01F27/2885—Shielding with shields or electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F19/00—Fixed transformers or mutual inductances of the signal type
- H01F19/04—Transformers or mutual inductances suitable for handling frequencies considerably beyond the audio range
- H01F19/08—Transformers having magnetic bias, e.g. for handling pulses
- H01F2019/085—Transformer for galvanic isolation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F38/00—Adaptations of transformers or inductances for specific applications or functions
- H01F38/14—Inductive couplings
- H01F2038/143—Inductive couplings for signals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F38/00—Adaptations of transformers or inductances for specific applications or functions
- H01F38/14—Inductive couplings
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021173793 | 2021-10-25 | ||
| PCT/JP2022/033692 WO2023074137A1 (ja) | 2021-10-25 | 2022-09-08 | トランスチップ、信号伝達装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023074137A1 true JPWO2023074137A1 (https=) | 2023-05-04 |
| JPWO2023074137A5 JPWO2023074137A5 (https=) | 2024-07-11 |
Family
ID=86157686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023556164A Pending JPWO2023074137A1 (https=) | 2021-10-25 | 2022-09-08 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20240221992A1 (https=) |
| JP (1) | JPWO2023074137A1 (https=) |
| CN (1) | CN118020158A (https=) |
| WO (1) | WO2023074137A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021215237A1 (ja) * | 2020-04-24 | 2021-10-28 | ローム株式会社 | パルス受信回路、信号伝達装置 |
| WO2025009421A1 (ja) * | 2023-07-03 | 2025-01-09 | ローム株式会社 | トランスチップおよび信号伝達装置 |
| JP2025017247A (ja) * | 2023-07-24 | 2025-02-05 | 合肥晶合集成電路股▲ふん▼有限公司 | 半導体装置及び半導体装置の設計支援装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3221415B2 (ja) * | 1998-11-18 | 2001-10-22 | 日本電気株式会社 | アナログ信号パッドのシールド法、および半導体集積回路 |
| JP5964183B2 (ja) * | 2012-09-05 | 2016-08-03 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP6619698B2 (ja) * | 2016-06-09 | 2019-12-11 | ルネサスエレクトロニクス株式会社 | 半導体装置、及び通信回路 |
| DE112018004478B4 (de) * | 2017-10-13 | 2025-03-27 | Rohm Co., Ltd. | Elektronikkomponente |
-
2022
- 2022-09-08 CN CN202280063884.8A patent/CN118020158A/zh active Pending
- 2022-09-08 WO PCT/JP2022/033692 patent/WO2023074137A1/ja not_active Ceased
- 2022-09-08 JP JP2023556164A patent/JPWO2023074137A1/ja active Pending
-
2024
- 2024-03-20 US US18/610,509 patent/US20240221992A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20240221992A1 (en) | 2024-07-04 |
| CN118020158A (zh) | 2024-05-10 |
| WO2023074137A1 (ja) | 2023-05-04 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240318 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250901 |