JP2012185291A5 - - Google Patents

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JP2012185291A5
JP2012185291A5 JP2011047818A JP2011047818A JP2012185291A5 JP 2012185291 A5 JP2012185291 A5 JP 2012185291A5 JP 2011047818 A JP2011047818 A JP 2011047818A JP 2011047818 A JP2011047818 A JP 2011047818A JP 2012185291 A5 JP2012185291 A5 JP 2012185291A5
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structural unit
component
carbon atoms
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JP5691657B2 (en
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(式中、Rは炭素数1〜4のアルキル基を表す。R、R、Rは、それぞれ独立して水素原子または炭素数1〜4のアルキル基を表す。l、m、n、o、はそれぞれ、1〜2の整数を表す。R10およびR11は、それぞれ独立して炭素数1〜2のアルキル基を表す。)
第2の発明の感光性樹脂組成物は、第1の発明において、前記成分(A)は、構成単位(a1)、構成単位(a2)および構成単位(a3)に加えて下記式(5)で表される(メタ)アクリル酸エステル単量体から誘導される構成単位(a4)を、構成単位(a1)と構成単位(a2)の合計量100質量部に対して1〜145質量部有する共重合体であることを特徴とする。
(In the formula, R 6 represents an alkyl group having 1 to 4 carbon atoms. R 7 , R 8 and R 9 each independently represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. n and o each represents an integer of 1 to 2. R 10 and R 11 each independently represents an alkyl group having 1 to 2 carbon atoms.)
In the photosensitive resin composition of the second invention, in the first invention, the component (A) is represented by the following formula (5) in addition to the structural unit (a1), the structural unit (a2) and the structural unit (a3). 1 to 145 parts by mass of the structural unit (a4) derived from the (meth) acrylate monomer represented by the formula (1) with respect to 100 parts by mass of the total amount of the structural unit (a1) and the structural unit (a2). It is a copolymer.

さらに、成分(A)の共重合体は、構成単位(a1)、構成単位(a2)および構成単位(a3)に加えて、下記式(5)で表される(メタ)アクリル酸エステル単量体から誘導される構成単位(a4)を、構成単位(a1)と構成単位(a2)の合計量100質量部に対して1〜145質量部含有することができる。 Furthermore, the copolymer of component (A) is a (meth) acrylic acid ester monomer represented by the following formula (5) in addition to the structural unit (a1), the structural unit (a2) and the structural unit (a3). a structural unit derived from the body (a4), can be from 1 to 145 parts by weight content with respect to the total amount 100 parts by mass of the structural unit (a1) and the structural unit (a2).

この構成単位(a4)は、構成単位(a1)と構成単位(a2)の合計量100質量部に対して好ましくは1〜145質量部含まれる。構成単位(a4)の含有量が1質量部を下回ると、構成単位(a4)に基づく機能発現が不十分となる。その一方、145質量部を上回ると、他成分との相溶性が悪化し、白濁や透明性の低下を招く。 This structural unit (a4) is preferably contained in an amount of 1 to 145 parts by mass with respect to 100 parts by mass as the total of the structural unit (a1) and the structural unit (a2). When content of a structural unit (a4) is less than 1 mass part, the function expression based on a structural unit (a4) will become inadequate. On the other hand, when it exceeds 145 mass parts, compatibility with another component will deteriorate and it will cause white turbidity and transparency fall.

Claims (4)

