JPWO2023073833A1 - - Google Patents

Info

Publication number
JPWO2023073833A1
JPWO2023073833A1 JP2023555954A JP2023555954A JPWO2023073833A1 JP WO2023073833 A1 JPWO2023073833 A1 JP WO2023073833A1 JP 2023555954 A JP2023555954 A JP 2023555954A JP 2023555954 A JP2023555954 A JP 2023555954A JP WO2023073833 A1 JPWO2023073833 A1 JP WO2023073833A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023555954A
Other languages
Japanese (ja)
Other versions
JPWO2023073833A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023073833A1 publication Critical patent/JPWO2023073833A1/ja
Publication of JPWO2023073833A5 publication Critical patent/JPWO2023073833A5/ja
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/032Observing, e.g. monitoring, the workpiece using optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2023555954A 2021-10-27 2021-10-27 Pending JPWO2023073833A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/039660 WO2023073833A1 (ja) 2021-10-27 2021-10-27 データ生成方法、クラウドシステム、加工装置、コンピュータプログラム及び記録媒体

Publications (2)

Publication Number Publication Date
JPWO2023073833A1 true JPWO2023073833A1 (https=) 2023-05-04
JPWO2023073833A5 JPWO2023073833A5 (https=) 2024-09-09

Family

ID=86159230

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023555954A Pending JPWO2023073833A1 (https=) 2021-10-27 2021-10-27

Country Status (5)

Country Link
US (1) US20240416449A1 (https=)
EP (1) EP4424454A4 (https=)
JP (1) JPWO2023073833A1 (https=)
CN (1) CN118284491A (https=)
WO (1) WO2023073833A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7649694B2 (ja) * 2021-05-28 2025-03-21 株式会社ディスコ レーザー加工装置
WO2025094320A1 (ja) * 2023-11-01 2025-05-08 株式会社ニコン データ生成方法、コンピュータプログラム、記録媒体及び加工装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009532213A (ja) * 2006-03-31 2009-09-10 スリーエム イノベイティブ プロパティズ カンパニー 微細構造工具及びレーザーアブレーションを用いてこれを作成する方法
JP2021511216A (ja) * 2018-01-26 2021-05-06 レーザー エンジニアリング アプリケーションズ レーザー加工パラメータを決定するための方法および該方法を使用するレーザー加工装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7128737B1 (en) * 1997-10-22 2006-10-31 Carl Zeiss Meditec Ag Object figuring device
JP3686317B2 (ja) 2000-08-10 2005-08-24 三菱重工業株式会社 レーザ加工ヘッド及びこれを備えたレーザ加工装置
DE102007017119A1 (de) * 2007-04-11 2008-10-16 Carl Zeiss Meditec Ag Vorrichtung und Verfahren zur Materialbearbeitung mittels Laserstrahlung
JP2012094591A (ja) * 2010-10-25 2012-05-17 Disco Abrasive Syst Ltd ビアホールの加工方法およびレーザー加工装置
KR101304424B1 (ko) 2013-05-31 2013-09-05 광주과학기술원 버스트 모드 레이저 발생 장치 및 방법
JP5935771B2 (ja) * 2013-07-30 2016-06-15 ブラザー工業株式会社 レーザ加工システム
JP6382554B2 (ja) * 2014-03-31 2018-08-29 パナソニック デバイスSunx株式会社 レーザ加工装置
US10258982B2 (en) 2014-04-23 2019-04-16 Japan Science And Technology Agency Combined-blade open flow path device and joined body thereof
JP6557629B2 (ja) * 2016-04-05 2019-08-07 株式会社タマリ工業 レーザ制御装置及びレーザ切断装置
DE102018125436A1 (de) * 2018-10-15 2020-04-16 Ewag Ag Verfahren zur materialabtragenden Laserbearbeitung eines Werkstücks
JP7299597B2 (ja) * 2018-12-27 2023-06-28 国立大学法人 東京大学 レーザ加工におけるレーザ光強度への依存性の判定方法及びレーザ加工装置
WO2021024480A1 (ja) 2019-08-08 2021-02-11 株式会社ニコン 加工装置
JP7435626B2 (ja) * 2019-12-26 2024-02-21 株式会社ニコン ビーム加工装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009532213A (ja) * 2006-03-31 2009-09-10 スリーエム イノベイティブ プロパティズ カンパニー 微細構造工具及びレーザーアブレーションを用いてこれを作成する方法
JP2021511216A (ja) * 2018-01-26 2021-05-06 レーザー エンジニアリング アプリケーションズ レーザー加工パラメータを決定するための方法および該方法を使用するレーザー加工装置

Also Published As

Publication number Publication date
EP4424454A1 (en) 2024-09-04
WO2023073833A1 (ja) 2023-05-04
US20240416449A1 (en) 2024-12-19
CN118284491A (zh) 2024-07-02
EP4424454A4 (en) 2025-09-03

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