JPWO2023048121A1 - - Google Patents
Info
- Publication number
- JPWO2023048121A1 JPWO2023048121A1 JP2023549689A JP2023549689A JPWO2023048121A1 JP WO2023048121 A1 JPWO2023048121 A1 JP WO2023048121A1 JP 2023549689 A JP2023549689 A JP 2023549689A JP 2023549689 A JP2023549689 A JP 2023549689A JP WO2023048121 A1 JPWO2023048121 A1 JP WO2023048121A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
- C08K5/3445—Five-membered rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/025—Electric or magnetic properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
- C08K5/3445—Five-membered rings
- C08K5/3447—Five-membered rings condensed with carbocyclic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
- B32B2379/08—Polyimides
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021152911 | 2021-09-21 | ||
PCT/JP2022/034926 WO2023048121A1 (ja) | 2021-09-21 | 2022-09-20 | ポリイミド前駆体組成物およびポリイミドフィルム |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2023048121A1 true JPWO2023048121A1 (ja) | 2023-03-30 |
Family
ID=85719500
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023549689A Pending JPWO2023048121A1 (ja) | 2021-09-21 | 2022-09-20 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2023048121A1 (ja) |
KR (1) | KR20240070585A (ja) |
CN (1) | CN118176258A (ja) |
TW (1) | TW202319448A (ja) |
WO (1) | WO2023048121A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2024017216A (ja) * | 2022-07-27 | 2024-02-08 | 住友化学株式会社 | ポリイミド系フィルム |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101897617B1 (ko) | 2010-07-22 | 2018-09-12 | 우베 고산 가부시키가이샤 | 폴리이미드 전구체, 폴리이미드 및 그 제조에 사용되는 재료 |
US10781288B2 (en) | 2012-05-28 | 2020-09-22 | Ube Industries, Ltd. | Polyimide precursor and polyimide |
JP6283954B2 (ja) | 2012-09-10 | 2018-02-28 | 宇部興産株式会社 | ポリイミド前駆体、ポリイミド、ワニス、ポリイミドフィルム、及び基板 |
CN109535423B (zh) * | 2013-11-27 | 2021-06-01 | 宇部兴产株式会社 | 聚酰亚胺前体组合物、聚酰亚胺的制造方法、聚酰亚胺、聚酰亚胺膜和基板 |
US20170342215A1 (en) * | 2014-10-23 | 2017-11-30 | Ube Industries, Ltd. | Polyimide film, polyimide precursor, and polyimide |
WO2017030019A1 (ja) | 2015-08-14 | 2017-02-23 | Jxエネルギー株式会社 | テトラカルボン酸二無水物、カルボニル化合物、ポリアミド酸、ポリイミド及びそれらの製造方法、ポリアミド酸を用いた溶液、並びに、ポリイミドを用いたフィルム |
JP6916189B2 (ja) | 2016-09-13 | 2021-08-11 | Eneos株式会社 | ポリイミド、ポリアミド酸、それらの溶液及びポリイミドを用いたフィルム |
JP2018044180A (ja) | 2017-12-26 | 2018-03-22 | Jxtgエネルギー株式会社 | ポリイミド樹脂組成物及びポリイミドワニス |
JP7250459B2 (ja) | 2018-02-08 | 2023-04-03 | Eneos株式会社 | ポリイミド、ワニス及びポリイミドフィルム |
WO2019163703A1 (ja) | 2018-02-21 | 2019-08-29 | Jxtgエネルギー株式会社 | ポリイミド前駆体樹脂組成物 |
JP2022044020A (ja) * | 2020-09-04 | 2022-03-16 | 株式会社カネカ | ポリアミド酸、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびフレキシブルデバイス、ならびにポリイミド膜の製造方法 |
KR20230146067A (ko) * | 2021-02-19 | 2023-10-18 | 유비이 가부시키가이샤 | 폴리이미드 전구체 조성물 및 폴리이미드 필름 |
JPWO2022196664A1 (ja) * | 2021-03-17 | 2022-09-22 |
-
2022
- 2022-09-20 WO PCT/JP2022/034926 patent/WO2023048121A1/ja active Application Filing
- 2022-09-20 CN CN202280069075.8A patent/CN118176258A/zh active Pending
- 2022-09-20 KR KR1020247012693A patent/KR20240070585A/ko unknown
- 2022-09-20 JP JP2023549689A patent/JPWO2023048121A1/ja active Pending
- 2022-09-21 TW TW111135634A patent/TW202319448A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR20240070585A (ko) | 2024-05-21 |
TW202319448A (zh) | 2023-05-16 |
CN118176258A (zh) | 2024-06-11 |
WO2023048121A1 (ja) | 2023-03-30 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240319 |