下記に示す成分(A)、成分(B)、成分(C)および成分(D)を含有し、各成分の構成割合が成分(A)100質量部に対して成分(B)5〜50質量部、成分(C)10〜70質量部および成分(D)1〜40質量部である感光性樹脂組成物であって、
前記成分(A)は下記式(1)で表されるイタコン酸ジエステル単量体から誘導される構成単位(a1)、下記式(2)で表される芳香族ビニル単量体から誘導される構成単位(a2)および下記式(3)で表されるα,β−不飽和カルボン酸単量体から誘導される構成単位(a3)を有する共重合体であり、構成単位(a1)と構成単位(a2)の合計量に対して構成単位(a1)が15〜95質量%、構成単位(a2)が5〜85質量%であると共に、構成単位(a1)と構成単位(a2)の合計量100質量部に対して構成単位(a3)が5〜150質量部であることを特徴とする感光性樹脂組成物。
(式中、RおよびRは、それぞれ独立して炭素数1〜8の直鎖アルキル基、炭素数3〜8の分岐アルキル基、炭素数4〜12のシクロアルキル基)
(式中、RおよびRは、それぞれ独立して水素原子またはメチル基)
(式中のRは水素原子またはメチル基)
成分(B):多官能フェノール性化合物とキノンジアジド化合物とをエステル化反応させて得られる、キノンジアジド基を有するエステル化物。
成分(C):2個以上のエポキシ基を有する化合物。
成分(D):下記式(4)で表されるフェノール化合物。
(式中、Rは炭素数1〜4のアルキル基を表す。R、R、Rは、それぞれ独立して水素原子または炭素数1〜4のアルキル基を表す。l、m、n、o、はそれぞれ、1〜2の整数を表す。R10およびR11は、それぞれ独立して炭素数1〜2のアルキル基を表す。)
The component (A), the component (B), the component (C), and the component (D) shown below are contained, and the component ratio of each component is 5 to 50 masses of the component (B) with respect to 100 mass parts of the component (A). Part, component (C) 10-70 parts by mass and component (D) 1-40 parts by mass of a photosensitive resin composition,
The component (A) is derived from a structural unit (a1) derived from an itaconic acid diester monomer represented by the following formula (1) and an aromatic vinyl monomer represented by the following formula (2). A copolymer having a structural unit (a2) and a structural unit (a3) derived from an α, β-unsaturated carboxylic acid monomer represented by the following formula (3), the structural unit (a1) and the structural unit The structural unit (a1) is 15 to 95% by mass and the structural unit (a2) is 5 to 85% by mass with respect to the total amount of the unit (a2), and the total of the structural unit (a1) and the structural unit (a2). The structural unit (a3) is 5 to 150 parts by mass with respect to 100 parts by mass of the photosensitive resin composition.
(Wherein R 1 and R 2 are each independently a linear alkyl group having 1 to 8 carbon atoms, a branched alkyl group having 3 to 8 carbon atoms, or a cycloalkyl group having 4 to 12 carbon atoms).
(Wherein R 3 and R 4 are each independently a hydrogen atom or a methyl group)
(Wherein R 5 is a hydrogen atom or a methyl group)
Component (B): An esterified product having a quinonediazide group, obtained by esterifying a polyfunctional phenolic compound and a quinonediazide compound.
Component (C): a compound having two or more epoxy groups.
Component (D): A phenol compound represented by the following formula (4).
(In the formula, R 6 represents an alkyl group having 1 to 4 carbon atoms. R 7 , R 8 and R 9 each independently represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. n and o each represents an integer of 1 to 2. R 10 and R 11 each independently represents an alkyl group having 1 to 2 carbon atoms.)
前記成分(A)は、構成単位(a1)、構成単位(a2)および構成単位(a3)に加えて下記式(5)で表される(メタ)アクリル酸エステル単量体から誘導される構成単位(a4)を、構成単位(a1)と構成単位(a2)の合計量100質量部に対して1〜145質量部有する共重合体であることを特徴とする請求項1に記載の感光性樹脂組成物。
(式中のR12は水素原子またはメチル基、R13は炭素数1〜12の直鎖アルキル基、炭素数3〜12の分岐アルキル基、炭素数6〜12のアリール基、ベンジル基、炭素数1〜12のヒドロキシアルキル基または主環構成炭素数3〜12の脂環式炭化水素基)
The component (A) is derived from a (meth) acrylate monomer represented by the following formula (5) in addition to the structural unit (a1), the structural unit (a2) and the structural unit (a3). The photosensitivity according to claim 1, wherein the unit (a4) is a copolymer having 1 to 145 parts by mass with respect to 100 parts by mass of the total amount of the structural unit (a1) and the structural unit (a2). Resin composition.
(Wherein R 12 is a hydrogen atom or a methyl group, R 13 is a linear alkyl group having 1 to 12 carbon atoms, a branched alkyl group having 3 to 12 carbon atoms, an aryl group having 6 to 12 carbon atoms, a benzyl group, carbon A hydroxyalkyl group having 1 to 12 carbon atoms or an alicyclic hydrocarbon group having 3 to 12 carbon atoms constituting the main ring)
請求項1または2に記載の感光性樹脂組成物から得られるパターン膜を有するフラットパネルディスプレイ。 A flat panel display having a pattern film obtained from the photosensitive resin composition according to claim 1. 請求項1または2に記載の感光性樹脂組成物から得られるパターン膜を有する半導体デバイス。 A semiconductor device having a pattern film obtained from the photosensitive resin composition according to claim 1.
JP2011047818A 2011-03-04 2011-03-04 Photosensitive resin composition and use thereof Active JP5691657B2 (en)

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JP2012185291A JP2012185291A (en) 2012-09-27
JP2012185291A5 true JP2012185291A5 (en) 2014-03-06
JP5691657B2 JP5691657B2 (en) 2015-04-01

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JP2013130816A (en) * 2011-12-22 2013-07-04 Nippon Zeon Co Ltd Resin composition for permanent film and electronic component
JP6143369B2 (en) * 2014-09-29 2017-06-07 富士フイルム株式会社 Resin composition, film, polarizing plate protective film, polarizing plate and liquid crystal display device, bis-type alicyclic cardophenol compound
KR101669341B1 (en) * 2014-12-10 2016-10-26 삼성에스디아이 주식회사 Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated by using the same
JP6607109B2 (en) * 2016-03-22 2019-11-20 Jsr株式会社 Cured film, display element, cured film forming material, and cured film forming method
CN115698854A (en) * 2020-08-17 2023-02-03 东丽株式会社 Photosensitive resin composition, cured product, display device, semiconductor device, and method for producing cured product

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JP2003345016A (en) * 2002-05-23 2003-12-03 Fuji Photo Film Co Ltd Resin composition
WO2005008337A1 (en) * 2003-07-16 2005-01-27 Az Electronic Materials (Japan) K.K. Photosensitive resin composition
JP4753237B2 (en) * 2005-07-25 2011-08-24 Azエレクトロニックマテリアルズ株式会社 Photosensitive resin composition
JP5417323B2 (en) * 2008-05-09 2014-02-12 旭化成イーマテリアルズ株式会社 Photosensitive polyimide precursor composition, photosensitive dry film, and flexible printed wiring board
JP5338352B2 (en) * 2009-02-09 2013-11-13 日油株式会社 Positive photosensitive resin composition
JP5526693B2 (en) * 2009-10-09 2014-06-18 日油株式会社 Photosensitive resin composition and use thereof

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