JPWO2023008138A1 - - Google Patents

Info

Publication number
JPWO2023008138A1
JPWO2023008138A1 JP2023538393A JP2023538393A JPWO2023008138A1 JP WO2023008138 A1 JPWO2023008138 A1 JP WO2023008138A1 JP 2023538393 A JP2023538393 A JP 2023538393A JP 2023538393 A JP2023538393 A JP 2023538393A JP WO2023008138 A1 JPWO2023008138 A1 JP WO2023008138A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023538393A
Other languages
Japanese (ja)
Other versions
JPWO2023008138A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023008138A1 publication Critical patent/JPWO2023008138A1/ja
Publication of JPWO2023008138A5 publication Critical patent/JPWO2023008138A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
    • H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2023538393A 2021-07-30 2022-07-08 Pending JPWO2023008138A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021125058 2021-07-30
PCT/JP2022/027066 WO2023008138A1 (ja) 2021-07-30 2022-07-08 水晶発振器及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2023008138A1 true JPWO2023008138A1 (https=) 2023-02-02
JPWO2023008138A5 JPWO2023008138A5 (https=) 2024-04-16

Family

ID=85086804

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023538393A Pending JPWO2023008138A1 (https=) 2021-07-30 2022-07-08

Country Status (2)

Country Link
JP (1) JPWO2023008138A1 (https=)
WO (1) WO2023008138A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007318286A (ja) * 2006-05-24 2007-12-06 Epson Toyocom Corp 圧電デバイス
JP2007325161A (ja) * 2006-06-05 2007-12-13 Epson Toyocom Corp 圧電デバイス
JP2015080039A (ja) * 2013-10-15 2015-04-23 日本電波工業株式会社 圧電デバイス
JP2015177335A (ja) * 2014-03-14 2015-10-05 日本電波工業株式会社 圧電デバイス用パッケージ及び圧電デバイス
JP2017130823A (ja) * 2016-01-21 2017-07-27 京セラ株式会社 圧電発振器及びその製造方法
JP2018074350A (ja) * 2016-10-28 2018-05-10 株式会社大真空 表面実装型圧電発振器とその回路基板への搭載構造
JP2020136999A (ja) * 2019-02-22 2020-08-31 京セラ株式会社 水晶素子、水晶デバイス及び電子機器

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012090203A (ja) * 2010-10-22 2012-05-10 Seiko Epson Corp 圧電発振器
JP2013207686A (ja) * 2012-03-29 2013-10-07 Nippon Dempa Kogyo Co Ltd 水晶発振器

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007318286A (ja) * 2006-05-24 2007-12-06 Epson Toyocom Corp 圧電デバイス
JP2007325161A (ja) * 2006-06-05 2007-12-13 Epson Toyocom Corp 圧電デバイス
JP2015080039A (ja) * 2013-10-15 2015-04-23 日本電波工業株式会社 圧電デバイス
JP2015177335A (ja) * 2014-03-14 2015-10-05 日本電波工業株式会社 圧電デバイス用パッケージ及び圧電デバイス
JP2017130823A (ja) * 2016-01-21 2017-07-27 京セラ株式会社 圧電発振器及びその製造方法
JP2018074350A (ja) * 2016-10-28 2018-05-10 株式会社大真空 表面実装型圧電発振器とその回路基板への搭載構造
JP2020136999A (ja) * 2019-02-22 2020-08-31 京セラ株式会社 水晶素子、水晶デバイス及び電子機器

Also Published As

Publication number Publication date
WO2023008138A1 (ja) 2023-02-02

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