CN118284491A - 数据生成方法、云端系统、加工装置、计算机程序及记录介质 - Google Patents

数据生成方法、云端系统、加工装置、计算机程序及记录介质 Download PDF

Info

Publication number
CN118284491A
CN118284491A CN202180103673.8A CN202180103673A CN118284491A CN 118284491 A CN118284491 A CN 118284491A CN 202180103673 A CN202180103673 A CN 202180103673A CN 118284491 A CN118284491 A CN 118284491A
Authority
CN
China
Prior art keywords
processing
energy beam
irradiation target
irradiation
target position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180103673.8A
Other languages
English (en)
Chinese (zh)
Inventor
江上茂树
北尚宪
立崎阳介
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of CN118284491A publication Critical patent/CN118284491A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
CN202180103673.8A 2021-10-27 2021-10-27 数据生成方法、云端系统、加工装置、计算机程序及记录介质 Pending CN118284491A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/039660 WO2023073833A1 (ja) 2021-10-27 2021-10-27 データ生成方法、クラウドシステム、加工装置、コンピュータプログラム及び記録媒体

Publications (1)

Publication Number Publication Date
CN118284491A true CN118284491A (zh) 2024-07-02

Family

ID=86159230

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180103673.8A Pending CN118284491A (zh) 2021-10-27 2021-10-27 数据生成方法、云端系统、加工装置、计算机程序及记录介质

Country Status (5)

Country Link
US (1) US20240416449A1 (https=)
EP (1) EP4424454A4 (https=)
JP (1) JPWO2023073833A1 (https=)
CN (1) CN118284491A (https=)
WO (1) WO2023073833A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7649694B2 (ja) * 2021-05-28 2025-03-21 株式会社ディスコ レーザー加工装置
WO2025094320A1 (ja) * 2023-11-01 2025-05-08 株式会社ニコン データ生成方法、コンピュータプログラム、記録媒体及び加工装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7128737B1 (en) * 1997-10-22 2006-10-31 Carl Zeiss Meditec Ag Object figuring device
JP3686317B2 (ja) 2000-08-10 2005-08-24 三菱重工業株式会社 レーザ加工ヘッド及びこれを備えたレーザ加工装置
US20070231541A1 (en) * 2006-03-31 2007-10-04 3M Innovative Properties Company Microstructured tool and method of making same using laser ablation
DE102007017119A1 (de) * 2007-04-11 2008-10-16 Carl Zeiss Meditec Ag Vorrichtung und Verfahren zur Materialbearbeitung mittels Laserstrahlung
JP2012094591A (ja) * 2010-10-25 2012-05-17 Disco Abrasive Syst Ltd ビアホールの加工方法およびレーザー加工装置
KR101304424B1 (ko) 2013-05-31 2013-09-05 광주과학기술원 버스트 모드 레이저 발생 장치 및 방법
JP5935771B2 (ja) * 2013-07-30 2016-06-15 ブラザー工業株式会社 レーザ加工システム
JP6382554B2 (ja) * 2014-03-31 2018-08-29 パナソニック デバイスＳｕｎｘ株式会社 レーザ加工装置
US10258982B2 (en) 2014-04-23 2019-04-16 Japan Science And Technology Agency Combined-blade open flow path device and joined body thereof
JP6557629B2 (ja) * 2016-04-05 2019-08-07 株式会社タマリ工業 レーザ制御装置及びレーザ切断装置
BE1025957B1 (fr) * 2018-01-26 2019-08-27 Laser Engineering Applications Méthode pour la détermination de paramètres d'usinage laser et dispositif d'usinage laser utilisant ladite méthode
DE102018125436A1 (de) * 2018-10-15 2020-04-16 Ewag Ag Verfahren zur materialabtragenden Laserbearbeitung eines Werkstücks
JP7299597B2 (ja) * 2018-12-27 2023-06-28 国立大学法人 東京大学 レーザ加工におけるレーザ光強度への依存性の判定方法及びレーザ加工装置
WO2021024480A1 (ja) 2019-08-08 2021-02-11 株式会社ニコン 加工装置
JP7435626B2 (ja) * 2019-12-26 2024-02-21 株式会社ニコン ビーム加工装置

Also Published As

Publication number Publication date
EP4424454A1 (en) 2024-09-04
WO2023073833A1 (ja) 2023-05-04
US20240416449A1 (en) 2024-12-19
JPWO2023073833A1 (https=) 2023-05-04
EP4424454A4 (en) 2025-09-03

Similar Documents

Publication Publication Date Title
JP7435626B2 (ja) ビーム加工装置
JP2026015389A (ja) 処理システム及びロボットシステム
CN118284491A (zh) 数据生成方法、云端系统、加工装置、计算机程序及记录介质
JP2026031671A (ja) 加工システム及び計測部材
WO2021171371A1 (ja) 加工システム
JP2025179168A (ja) 加工システム
EP4414119A1 (en) Processing system
WO2025094320A1 (ja) データ生成方法、コンピュータプログラム、記録媒体及び加工装置
EP4534232A1 (en) Processing system
JP7647765B2 (ja) 加工システム及び表示装置
US20250196261A1 (en) Processing apparatus
US20250339925A1 (en) Processing method and processing apparatus
WO2024166291A1 (ja) 情報処理方法、情報処理装置、加工装置及び加工方法
WO2025041188A1 (ja) 加工システム、計測装置及び加工方法
WO2025177461A1 (ja) 加工システム、制御装置、制御方法、コンピュータプログラム及び記録媒体

Legal Events

Date Code Title Description
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination