JPWO2022254807A1 - - Google Patents

Info

Publication number
JPWO2022254807A1
JPWO2022254807A1 JP2023525387A JP2023525387A JPWO2022254807A1 JP WO2022254807 A1 JPWO2022254807 A1 JP WO2022254807A1 JP 2023525387 A JP2023525387 A JP 2023525387A JP 2023525387 A JP2023525387 A JP 2023525387A JP WO2022254807 A1 JPWO2022254807 A1 JP WO2022254807A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023525387A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022254807A1 publication Critical patent/JPWO2022254807A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, electron beams [EB]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2023525387A 2021-06-02 2022-02-17 Pending JPWO2022254807A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021092980 2021-06-02
PCT/JP2022/006309 WO2022254807A1 (ja) 2021-06-02 2022-02-17 レーザーはんだ装置、制御装置及びレーザーはんだ付け方法

Publications (1)

Publication Number Publication Date
JPWO2022254807A1 true JPWO2022254807A1 (https=) 2022-12-08

Family

ID=84324148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023525387A Pending JPWO2022254807A1 (https=) 2021-06-02 2022-02-17

Country Status (3)

Country Link
US (1) US20240253142A1 (https=)
JP (1) JPWO2022254807A1 (https=)
WO (1) WO2022254807A1 (https=)

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62248565A (ja) * 1986-04-22 1987-10-29 Toshiba Corp レ−ザ半田付装置
JPH06201325A (ja) * 1992-11-09 1994-07-19 Philips Electron Nv 反射放射ビームによる物体の調査方法とデバイスおよびその使用に適したイメージセンサ
EP1372016A2 (en) * 2002-06-15 2003-12-17 Brocklehurst John Robert Dynamic shaping of laser beams
JP2004255461A (ja) * 2003-02-03 2004-09-16 Seiko Epson Corp レーザー加工方法、レーザー溶接方法並びにレーザー加工装置
JP2008277406A (ja) * 2007-04-26 2008-11-13 I-Pulse Co Ltd レーザリフロー装置
JP2009160602A (ja) * 2007-12-28 2009-07-23 Sanyo Electric Co Ltd 半田付け装置
JP2013515612A (ja) * 2009-12-23 2013-05-09 イムラ アメリカ インコーポレイテッド 光学素子構造体と集束ビームとを用いたレーザ利用パターン形成
DE102017200170A1 (de) * 2017-01-09 2018-07-12 Robert Bosch Gmbh Vorrichtung und Verfahren zur Formung eines Laserstrahls durch einen programmierbaren Strahlformer
JP2018187638A (ja) * 2017-04-28 2018-11-29 武蔵エンジニアリング株式会社 レーザーはんだ付け方法および装置
JP2019161153A (ja) * 2018-03-16 2019-09-19 シャープ株式会社 半田付け方法及び半田付け装置
JP2020025985A (ja) * 2018-08-16 2020-02-20 台達電子工業股▲ふん▼有限公司Ｄｅｌｔａ Ｅｌｅｃｔｒｏｎｉｃｓ，Ｉｎｃ． マルチビームはんだ付けシステムおよびマルチビームはんだ付け方法
US20200251442A1 (en) * 2019-02-01 2020-08-06 Laserssel Co., Ltd. Multi-beam laser de-bonding apparatus and method thereof
DE102019108131A1 (de) * 2019-03-28 2020-10-01 Pulsar Photonics Gmbh Vorrichtung und Verfahren zur Ausbildung von VIA-Laserbohrungen
CN111922513A (zh) * 2020-07-23 2020-11-13 武汉华工激光工程有限责任公司 一种激光焊接光束整形优化装置

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62248565A (ja) * 1986-04-22 1987-10-29 Toshiba Corp レ−ザ半田付装置
JPH06201325A (ja) * 1992-11-09 1994-07-19 Philips Electron Nv 反射放射ビームによる物体の調査方法とデバイスおよびその使用に適したイメージセンサ
EP1372016A2 (en) * 2002-06-15 2003-12-17 Brocklehurst John Robert Dynamic shaping of laser beams
JP2004255461A (ja) * 2003-02-03 2004-09-16 Seiko Epson Corp レーザー加工方法、レーザー溶接方法並びにレーザー加工装置
JP2008277406A (ja) * 2007-04-26 2008-11-13 I-Pulse Co Ltd レーザリフロー装置
JP2009160602A (ja) * 2007-12-28 2009-07-23 Sanyo Electric Co Ltd 半田付け装置
JP2013515612A (ja) * 2009-12-23 2013-05-09 イムラ アメリカ インコーポレイテッド 光学素子構造体と集束ビームとを用いたレーザ利用パターン形成
DE102017200170A1 (de) * 2017-01-09 2018-07-12 Robert Bosch Gmbh Vorrichtung und Verfahren zur Formung eines Laserstrahls durch einen programmierbaren Strahlformer
JP2018187638A (ja) * 2017-04-28 2018-11-29 武蔵エンジニアリング株式会社 レーザーはんだ付け方法および装置
JP2019161153A (ja) * 2018-03-16 2019-09-19 シャープ株式会社 半田付け方法及び半田付け装置
JP2020025985A (ja) * 2018-08-16 2020-02-20 台達電子工業股▲ふん▼有限公司Ｄｅｌｔａ Ｅｌｅｃｔｒｏｎｉｃｓ，Ｉｎｃ． マルチビームはんだ付けシステムおよびマルチビームはんだ付け方法
US20200251442A1 (en) * 2019-02-01 2020-08-06 Laserssel Co., Ltd. Multi-beam laser de-bonding apparatus and method thereof
DE102019108131A1 (de) * 2019-03-28 2020-10-01 Pulsar Photonics Gmbh Vorrichtung und Verfahren zur Ausbildung von VIA-Laserbohrungen
CN111922513A (zh) * 2020-07-23 2020-11-13 武汉华工激光工程有限责任公司 一种激光焊接光束整形优化装置

Also Published As

Publication number Publication date
WO2022254807A1 (ja) 2022-12-08
US20240253142A1 (en) 2024-08-01

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