JPWO2023054055A1 - - Google Patents

Info

Publication number
JPWO2023054055A1
JPWO2023054055A1 JP2023551340A JP2023551340A JPWO2023054055A1 JP WO2023054055 A1 JPWO2023054055 A1 JP WO2023054055A1 JP 2023551340 A JP2023551340 A JP 2023551340A JP 2023551340 A JP2023551340 A JP 2023551340A JP WO2023054055 A1 JPWO2023054055 A1 JP WO2023054055A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023551340A
Other versions
JPWO2023054055A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023054055A1 publication Critical patent/JPWO2023054055A1/ja
Publication of JPWO2023054055A5 publication Critical patent/JPWO2023054055A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2023551340A 2021-09-30 2022-09-20 Pending JPWO2023054055A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202163250239P 2021-09-30 2021-09-30
PCT/JP2022/034953 WO2023054055A1 (ja) 2021-09-30 2022-09-20 基板の処理方法、薬液及び薬液の提供方法

Publications (2)

Publication Number Publication Date
JPWO2023054055A1 true JPWO2023054055A1 (ja) 2023-04-06
JPWO2023054055A5 JPWO2023054055A5 (ja) 2024-06-05

Family

ID=85782532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023551340A Pending JPWO2023054055A1 (ja) 2021-09-30 2022-09-20

Country Status (4)

Country Link
JP (1) JPWO2023054055A1 (ja)
KR (1) KR20240046604A (ja)
TW (1) TW202323512A (ja)
WO (1) WO2023054055A1 (ja)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000223467A (ja) * 1999-01-28 2000-08-11 Nippon Telegr & Teleph Corp <Ntt> 超臨界乾燥方法および装置
JP4042412B2 (ja) * 2002-01-11 2008-02-06 ソニー株式会社 洗浄及び乾燥方法
JP2003347261A (ja) * 2002-05-30 2003-12-05 Tokyo Electron Ltd 洗浄装置、および洗浄方法
JP2004327894A (ja) * 2003-04-28 2004-11-18 Nippon Telegr & Teleph Corp <Ntt> 超臨界乾燥方法及び超臨界乾燥装置
JP4008900B2 (ja) * 2004-07-22 2007-11-14 日本電信電話株式会社 超臨界処理方法
JP2007088257A (ja) * 2005-09-22 2007-04-05 Dainippon Screen Mfg Co Ltd 基板処理装置および基板乾燥方法
JP2008130685A (ja) * 2006-11-17 2008-06-05 Sony Corp 微細構造体の処理方法、処理装置、及びその微細構造体
JP6085423B2 (ja) * 2011-05-30 2017-02-22 株式会社東芝 基板処理方法、基板処理装置および記憶媒体
JP2013055230A (ja) * 2011-09-05 2013-03-21 Toshiba Corp 半導体基板の超臨界乾燥方法
JP6168128B2 (ja) 2015-11-11 2017-08-02 セントラル硝子株式会社 基板の処理方法及びその方法に用いる溶剤
JP2017195312A (ja) * 2016-04-21 2017-10-26 ダイキン工業株式会社 半導体基板の基板処理方法及び基板処理装置

Also Published As

Publication number Publication date
KR20240046604A (ko) 2024-04-09
WO2023054055A1 (ja) 2023-04-06
TW202323512A (zh) 2023-06-16

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Legal Events

Date Code Title Description
A521 Request for written amendment filed

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Effective date: 20240313

A621 Written request for application examination

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Effective date: 20240313