EP2397508B1
(en )
2016-02-10
Silphenylene-containing photocurable composition, pattern formation method using same, and optical semiconductor element obtained using the method
JPWO2022065025A5
(cg-RX-API-DMAC7.html )
2023-06-20
WO2006115044A1
(ja )
2006-11-02
光架橋硬化のレジスト下層膜を形成するためのレジスト下層膜形成組成物
JPWO2023162565A5
(cg-RX-API-DMAC7.html )
2024-10-29
JP2004101706A5
(cg-RX-API-DMAC7.html )
2005-09-22
JP2004029136A5
(cg-RX-API-DMAC7.html )
2005-09-29
JPWO2022209733A5
(cg-RX-API-DMAC7.html )
2023-12-27
KR101852531B1
(ko )
2018-04-27
단환식 지방족 탄화수소환을 갖는 에폭시 수지 조성물
JPWO2023008127A5
(cg-RX-API-DMAC7.html )
2024-04-22
US11370888B2
(en )
2022-06-28
Silicon-rich silsesquioxane resins
JP2006276760A5
(cg-RX-API-DMAC7.html )
2008-05-01
KR102848811B1
(ko )
2025-08-22
레지스트 조성물 및 이를 사용한 반도체 소자 제조 방법
JPWO2022270230A5
(cg-RX-API-DMAC7.html )
2024-03-25
JP2008546027A5
(cg-RX-API-DMAC7.html )
2009-07-02
JP2009109541A5
(cg-RX-API-DMAC7.html )
2010-11-25
JPWO2022172597A5
(cg-RX-API-DMAC7.html )
2023-11-06
JPWO2023106171A5
(cg-RX-API-DMAC7.html )
2024-08-22
JPH0623840B2
(ja )
1994-03-30
高感度ポリアミドエステルホトレジスト組成物
JP2005043819A5
(cg-RX-API-DMAC7.html )
2006-07-06
JPH02261862A
(ja )
1990-10-24
光重合性樹脂組成物
KR20250041033A
(ko )
2025-03-25
감활성광선성 또는 감방사선성 수지 조성물, 감활성광선성 또는 감방사선성막, 패턴 형성 방법, 및 전자 디바이스의 제조 방법
TW201942160A
(zh )
2019-11-01
含有不飽和基的鹼可溶性樹脂、以其作為必須成分的感光性樹脂組成物及其硬化物
JPWO2023120035A5
(cg-RX-API-DMAC7.html )
2024-09-10
US20220146940A1
(en )
2022-05-12
Composition, silicon-containing film, method of forming silicon-containing film, and method of treating semiconductor substrate
JP3856237B1
(ja )
2006-12-13
シリコン含有感光性組成物、これを用いた薄膜パターンの製造方法、電子機器用保護膜