JPWO2022270460A5 - - Google Patents
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- JPWO2022270460A5 JPWO2022270460A5 JP2022541690A JP2022541690A JPWO2022270460A5 JP WO2022270460 A5 JPWO2022270460 A5 JP WO2022270460A5 JP 2022541690 A JP2022541690 A JP 2022541690A JP 2022541690 A JP2022541690 A JP 2022541690A JP WO2022270460 A5 JPWO2022270460 A5 JP WO2022270460A5
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- JP
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- Prior art keywords
- weight
- meth
- acrylic resin
- molecular weight
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004925 Acrylic resin Substances 0.000 claims 31
- 229920000178 Acrylic resin Polymers 0.000 claims 31
- 239000000203 mixture Substances 0.000 claims 11
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 4
- 239000003960 organic solvent Substances 0.000 claims 4
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 239000010419 fine particle Substances 0.000 claims 2
- 239000002002 slurry Substances 0.000 claims 2
- 125000004434 sulfur atom Chemical group 0.000 claims 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- 239000004014 plasticizer Substances 0.000 claims 1
Claims (8)
下記(1)~(3)のいずれか1つを満たし、
前記有機溶剤中に含まれるOH基の重量濃度が9.0重量%以上28.0重量%以下である、(メタ)アクリル樹脂組成物。
(1)前記(メタ)アクリル樹脂は、重量平均分子量が12万以上30万以下の高分子量(メタ)アクリル樹脂(A)を含有し、
前記高分子量(メタ)アクリル樹脂(A)中に含まれるOH基の重量濃度が0.4重量%以上2.0重量%以下である。
(2)前記(メタ)アクリル樹脂は、重量平均分子量が30万を超え50万以下である高分子量(メタ)アクリル樹脂(B)を含有し、
前記高分子量(メタ)アクリル樹脂(B)中に含まれるOH基の重量濃度が1.3重量%以上3.5重量%以下である。
(3)前記(メタ)アクリル樹脂は、重量平均分子量が0.5万以上10万以下である低分子量(メタ)アクリル樹脂(C)を含有し、
前記低分子量(メタ)アクリル樹脂(C)中に含まれるOH基の重量濃度が1.3重量%以上3.5重量%以下であり、
前記(メタ)アクリル樹脂中に含まれるS原子の重量濃度が250ppm以上20000ppm以下である。 A (meth)acrylic resin composition containing a (meth)acrylic resin and an organic solvent,
Satisfies any one of the following (1) to (3),
A (meth)acrylic resin composition, wherein the weight concentration of OH groups contained in the organic solvent is 9.0% by weight or more and 28.0% by weight or less.
(1) The (meth)acrylic resin contains a high molecular weight (meth)acrylic resin (A) with a weight average molecular weight of 120,000 to 300,000,
The weight concentration of OH groups contained in the high molecular weight (meth)acrylic resin (A) is 0.4% by weight or more and 2.0% by weight or less.
(2) The (meth)acrylic resin contains a high molecular weight (meth)acrylic resin (B) having a weight average molecular weight of more than 300,000 and less than 500,000,
The weight concentration of OH groups contained in the high molecular weight (meth)acrylic resin (B) is 1.3% by weight or more and 3.5% by weight or less.
(3) The (meth)acrylic resin contains a low molecular weight (meth)acrylic resin (C) having a weight average molecular weight of 50,000 to 100,000,
The weight concentration of OH groups contained in the low molecular weight (meth)acrylic resin (C) is 1.3% by weight or more and 3.5% by weight or less,
The weight concentration of S atoms contained in the (meth)acrylic resin is 250 ppm or more and 20,000 ppm or less.
