JPWO2022244235A1 - - Google Patents

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Publication number
JPWO2022244235A1
JPWO2022244235A1 JP2023522160A JP2023522160A JPWO2022244235A1 JP WO2022244235 A1 JPWO2022244235 A1 JP WO2022244235A1 JP 2023522160 A JP2023522160 A JP 2023522160A JP 2023522160 A JP2023522160 A JP 2023522160A JP WO2022244235 A1 JPWO2022244235 A1 JP WO2022244235A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023522160A
Other versions
JP7551915B2 (ja
JPWO2022244235A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022244235A1 publication Critical patent/JPWO2022244235A1/ja
Publication of JPWO2022244235A5 publication Critical patent/JPWO2022244235A5/ja
Application granted granted Critical
Publication of JP7551915B2 publication Critical patent/JP7551915B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06766—Input circuits therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/28—Provision in measuring instruments for reference values, e.g. standard voltage, standard waveform
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R23/00—Arrangements for measuring frequencies; Arrangements for analysing frequency spectra
    • G01R23/02—Arrangements for measuring frequency, e.g. pulse repetition rate; Arrangements for measuring period of current or voltage
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R23/00—Arrangements for measuring frequencies; Arrangements for analysing frequency spectra
    • G01R23/02—Arrangements for measuring frequency, e.g. pulse repetition rate; Arrangements for measuring period of current or voltage
    • G01R23/12—Arrangements for measuring frequency, e.g. pulse repetition rate; Arrangements for measuring period of current or voltage by converting frequency into phase shift
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/305—Contactless testing using electron beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/22—Optical, image processing or photographic arrangements associated with the tube
    • H01J37/222—Image processing arrangements associated with the tube
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/22—Treatment of data
    • H01J2237/221—Image processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26—Electron or ion microscopes
    • H01J2237/28—Scanning microscopes
    • H01J2237/2813—Scanning microscopes characterised by the application
    • H01J2237/2817—Pattern inspection

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2023522160A 2021-05-21 2021-05-21 試料検査装置 Active JP7551915B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/019365 WO2022244235A1 (ja) 2021-05-21 2021-05-21 試料検査装置

Publications (3)

Publication Number Publication Date
JPWO2022244235A1 true JPWO2022244235A1 (ja) 2022-11-24
JPWO2022244235A5 JPWO2022244235A5 (ja) 2024-02-15
JP7551915B2 JP7551915B2 (ja) 2024-09-17

Family

ID=84140347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023522160A Active JP7551915B2 (ja) 2021-05-21 2021-05-21 試料検査装置

Country Status (5)

Country Link
US (1) US20240255556A1 (ja)
JP (1) JP7551915B2 (ja)
CN (1) CN117280224A (ja)
TW (1) TWI801243B (ja)
WO (1) WO2022244235A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11719746B2 (en) * 2018-06-28 2023-08-08 Hitachi High-Tech Corporation Semiconductor inspection device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002026100A (ja) * 2000-07-04 2002-01-25 Hitachi Ltd 半導体基板および電気回路製造プロセスの検査方法並びに電気回路装置の製造方法
CN1265232C (zh) * 2000-12-01 2006-07-19 凸版印刷株式会社 电路图形检测装置和电路图形检测方法
JP2002296314A (ja) 2001-03-29 2002-10-09 Hitachi Ltd 半導体デバイスのコンタクト不良検査方法及びその装置
US7190458B2 (en) * 2003-12-09 2007-03-13 Applied Materials, Inc. Use of scanning beam for differential evaluation of adjacent regions for change in reflectivity
JP2007071740A (ja) * 2005-09-08 2007-03-22 Jeol Ltd マニピュレータを備える荷電粒子ビーム装置
JP5873741B2 (ja) * 2012-03-09 2016-03-01 株式会社日立ハイテクノロジーズ 半導体検査装置および半導体検査方法
US10191111B2 (en) * 2013-03-24 2019-01-29 Dcg Systems, Inc. Synchronized pulsed LADA for the simultaneous acquisition of timing diagrams and laser-induced upsets
JP6604629B2 (ja) 2016-02-15 2019-11-13 株式会社Ｓｃｒｅｅｎホールディングス 検査装置及び検査方法
WO2019155520A1 (ja) * 2018-02-06 2019-08-15 株式会社 日立ハイテクノロジーズ プローブモジュールおよびプローブ
KR102632983B1 (ko) 2018-08-28 2024-02-06 에이에스엠엘 네델란즈 비.브이. 시간 의존적 결함 검사 장치

Also Published As

Publication number Publication date
CN117280224A (zh) 2023-12-22
JP7551915B2 (ja) 2024-09-17
US20240255556A1 (en) 2024-08-01
KR20230171984A (ko) 2023-12-21
TW202246789A (zh) 2022-12-01
TWI801243B (zh) 2023-05-01
WO2022244235A1 (ja) 2022-11-24

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