JPWO2023002919A1 - - Google Patents

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Publication number
JPWO2023002919A1
JPWO2023002919A1 JP2023536718A JP2023536718A JPWO2023002919A1 JP WO2023002919 A1 JPWO2023002919 A1 JP WO2023002919A1 JP 2023536718 A JP2023536718 A JP 2023536718A JP 2023536718 A JP2023536718 A JP 2023536718A JP WO2023002919 A1 JPWO2023002919 A1 JP WO2023002919A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023536718A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023002919A1 publication Critical patent/JPWO2023002919A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/18—Layered products comprising a layer of metal comprising iron or steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/027—Thermal properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/049—Protective back sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/308—Heat stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/22—Nickel or cobalt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/30—Iron, e.g. steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/10—Batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Laminated Bodies (AREA)
JP2023536718A 2021-07-20 2022-07-14 Pending JPWO2023002919A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021119890 2021-07-20
PCT/JP2022/027751 WO2023002919A1 (ja) 2021-07-20 2022-07-14 積層体

Publications (1)

Publication Number Publication Date
JPWO2023002919A1 true JPWO2023002919A1 (ja) 2023-01-26

Family

ID=84979252

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023536718A Pending JPWO2023002919A1 (ja) 2021-07-20 2022-07-14

Country Status (5)

Country Link
JP (1) JPWO2023002919A1 (ja)
KR (1) KR20240035399A (ja)
CN (1) CN117642285A (ja)
TW (1) TW202304706A (ja)
WO (1) WO2023002919A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023189719A1 (ja) * 2022-03-29 2023-10-05

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01174439A (ja) * 1987-12-28 1989-07-11 Mitsui Toatsu Chem Inc フレキシブル金属箔積層材
JP3814989B2 (ja) 1997-10-14 2006-08-30 東洋紡績株式会社 面状フレキシブルヒーター
JP2007098791A (ja) * 2005-10-05 2007-04-19 Shin Etsu Chem Co Ltd フレキシブル片面銅張ポリイミド積層板
JP2007101497A (ja) 2005-10-07 2007-04-19 Toyobo Co Ltd プローブカード
JP2007101496A (ja) 2005-10-07 2007-04-19 Toyobo Co Ltd プローブカード
JP2009117192A (ja) 2007-11-07 2009-05-28 Toyobo Co Ltd 絶縁型発熱体
JP5862238B2 (ja) * 2011-05-27 2016-02-16 東洋紡株式会社 積層体とその製造方法及びそれを用いたデバイス構造体の製造方法
KR101942967B1 (ko) * 2012-12-12 2019-01-28 삼성전자주식회사 실록산계 단량체를 이용한 접합 기판 구조체 및 그 제조방법
JP5764700B2 (ja) 2013-06-07 2015-08-19 古河電気工業株式会社 高周波基板用銅張り積層板及び表面処理銅箔
JP6234802B2 (ja) * 2013-12-18 2017-11-22 株式会社有沢製作所 積層体
JP2015178237A (ja) * 2014-03-19 2015-10-08 東洋紡株式会社 積層無機基板、積層体、積層体の製造方法、およびフレキシブル電子デバイスの製造方法
TWI709481B (zh) * 2014-08-25 2020-11-11 日商東洋紡股份有限公司 矽烷偶合劑層疊層高分子膜及其製造方法、疊層體及其製造方法、可撓性電子器件之製造方法
KR102232802B1 (ko) * 2015-12-10 2021-03-25 가부시키가이샤 데라오카 세이사쿠쇼 점착제 조성물 및 점착 테이프
JP6721041B2 (ja) 2016-04-28 2020-07-08 東洋紡株式会社 ポリイミドフィルム積層体
KR102418502B1 (ko) * 2016-09-05 2022-07-06 아라까와 가가꾸 고교 가부시끼가이샤 플렉서블 프린트 배선판용 동피복 적층판 및 플렉서블 프린트 배선판
JP6511614B2 (ja) * 2017-08-02 2019-05-15 株式会社新技術研究所 金属と樹脂の複合材
JP7013875B2 (ja) 2018-01-04 2022-02-01 東洋紡株式会社 積層体、積層体の製造方法、フレキシブル電子デバイスの製造方法
JP2020059169A (ja) 2018-10-05 2020-04-16 東洋紡株式会社 積層体、及び、積層体の製造方法
WO2020096410A1 (ko) * 2018-11-09 2020-05-14 에스케이씨코오롱피아이 주식회사 금속층과의 접착력이 향상된 폴리이미드 복합 필름 및 이를 제조하는 방법
JP2020136600A (ja) 2019-02-25 2020-08-31 東レ株式会社 半導体または電子部品製造用粘着フィルムならびに半導体または電子部品の製造方法
US11884055B2 (en) * 2019-03-26 2024-01-30 The Boeing Company Laminated hybrid metallized polymer films, system, and method for erosion protection of composite structures
US20220274314A1 (en) * 2019-10-02 2022-09-01 Toyobo Co., Ltd. Apparatus for manufacturing laminate and method for manufacturing laminate

Also Published As

Publication number Publication date
KR20240035399A (ko) 2024-03-15
CN117642285A (zh) 2024-03-01
WO2023002919A1 (ja) 2023-01-26
TW202304706A (zh) 2023-02-01

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