JPWO2023013732A1 - - Google Patents

Info

Publication number
JPWO2023013732A1
JPWO2023013732A1 JP2023540410A JP2023540410A JPWO2023013732A1 JP WO2023013732 A1 JPWO2023013732 A1 JP WO2023013732A1 JP 2023540410 A JP2023540410 A JP 2023540410A JP 2023540410 A JP2023540410 A JP 2023540410A JP WO2023013732 A1 JPWO2023013732 A1 JP WO2023013732A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023540410A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023013732A1 publication Critical patent/JPWO2023013732A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2023540410A 2021-08-06 2022-08-04 Pending JPWO2023013732A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021130201 2021-08-06
PCT/JP2022/029981 WO2023013732A1 (ja) 2021-08-06 2022-08-04 フラックス用樹脂組成物、はんだペースト及び実装構造体

Publications (1)

Publication Number Publication Date
JPWO2023013732A1 true JPWO2023013732A1 (zh) 2023-02-09

Family

ID=85156002

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023540410A Pending JPWO2023013732A1 (zh) 2021-08-06 2022-08-04

Country Status (3)

Country Link
JP (1) JPWO2023013732A1 (zh)
CN (1) CN117715726A (zh)
WO (1) WO2023013732A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117862745A (zh) * 2024-01-19 2024-04-12 江苏三沃电子科技有限公司 一种锡膏的防水制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5242521B2 (ja) * 2009-08-17 2013-07-24 株式会社タムラ製作所 はんだ接合剤組成物
JP5681432B2 (ja) * 2010-10-01 2015-03-11 ナミックス株式会社 エポキシ樹脂組成物及びそれを使用した半導体装置
KR101872556B1 (ko) * 2011-03-10 2018-06-28 스미또모 베이크라이트 가부시키가이샤 반도체 장치 및 반도체 장치의 제조 방법
JP5571730B2 (ja) * 2012-04-11 2014-08-13 パナソニック株式会社 熱硬化性樹脂組成物および半導体装置
JP2014210880A (ja) * 2013-04-19 2014-11-13 日東電工株式会社 熱硬化性樹脂組成物及び半導体装置の製造方法
US11495564B2 (en) * 2018-05-25 2022-11-08 Panasonic Intellectual Property Management Co., Ltd. Electronic-part-reinforcing thermosetting resin composition, semiconductor device, and method for fabricating the semiconductor device
JP2021178336A (ja) * 2020-05-12 2021-11-18 パナソニックＩｐマネジメント株式会社 樹脂フラックスはんだペーストおよび実装構造体

Also Published As

Publication number Publication date
WO2023013732A1 (ja) 2023-02-09
CN117715726A (zh) 2024-03-15

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