JPWO2022255141A1 - - Google Patents

Info

Publication number
JPWO2022255141A1
JPWO2022255141A1 JP2023525736A JP2023525736A JPWO2022255141A1 JP WO2022255141 A1 JPWO2022255141 A1 JP WO2022255141A1 JP 2023525736 A JP2023525736 A JP 2023525736A JP 2023525736 A JP2023525736 A JP 2023525736A JP WO2022255141 A1 JPWO2022255141 A1 JP WO2022255141A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023525736A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022255141A1 publication Critical patent/JPWO2022255141A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02—Homopolymers or copolymers of hydrocarbons
    • C09J125/04—Homopolymers or copolymers of styrene
    • C09J125/08—Copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2023525736A 2021-06-02 2022-05-23 Pending JPWO2022255141A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021092772 2021-06-02
PCT/JP2022/021075 WO2022255141A1 (ja) 2021-06-02 2022-05-23 接着剤組成物

Publications (1)

Publication Number Publication Date
JPWO2022255141A1 true JPWO2022255141A1 (ja) 2022-12-08

Family

ID=84323324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023525736A Pending JPWO2022255141A1 (ja) 2021-06-02 2022-05-23

Country Status (2)

Country Link
JP (1) JPWO2022255141A1 (ja)
WO (1) WO2022255141A1 (ja)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007051226A (ja) * 2005-08-18 2007-03-01 Ajinomoto Co Inc 低誘電率樹脂組成物
JP5649773B2 (ja) * 2007-05-31 2015-01-07 三菱瓦斯化学株式会社 硬化性樹脂組成物および硬化性フィルムならびにそれらの硬化物
JP6493745B2 (ja) * 2015-03-31 2019-04-03 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、樹脂付きフィルム、積層板及びプリント配線板及び半導体パッケージ
JP6863126B2 (ja) * 2017-06-22 2021-04-21 昭和電工マテリアルズ株式会社 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ
JP7081127B2 (ja) * 2017-12-05 2022-06-07 昭和電工マテリアルズ株式会社 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び高速通信対応モジュール
TWI814832B (zh) * 2018-06-01 2023-09-11 日商三菱瓦斯化學股份有限公司 樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片及印刷配線板
JP7396999B2 (ja) * 2018-10-31 2023-12-12 三井化学株式会社 ベンダブル配線基板、伸縮できる配線基板およびそれらによる電子デバイス
TW202039659A (zh) * 2018-12-18 2020-11-01 日商日立化成股份有限公司 複合材料及其製造方法、預浸體、積層板、印刷線路板以及半導體封裝體

Also Published As

Publication number Publication date
WO2022255141A1 (ja) 2022-12-08

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