JPWO2022270460A5 - - Google Patents

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JPWO2022270460A5
JPWO2022270460A5 JP2022541690A JP2022541690A JPWO2022270460A5 JP WO2022270460 A5 JPWO2022270460 A5 JP WO2022270460A5 JP 2022541690 A JP2022541690 A JP 2022541690A JP 2022541690 A JP2022541690 A JP 2022541690A JP WO2022270460 A5 JPWO2022270460 A5 JP WO2022270460A5
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acrylic resin
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Priority claimed from PCT/JP2022/024519 external-priority patent/WO2022270460A1/en
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(メタ)アクリル樹脂、及び、有機溶剤を含有する(メタ)アクリル樹脂組成物であって、
下記(1)~(3)のいずれか1つを満たし、
前記有機溶剤中に含まれるOH基の重量濃度が9.0重量%以上28.0重量%以下である、(メタ)アクリル樹脂組成物。
(1)前記(メタ)アクリル樹脂は、重量平均分子量が12万以上30万以下の高分子量(メタ)アクリル樹脂(A)を含有し、
前記高分子量(メタ)アクリル樹脂(A)中に含まれるOH基の重量濃度が0.4重量%以上2.0重量%以下である。
(2)前記(メタ)アクリル樹脂は、重量平均分子量が30万を超え50万以下である高分子量(メタ)アクリル樹脂(B)を含有し、
前記高分子量(メタ)アクリル樹脂(B)中に含まれるOH基の重量濃度が1.3重量%以上3.5重量%以下である。
(3)前記(メタ)アクリル樹脂は、重量平均分子量が0.5万以上10万以下である低分子量(メタ)アクリル樹脂(C)を含有し、
前記低分子量(メタ)アクリル樹脂(C)中に含まれるOH基の重量濃度が1.3重量%以上3.5重量%以下であり、
前記(メタ)アクリル樹脂中に含まれるS原子の重量濃度が250ppm以上20000ppm以下である。
A (meth)acrylic resin composition containing a (meth)acrylic resin and an organic solvent,
Satisfies any one of the following (1) to (3),
A (meth)acrylic resin composition, wherein the weight concentration of OH groups contained in the organic solvent is 9.0% by weight or more and 28.0% by weight or less.
(1) The (meth)acrylic resin contains a high molecular weight (meth)acrylic resin (A) with a weight average molecular weight of 120,000 to 300,000,
The weight concentration of OH groups contained in the high molecular weight (meth)acrylic resin (A) is 0.4% by weight or more and 2.0% by weight or less.
(2) The (meth)acrylic resin contains a high molecular weight (meth)acrylic resin (B) having a weight average molecular weight of more than 300,000 and less than 500,000,
The weight concentration of OH groups contained in the high molecular weight (meth)acrylic resin (B) is 1.3% by weight or more and 3.5% by weight or less.
(3) The (meth)acrylic resin contains a low molecular weight (meth)acrylic resin (C) having a weight average molecular weight of 50,000 to 100,000,
The weight concentration of OH groups contained in the low molecular weight (meth)acrylic resin (C) is 1.3% by weight or more and 3.5% by weight or less,
The weight concentration of S atoms contained in the (meth)acrylic resin is 250 ppm or more and 20,000 ppm or less.
(1)を満たし、かつ、重量平均分子量が0.5万以上10万以下である低分子量(メタ)アクリル樹脂を含有し、前記低分子量(メタ)アクリル樹脂中に含まれるOH基の重量濃度が1.3重量%以上3.5重量%以下であり、高分子量(メタ)アクリル樹脂(A)100重量部に対する前記低分子量(メタ)アクリル樹脂の含有量が0.1重量部以上10重量部以下である、請求項1に記載の(メタ)アクリル樹脂組成物。 Contains a low molecular weight (meth)acrylic resin that satisfies (1) and has a weight average molecular weight of 5,000 to 100,000, and the weight concentration of OH groups contained in the low molecular weight (meth)acrylic resin. is 1.3% by weight or more and 3.5% by weight or less, and the content of the low molecular weight (meth)acrylic resin is 0.1 parts by weight or more and 10 parts by weight relative to 100 parts by weight of the high molecular weight (meth)acrylic resin (A). The (meth)acrylic resin composition according to claim 1, wherein the (meth)acrylic resin composition is less than or equal to (1)又は(2)を満たし、かつ、高分子量(メタ)アクリル樹脂(A)又は(B)のエタノールへの溶解度が10重量部/エタノール100重量部以上である、請求項1に記載の(メタ)アクリル樹脂組成物。 The method according to claim 1, which satisfies (1) or (2) and has a solubility of the high molecular weight (meth)acrylic resin (A) or (B) in ethanol of 10 parts by weight/100 parts by weight of ethanol or more. (meth)acrylic resin composition. (1)又は(2)を満たし、かつ、高分子量(メタ)アクリル樹脂(A)又は(B)は、全構成単位に対して、下記式(a)で表される構成単位を79重量%以上96重量%以下、下記式(b)で表される構成単位を3.1重量%以上17重量%以下含有する、請求項1又は3に記載の(メタ)アクリル樹脂組成物。
