JPWO2023013576A1 - - Google Patents

Info

Publication number
JPWO2023013576A1
JPWO2023013576A1 JP2023540329A JP2023540329A JPWO2023013576A1 JP WO2023013576 A1 JPWO2023013576 A1 JP WO2023013576A1 JP 2023540329 A JP2023540329 A JP 2023540329A JP 2023540329 A JP2023540329 A JP 2023540329A JP WO2023013576 A1 JPWO2023013576 A1 JP WO2023013576A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023540329A
Other versions
JPWO2023013576A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023013576A1 publication Critical patent/JPWO2023013576A1/ja
Publication of JPWO2023013576A5 publication Critical patent/JPWO2023013576A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/22—Rubbers synthetic or natural
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
JP2023540329A 2021-08-04 2022-08-01 Pending JPWO2023013576A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021128004 2021-08-04
PCT/JP2022/029479 WO2023013576A1 (ja) 2021-08-04 2022-08-01 研磨パッド

Publications (2)

Publication Number Publication Date
JPWO2023013576A1 true JPWO2023013576A1 (ja) 2023-02-09
JPWO2023013576A5 JPWO2023013576A5 (ja) 2024-04-30

Family

ID=85154727

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023540329A Pending JPWO2023013576A1 (ja) 2021-08-04 2022-08-01

Country Status (7)

Country Link
EP (1) EP4382250A1 (ja)
JP (1) JPWO2023013576A1 (ja)
KR (1) KR20240034874A (ja)
CN (1) CN117794687A (ja)
IL (1) IL309873A (ja)
TW (1) TWI814517B (ja)
WO (1) WO2023013576A1 (ja)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000237950A (ja) 1999-02-18 2000-09-05 Nec Corp 半導体ウェハーの研磨パッド及び半導体装置の製造方法
TW548484B (en) 1999-07-16 2003-08-21 Seiko Epson Corp Liquid crystal display device, electronic apparatus and substrate for liquid crystal device
DE60110225T2 (de) * 2000-06-19 2006-03-09 Struers A/S Eine schleif- und/oder polierscheibe mit mehreren zonen
JP4563025B2 (ja) * 2003-12-19 2010-10-13 東洋ゴム工業株式会社 Ｃｍｐ用研磨パッド、及びそれを用いた研磨方法
KR101279819B1 (ko) * 2005-04-12 2013-06-28 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 방사-편향 연마 패드
JP5706178B2 (ja) 2010-02-05 2015-04-22 株式会社クラレ 研磨パッド
JPWO2013103142A1 (ja) * 2012-01-06 2015-05-11 東レ株式会社 研磨パッド
US9522454B2 (en) * 2012-12-17 2016-12-20 Seagate Technology Llc Method of patterning a lapping plate, and patterned lapping plates
TWM459065U (zh) 2013-04-29 2013-08-11 Iv Technologies Co Ltd 硏磨墊以及硏磨系統
US10875146B2 (en) * 2016-03-24 2020-12-29 Rohm And Haas Electronic Materials Cmp Holdings Debris-removal groove for CMP polishing pad
JP6989752B2 (ja) * 2017-03-30 2022-02-03 富士紡ホールディングス株式会社 研磨パッド
JP7166817B2 (ja) * 2018-07-12 2022-11-08 株式会社荏原製作所 基板搬送装置および基板搬送装置を備える基板処理装置

Also Published As

Publication number Publication date
TWI814517B (zh) 2023-09-01
KR20240034874A (ko) 2024-03-14
TW202319178A (zh) 2023-05-16
IL309873A (en) 2024-03-01
CN117794687A (zh) 2024-03-29
WO2023013576A1 (ja) 2023-02-09
EP4382250A1 (en) 2024-06-12

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Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240207

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240207