JPWO2023042261A1 - - Google Patents

Info

Publication number
JPWO2023042261A1
JPWO2023042261A1 JP2023547968A JP2023547968A JPWO2023042261A1 JP WO2023042261 A1 JPWO2023042261 A1 JP WO2023042261A1 JP 2023547968 A JP2023547968 A JP 2023547968A JP 2023547968 A JP2023547968 A JP 2023547968A JP WO2023042261 A1 JPWO2023042261 A1 JP WO2023042261A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023547968A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023042261A1 publication Critical patent/JPWO2023042261A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Dicing (AREA)
  • Small-Scale Networks (AREA)
  • Interconnected Communication Systems, Intercoms, And Interphones (AREA)
  • Circuit For Audible Band Transducer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2023547968A 2021-09-14 2021-09-14 Pending JPWO2023042261A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/033739 WO2023042261A1 (fr) 2021-09-14 2021-09-14 Dispositif d'expansion et procédé d'expansion

Publications (1)

Publication Number Publication Date
JPWO2023042261A1 true JPWO2023042261A1 (fr) 2023-03-23

Family

ID=85601990

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023547968A Pending JPWO2023042261A1 (fr) 2021-09-14 2021-09-14

Country Status (5)

Country Link
JP (1) JPWO2023042261A1 (fr)
KR (1) KR20240021304A (fr)
CN (1) CN117716470A (fr)
TW (1) TWI824409B (fr)
WO (1) WO2023042261A1 (fr)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006054246A (ja) * 2004-08-10 2006-02-23 Disco Abrasive Syst Ltd ウエーハの分離方法
JP5791866B2 (ja) * 2009-03-06 2015-10-07 株式会社ディスコ ワーク分割装置
JP5554033B2 (ja) * 2009-08-26 2014-07-23 リンテック株式会社 光照射装置及び光照射方法
JP5013148B1 (ja) * 2011-02-16 2012-08-29 株式会社東京精密 ワーク分割装置及びワーク分割方法
JP6298635B2 (ja) * 2014-01-10 2018-03-20 株式会社ディスコ 分割装置及び被加工物の分割方法
JP2018050010A (ja) * 2016-09-23 2018-03-29 株式会社ディスコ 加工方法
KR20180050010A (ko) 2016-11-04 2018-05-14 정인호 비소성 방식의 기능성 내장타일 제조방법 및 이에 의하여 제조된 기능성 내장타일
JP2018206936A (ja) * 2017-06-02 2018-12-27 東京エレクトロン株式会社 基板処理システム、基板処理方法

Also Published As

Publication number Publication date
KR20240021304A (ko) 2024-02-16
WO2023042261A1 (fr) 2023-03-23
TW202312254A (zh) 2023-03-16
CN117716470A (zh) 2024-03-15
TWI824409B (zh) 2023-12-01

Similar Documents

Publication Publication Date Title
BR112023005462A2 (fr)
BR112023012656A2 (fr)
BR112021014123A2 (fr)
BR112022009896A2 (fr)
BR112023009656A2 (fr)
BR112022024743A2 (fr)
BR112023006729A2 (fr)
BR102021018859A2 (fr)
BR102021015500A2 (fr)
BR102021007058A2 (fr)
BR112023008622A2 (fr)
BR102020022030A2 (fr)
BR112023011738A2 (fr)
BR112023016292A2 (fr)
BR112023004146A2 (fr)
BR112023011539A2 (fr)
BR112023011610A2 (fr)
BR112023008976A2 (fr)
BR102021020147A2 (fr)
BR102021018926A2 (fr)
BR102021018167A2 (fr)
BR102021017576A2 (fr)
BR102021016837A2 (fr)
BR102021016551A2 (fr)
BR102021016375A2 (fr)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240202