Figure 2022270460000001
式(a)中、Rは炭素数1~8の直鎖状又は分岐状アルキル基を表し、式(b)中、Rは、水素原子の少なくとも1つがOH基で置換された炭素数2~4の直鎖状又は分岐状アルキル基を表す。
The high molecular weight (meth)acrylic resin (A) or (B) that satisfies (1) or (2) contains 79% by weight of the structural unit represented by the following formula (a) based on the total structural units. The (meth)acrylic resin composition according to claim 1 or 3, which contains 96% by weight or less, and 3.1% by weight or more and 17% by weight or less of a structural unit represented by the following formula (b).
Figure 2022270460000001
In formula (a), R 1 represents a linear or branched alkyl group having 1 to 8 carbon atoms, and in formula (b), R 2 represents a carbon number in which at least one hydrogen atom is substituted with an OH group. Represents 2 to 4 linear or branched alkyl groups.
(1)又は(2)を満たし、かつ、高分子量(メタ)アクリル樹脂(A)又は(B)中に含まれるOH基の重量濃度に対する有機溶剤中に含まれるOH基の重量濃度の比(有機溶剤中に含まれるOH基の重量濃度/高分子量(メタ)アクリル樹脂(A)又は(B)中に含まれるOH基の重量濃度)が4.5以上46.2以下である、請求項1又は3に記載の(メタ)アクリル樹脂組成物。 The ratio of the weight concentration of OH groups contained in the organic solvent to the weight concentration of OH groups contained in the high molecular weight (meth)acrylic resin (A) or (B) that satisfies (1) or (2) ( A claim in which the weight concentration of OH groups contained in the organic solvent/weight concentration of OH groups contained in the high molecular weight (meth)acrylic resin (A) or (B)) is 4.5 or more and 46.2 or less. 3. The (meth)acrylic resin composition according to 1 or 3 . (2)を満たし、かつ、(メタ)アクリル樹脂は、高分子量(メタ)アクリル樹脂(B)のみからなるものであり、
前記(メタ)アクリル樹脂中に含まれるS原子の重量濃度が250ppm以上20000ppm以下である、請求項1又は3に記載の(メタ)アクリル樹脂組成物。
(2) is satisfied, and the (meth)acrylic resin consists only of high molecular weight (meth)acrylic resin (B),
The (meth)acrylic resin composition according to claim 1 or 3 , wherein the weight concentration of S atoms contained in the (meth)acrylic resin is 250 ppm or more and 20,000 ppm or less.
請求項1~の何れかに記載の(メタ)アクリル樹脂組成物、無機微粒子、及び、可塑剤を含有する、無機微粒子分散スラリー組成物。 An inorganic fine particle dispersed slurry composition containing the (meth)acrylic resin composition according to any one of claims 1 to 3 , inorganic fine particles, and a plasticizer. 請求項7に記載の無機微粒子分散スラリー組成物を用いてなる、無機微粒子分散成形物。 An inorganic fine particle-dispersed molded article using the inorganic fine particle-dispersed slurry composition according to claim 7.
JP2022541690A 2021-06-21 2022-06-20 Pending JPWO2022270460A1 (en)

Applications Claiming Priority (2)

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JP2021102531 2021-06-21
PCT/JP2022/024519 WO2022270460A1 (en) 2021-06-21 2022-06-20 (meth)acrylic resin composition, inorganic fine particle-dispersed slurry composition, and inorganic fine particle-dispersed molded product

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JPWO2022270460A1 JPWO2022270460A1 (en) 2022-12-29
JPWO2022270460A5 true JPWO2022270460A5 (en) 2024-03-21

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