JPWO2023008124A1 - - Google Patents
Info
- Publication number
- JPWO2023008124A1 JPWO2023008124A1 JP2023538382A JP2023538382A JPWO2023008124A1 JP WO2023008124 A1 JPWO2023008124 A1 JP WO2023008124A1 JP 2023538382 A JP2023538382 A JP 2023538382A JP 2023538382 A JP2023538382 A JP 2023538382A JP WO2023008124 A1 JPWO2023008124 A1 JP WO2023008124A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
- G01R29/12—Measuring electrostatic fields or voltage-potential
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Coating Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021121648 | 2021-07-26 | ||
PCT/JP2022/026855 WO2023008124A1 (ja) | 2021-07-26 | 2022-07-06 | 基板処理装置、情報処理方法及び記憶媒体 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2023008124A1 true JPWO2023008124A1 (ja) | 2023-02-02 |
Family
ID=85086750
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023538382A Pending JPWO2023008124A1 (ja) | 2021-07-26 | 2022-07-06 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2023008124A1 (ja) |
KR (1) | KR20240040762A (ja) |
CN (1) | CN117678052A (ja) |
TW (1) | TW202309997A (ja) |
WO (1) | WO2023008124A1 (ja) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004179211A (ja) * | 2002-11-25 | 2004-06-24 | Nec Kansai Ltd | レジスト塗布装置のエッジリンス機構 |
JP5459279B2 (ja) * | 2011-09-02 | 2014-04-02 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
JP6332095B2 (ja) * | 2015-03-20 | 2018-05-30 | 東京エレクトロン株式会社 | 薬液供給装置の調整方法、記憶媒体及び薬液供給装置 |
JP6754247B2 (ja) * | 2016-08-25 | 2020-09-09 | 株式会社Screenホールディングス | 周縁部処理装置および周縁部処理方法 |
JP2019096669A (ja) | 2017-11-20 | 2019-06-20 | 東京エレクトロン株式会社 | 基板処理装置及び塗布モジュールのパラメータの調整方法並びに記憶媒体 |
WO2020250306A1 (ja) * | 2019-06-11 | 2020-12-17 | 株式会社安川電機 | 制御システム、監視装置、監視方法、及びプログラム |
-
2022
- 2022-07-06 WO PCT/JP2022/026855 patent/WO2023008124A1/ja active Application Filing
- 2022-07-06 KR KR1020247005394A patent/KR20240040762A/ko unknown
- 2022-07-06 CN CN202280050790.7A patent/CN117678052A/zh active Pending
- 2022-07-06 JP JP2023538382A patent/JPWO2023008124A1/ja active Pending
- 2022-07-14 TW TW111126489A patent/TW202309997A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR20240040762A (ko) | 2024-03-28 |
TW202309997A (zh) | 2023-03-01 |
CN117678052A (zh) | 2024-03-08 |
WO2023008124A1 (ja) | 2023-02-02 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240112 |