JPWO2023032757A1 - - Google Patents

Info

Publication number
JPWO2023032757A1
JPWO2023032757A1 JP2023545477A JP2023545477A JPWO2023032757A1 JP WO2023032757 A1 JPWO2023032757 A1 JP WO2023032757A1 JP 2023545477 A JP2023545477 A JP 2023545477A JP 2023545477 A JP2023545477 A JP 2023545477A JP WO2023032757 A1 JPWO2023032757 A1 JP WO2023032757A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023545477A
Other languages
Japanese (ja)
Other versions
JP7679479B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023032757A1 publication Critical patent/JPWO2023032757A1/ja
Application granted granted Critical
Publication of JP7679479B2 publication Critical patent/JP7679479B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8502—Surface mount technology [SMT] type packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8508—Package substrates, e.g. submounts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
JP2023545477A 2021-08-31 2022-08-23 配線基板および電子装置 Active JP7679479B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021141686 2021-08-31
JP2021141686 2021-08-31
PCT/JP2022/031717 WO2023032757A1 (ja) 2021-08-31 2022-08-23 配線基板および電子装置

Publications (2)

Publication Number Publication Date
JPWO2023032757A1 true JPWO2023032757A1 (https=) 2023-03-09
JP7679479B2 JP7679479B2 (ja) 2025-05-19

Family

ID=85412253

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023545477A Active JP7679479B2 (ja) 2021-08-31 2022-08-23 配線基板および電子装置

Country Status (5)

Country Link
EP (1) EP4398291A1 (https=)
JP (1) JP7679479B2 (https=)
CN (1) CN117836926A (https=)
TW (1) TWI869699B (https=)
WO (1) WO2023032757A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63106143U (https=) * 1986-12-26 1988-07-08
JPH0595060U (ja) * 1992-05-29 1993-12-24 京セラ株式会社 Ｃｃｄ素子収納用パッケージ
JPH08130269A (ja) * 1994-11-02 1996-05-21 Fujitsu Ltd 光デバイスの製造方法
JP2000188356A (ja) * 1998-12-24 2000-07-04 Ngk Spark Plug Co Ltd 配線基板及びその製造方法
JP2007311445A (ja) * 2006-05-17 2007-11-29 Stanley Electric Co Ltd 半導体発光装置及びその製造方法
JP2016051711A (ja) * 2014-08-28 2016-04-11 京セラ株式会社 電子素子実装用基板及び電子装置
WO2020175619A1 (ja) * 2019-02-28 2020-09-03 京セラ株式会社 電子部品搭載用パッケージ、電子装置及び発光装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW456004B (en) * 1998-02-10 2001-09-21 Nissha Printing Substrate sheet for semiconductor module, method and apparatus for manufacturing the same
JP2006093565A (ja) * 2004-09-27 2006-04-06 Kyocera Corp 発光素子用配線基板ならびに発光装置およびその製造方法
US20080043444A1 (en) * 2004-04-27 2008-02-21 Kyocera Corporation Wiring Board for Light-Emitting Element
JP2006128511A (ja) * 2004-10-29 2006-05-18 Ngk Spark Plug Co Ltd 発光素子用セラミック基板
JP2007234846A (ja) * 2006-03-01 2007-09-13 Ngk Spark Plug Co Ltd 発光素子用セラミックパッケージ
JP4789671B2 (ja) * 2006-03-28 2011-10-12 京セラ株式会社 発光素子用配線基板ならびに発光装置
JP5393419B2 (ja) * 2009-11-27 2014-01-22 京セラ株式会社 発光素子搭載用基板および発光装置
TW201312807A (zh) * 2011-07-21 2013-03-16 克里股份有限公司 光發射器元件封裝與部件及改良化學抵抗性的方法與相關方法
US11582858B2 (en) * 2018-08-29 2023-02-14 Kyocera Corporation Wiring substrate, electronic device and electronic module

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63106143U (https=) * 1986-12-26 1988-07-08
JPH0595060U (ja) * 1992-05-29 1993-12-24 京セラ株式会社 Ｃｃｄ素子収納用パッケージ
JPH08130269A (ja) * 1994-11-02 1996-05-21 Fujitsu Ltd 光デバイスの製造方法
JP2000188356A (ja) * 1998-12-24 2000-07-04 Ngk Spark Plug Co Ltd 配線基板及びその製造方法
JP2007311445A (ja) * 2006-05-17 2007-11-29 Stanley Electric Co Ltd 半導体発光装置及びその製造方法
JP2016051711A (ja) * 2014-08-28 2016-04-11 京セラ株式会社 電子素子実装用基板及び電子装置
WO2020175619A1 (ja) * 2019-02-28 2020-09-03 京セラ株式会社 電子部品搭載用パッケージ、電子装置及び発光装置

Also Published As

Publication number Publication date
JP7679479B2 (ja) 2025-05-19
CN117836926A (zh) 2024-04-05
TW202316587A (zh) 2023-04-16
WO2023032757A1 (ja) 2023-03-09
EP4398291A1 (en) 2024-07-10
TWI869699B (zh) 2025-01-11

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