JPWO2023032904A1 - - Google Patents

Info

Publication number
JPWO2023032904A1
JPWO2023032904A1 JP2023545553A JP2023545553A JPWO2023032904A1 JP WO2023032904 A1 JPWO2023032904 A1 JP WO2023032904A1 JP 2023545553 A JP2023545553 A JP 2023545553A JP 2023545553 A JP2023545553 A JP 2023545553A JP WO2023032904 A1 JPWO2023032904 A1 JP WO2023032904A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023545553A
Other versions
JPWO2023032904A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023032904A1 publication Critical patent/JPWO2023032904A1/ja
Publication of JPWO2023032904A5 publication Critical patent/JPWO2023032904A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0236—Fixing laser chips on mounts using an adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Semiconductor Lasers (AREA)
JP2023545553A 2021-08-30 2022-08-29 Pending JPWO2023032904A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021139993 2021-08-30
PCT/JP2022/032379 WO2023032904A1 (ja) 2021-08-30 2022-08-29 半導体レーザモジュールおよびレーザ加工装置

Publications (2)

Publication Number Publication Date
JPWO2023032904A1 true JPWO2023032904A1 (ja) 2023-03-09
JPWO2023032904A5 JPWO2023032904A5 (ja) 2023-12-06

Family

ID=85412744

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023545553A Pending JPWO2023032904A1 (ja) 2021-08-30 2022-08-29

Country Status (2)

Country Link
JP (1) JPWO2023032904A1 (ja)
WO (1) WO2023032904A1 (ja)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001308423A (ja) * 2000-04-26 2001-11-02 Mitsubishi Heavy Ind Ltd 冷却ブロック及びこれを備えたｌｄ装置並びにこれを励起光源とする固体レーザ装置
JP2006344636A (ja) * 2005-06-07 2006-12-21 Fuji Electric Holdings Co Ltd 並列ループ型熱分散プレート
JP2007214157A (ja) * 2006-02-07 2007-08-23 Meidensha Corp 水冷式冷却構造
JP6564418B2 (ja) * 2017-04-20 2019-08-21 ファナック株式会社 光パワーモニタ装置およびレーザ装置
JP7174899B2 (ja) * 2017-07-07 2022-11-18 パナソニックＩｐマネジメント株式会社 半導体レーザ装置
WO2019009172A1 (ja) * 2017-07-07 2019-01-10 パナソニックＩｐマネジメント株式会社 半導体レーザ装置
JP6765395B2 (ja) * 2018-06-14 2020-10-07 株式会社フジクラ 光モジュールユニット及びレーザ装置

Also Published As

Publication number Publication date
WO2023032904A1 (ja) 2023-03-09

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