前記(メタ)アクリル樹脂中に含まれるS原子の重量濃度が250ppm以上20000ppm以下である、請求項1又は3に記載の(メタ)アクリル樹脂組成物。 (2) is satisfied, and the (meth)acrylic resin consists only of high molecular weight (meth)acrylic resin (B),
The (meth)acrylic resin composition according to claim 1 or 3 , wherein the weight concentration of S atoms contained in the (meth)acrylic resin is 250 ppm or more and 20,000 ppm or less.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021102531 | 2021-06-21 | ||
PCT/JP2022/024519 WO2022270460A1 (en) | 2021-06-21 | 2022-06-20 | (meth)acrylic resin composition, inorganic fine particle-dispersed slurry composition, and inorganic fine particle-dispersed molded product |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2022270460A1 JPWO2022270460A1 (en) | 2022-12-29 |
JPWO2022270460A5 true JPWO2022270460A5 (en) | 2024-03-21 |
Family
ID=84545689
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022541690A Pending JPWO2022270460A1 (en) | 2021-06-21 | 2022-06-20 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2022270460A1 (en) |
KR (1) | KR20240022439A (en) |
CN (1) | CN116829643A (en) |
TW (1) | TW202311318A (en) |
WO (1) | WO2022270460A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024048303A1 (en) * | 2022-08-30 | 2024-03-07 | 積水化学工業株式会社 | (meth)acrylic resin particles, vehicle composition, slurry composition, and method for manufacturing electronic components |
WO2024154467A1 (en) * | 2023-01-20 | 2024-07-25 | 積水化学工業株式会社 | (meth)acrylic resin particles, vehicle composition, slurry composition, and method for manufacturing electronic component |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE421531B (en) * | 1977-02-01 | 1982-01-04 | Bush Boake Allen Ltd | POLYMER COMPOSITION CONTAINING A REGULATED DELIVERY ACTIVE, FLATFUL COMPONENT, PROCEDURE FOR PREPARING THE COMPOSITION AND USING THEREOF |
JP2001002884A (en) * | 1999-06-16 | 2001-01-09 | Chisso Corp | Resin composition and manufacture of coated film |
JP2001011278A (en) * | 1999-06-29 | 2001-01-16 | Toagosei Co Ltd | Polymer composition, and curable composition and coating composition both prepared therefrom |
JP2001245913A (en) * | 1999-12-28 | 2001-09-11 | Lion Corp | Nonaqueous thermo-gel composition |
JP3485056B2 (en) * | 2000-01-20 | 2004-01-13 | 日本油脂株式会社 | Fiber treatment agent, treatment liquid, treatment method and treated fiber |
DE102004041536A1 (en) * | 2004-08-27 | 2006-03-02 | Merck Patent Gmbh | Use of random copolymers |
JP5067369B2 (en) * | 2006-07-31 | 2012-11-07 | コニカミノルタアドバンストレイヤー株式会社 | Polarizing plate protective film, polarizing plate and liquid crystal display device |
JP5230172B2 (en) * | 2007-04-20 | 2013-07-10 | 株式会社トクヤマデンタル | Curable composition |
JP2011084433A (en) | 2009-10-15 | 2011-04-28 | Tdk Corp | Methods for producing ceramic slurry, green sheet and electronic component |
JP5949080B2 (en) * | 2011-04-22 | 2016-07-06 | 三菱化学株式会社 | Rinse off conditioner |
JP5891838B2 (en) * | 2012-02-21 | 2016-03-23 | 東洋インキScホールディングス株式会社 | Curable resin composition |
JP2014125603A (en) * | 2012-12-27 | 2014-07-07 | Nippon Synthetic Chem Ind Co Ltd:The | Acrylic resin composition, acrylic adhesive, adhesive for electronic device, electronic device using the same, and method of producing acrylic resin composition |
JP6481565B2 (en) * | 2014-08-25 | 2019-03-13 | 荒川化学工業株式会社 | Hard coating agent for decorative film, cured film, plastic film, and molded product |
CN105754523A (en) * | 2016-03-10 | 2016-07-13 | 常州浩阳水性新材料有限公司 | Water-based diffusion film glue and preparation method thereof |
KR20190022459A (en) * | 2016-06-27 | 2019-03-06 | 에이지씨 가부시키가이샤 | Resin composition, coating liquid, mold with mold release and manufacturing method thereof |
CN106750385A (en) * | 2016-11-30 | 2017-05-31 | 江苏经纬技术创新咨询有限公司 | A kind of preparation method of redispersable latex powder |
WO2018230564A1 (en) * | 2017-06-16 | 2018-12-20 | 株式会社Adeka | Coating composition |
JP7055338B2 (en) * | 2017-12-14 | 2022-04-18 | 竹本油脂株式会社 | Additives for hydraulic compositions, and hydraulic compositions |
JP7363797B2 (en) * | 2018-10-03 | 2023-10-18 | Agc株式会社 | Method for producing dispersion liquid and resin-coated metal foil |
JP2020109761A (en) | 2020-02-26 | 2020-07-16 | 株式会社ノリタケカンパニーリミテド | Conductive paste and method for forming conductor film |
-
2022
- 2022-06-20 CN CN202280012445.4A patent/CN116829643A/en active Pending
- 2022-06-20 JP JP2022541690A patent/JPWO2022270460A1/ja active Pending
- 2022-06-20 WO PCT/JP2022/024519 patent/WO2022270460A1/en active Application Filing
- 2022-06-20 KR KR1020237024966A patent/KR20240022439A/en unknown
- 2022-06-21 TW TW111123019A patent/TW202311318A/en unknown
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