JP2012185291A5 - - Google Patents
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- JP2012185291A5 JP2012185291A5 JP2011047818A JP2011047818A JP2012185291A5 JP 2012185291 A5 JP2012185291 A5 JP 2012185291A5 JP 2011047818 A JP2011047818 A JP 2011047818A JP 2011047818 A JP2011047818 A JP 2011047818A JP 2012185291 A5 JP2012185291 A5 JP 2012185291A5
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Description
第2の発明の感光性樹脂組成物は、第1の発明において、前記成分(A)は、構成単位(a1)、構成単位(a2)および構成単位(a3)に加えて下記式(5)で表される(メタ)アクリル酸エステル単量体から誘導される構成単位(a4)を、構成単位(a1)と構成単位(a2)の合計量100質量部に対して1〜145質量部有する共重合体であることを特徴とする。
In the photosensitive resin composition of the second invention, in the first invention, the component (A) is represented by the following formula (5) in addition to the structural unit (a1), the structural unit (a2) and the structural unit (a3). 1 to 145 parts by mass of the structural unit (a4) derived from the (meth) acrylate monomer represented by the formula (1) with respect to 100 parts by mass of the total amount of the structural unit (a1) and the structural unit (a2). It is a copolymer.
さらに、成分(A)の共重合体は、構成単位(a1)、構成単位(a2)および構成単位(a3)に加えて、下記式(5)で表される(メタ)アクリル酸エステル単量体から誘導される構成単位(a4)を、構成単位(a1)と構成単位(a2)の合計量100質量部に対して1〜145質量部含有することができる。 Furthermore, the copolymer of component (A) is a (meth) acrylic acid ester monomer represented by the following formula (5) in addition to the structural unit (a1), the structural unit (a2) and the structural unit (a3). a structural unit derived from the body (a4), can be from 1 to 145 parts by weight content with respect to the total amount 100 parts by mass of the structural unit (a1) and the structural unit (a2).
この構成単位(a4)は、構成単位(a1)と構成単位(a2)の合計量100質量部に対して好ましくは1〜145質量部含まれる。構成単位(a4)の含有量が1質量部を下回ると、構成単位(a4)に基づく機能発現が不十分となる。その一方、145質量部を上回ると、他成分との相溶性が悪化し、白濁や透明性の低下を招く。 This structural unit (a4) is preferably contained in an amount of 1 to 145 parts by mass with respect to 100 parts by mass as the total of the structural unit (a1) and the structural unit (a2). When content of a structural unit (a4) is less than 1 mass part, the function expression based on a structural unit (a4) will become inadequate. On the other hand, when it exceeds 145 mass parts, compatibility with another component will deteriorate and it will cause white turbidity and transparency fall.
Claims (4)
前記成分(A)は下記式(1)で表されるイタコン酸ジエステル単量体から誘導される構成単位(a1)、下記式(2)で表される芳香族ビニル単量体から誘導される構成単位(a2)および下記式(3)で表されるα,β−不飽和カルボン酸単量体から誘導される構成単位(a3)を有する共重合体であり、構成単位(a1)と構成単位(a2)の合計量に対して構成単位(a1)が15〜95質量%、構成単位(a2)が5〜85質量%であると共に、構成単位(a1)と構成単位(a2)の合計量100質量部に対して構成単位(a3)が5〜150質量部であることを特徴とする感光性樹脂組成物。
成分(B):多官能フェノール性化合物とキノンジアジド化合物とをエステル化反応させて得られる、キノンジアジド基を有するエステル化物。
成分(C):2個以上のエポキシ基を有する化合物。
成分(D):下記式(4)で表されるフェノール化合物。
The component (A) is derived from a structural unit (a1) derived from an itaconic acid diester monomer represented by the following formula (1) and an aromatic vinyl monomer represented by the following formula (2). A copolymer having a structural unit (a2) and a structural unit (a3) derived from an α, β-unsaturated carboxylic acid monomer represented by the following formula (3), the structural unit (a1) and the structural unit The structural unit (a1) is 15 to 95% by mass and the structural unit (a2) is 5 to 85% by mass with respect to the total amount of the unit (a2), and the total of the structural unit (a1) and the structural unit (a2). The structural unit (a3) is 5 to 150 parts by mass with respect to 100 parts by mass of the photosensitive resin composition.
Component (B): An esterified product having a quinonediazide group, obtained by esterifying a polyfunctional phenolic compound and a quinonediazide compound.
Component (C): a compound having two or more epoxy groups.
Component (D): A phenol compound represented by the following formula (4).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011047818A JP5691657B2 (en) | 2011-03-04 | 2011-03-04 | Photosensitive resin composition and use thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011047818A JP5691657B2 (en) | 2011-03-04 | 2011-03-04 | Photosensitive resin composition and use thereof |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012185291A JP2012185291A (en) | 2012-09-27 |
JP2012185291A5 true JP2012185291A5 (en) | 2014-03-06 |
JP5691657B2 JP5691657B2 (en) | 2015-04-01 |
Family
ID=47015439
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011047818A Active JP5691657B2 (en) | 2011-03-04 | 2011-03-04 | Photosensitive resin composition and use thereof |
Country Status (1)
Country | Link |
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JP (1) | JP5691657B2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013130816A (en) * | 2011-12-22 | 2013-07-04 | Nippon Zeon Co Ltd | Resin composition for permanent film and electronic component |
JP6143369B2 (en) * | 2014-09-29 | 2017-06-07 | 富士フイルム株式会社 | Resin composition, film, polarizing plate protective film, polarizing plate and liquid crystal display device, bis-type alicyclic cardophenol compound |
KR101669341B1 (en) * | 2014-12-10 | 2016-10-26 | 삼성에스디아이 주식회사 | Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated by using the same |
JP6607109B2 (en) * | 2016-03-22 | 2019-11-20 | Jsr株式会社 | Cured film, display element, cured film forming material, and cured film forming method |
CN115698854A (en) * | 2020-08-17 | 2023-02-03 | 东丽株式会社 | Photosensitive resin composition, cured product, display device, semiconductor device, and method for producing cured product |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003345016A (en) * | 2002-05-23 | 2003-12-03 | Fuji Photo Film Co Ltd | Resin composition |
WO2005008337A1 (en) * | 2003-07-16 | 2005-01-27 | Az Electronic Materials (Japan) K.K. | Photosensitive resin composition |
JP4753237B2 (en) * | 2005-07-25 | 2011-08-24 | Azエレクトロニックマテリアルズ株式会社 | Photosensitive resin composition |
JP5417323B2 (en) * | 2008-05-09 | 2014-02-12 | 旭化成イーマテリアルズ株式会社 | Photosensitive polyimide precursor composition, photosensitive dry film, and flexible printed wiring board |
JP5338352B2 (en) * | 2009-02-09 | 2013-11-13 | 日油株式会社 | Positive photosensitive resin composition |
JP5526693B2 (en) * | 2009-10-09 | 2014-06-18 | 日油株式会社 | Photosensitive resin composition and use thereof |
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2011
- 2011-03-04 JP JP2011047818A patent/JP5691657B2/en active Active
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