JPWO2023013727A1 - - Google Patents

Info

Publication number
JPWO2023013727A1
JPWO2023013727A1 JP2023540407A JP2023540407A JPWO2023013727A1 JP WO2023013727 A1 JPWO2023013727 A1 JP WO2023013727A1 JP 2023540407 A JP2023540407 A JP 2023540407A JP 2023540407 A JP2023540407 A JP 2023540407A JP WO2023013727 A1 JPWO2023013727 A1 JP WO2023013727A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023540407A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023013727A1 publication Critical patent/JPWO2023013727A1/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Surface Treatment Of Glass (AREA)
  • Laminated Bodies (AREA)
  • Surface Treatment Of Optical Elements (AREA)
  • Materials For Photolithography (AREA)
JP2023540407A 2021-08-06 2022-08-04 Pending JPWO2023013727A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021130269 2021-08-06
PCT/JP2022/029942 WO2023013727A1 (ja) 2021-08-06 2022-08-04 リブ付き基板及び光半導体装置

Publications (1)

Publication Number Publication Date
JPWO2023013727A1 true JPWO2023013727A1 (ja) 2023-02-09

Family

ID=85155986

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023540407A Pending JPWO2023013727A1 (ja) 2021-08-06 2022-08-04

Country Status (3)

Country Link
JP (1) JPWO2023013727A1 (ja)
TW (1) TW202312510A (ja)
WO (1) WO2023013727A1 (ja)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000048218A1 (fr) * 1999-02-12 2000-08-17 Toppan Printing Co., Ltd. Ecran a plasma, procede et dispositif de production correspondants
JP4151293B2 (ja) * 2001-03-28 2008-09-17 東レ株式会社 ディスプレイの隔壁形成用感光性ペースト
JP2015065210A (ja) * 2013-09-24 2015-04-09 凸版印刷株式会社 固体撮像素子アレイ基板の切断方法
JP6945289B2 (ja) * 2016-09-30 2021-10-06 株式会社カネカ アルカリ現像性を有する光硬化性組成物、およびパターン硬化膜の製造方法
JP2021092700A (ja) * 2019-12-11 2021-06-17 株式会社カネカ ポジ型感光性組成物、パターン硬化膜およびその製造方法

Also Published As

Publication number Publication date
TW202312510A (zh) 2023-03-16
WO2023013727A1 (ja) 2023-02-09

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