JPWO2022239806A1 - - Google Patents
Info
- Publication number
- JPWO2022239806A1 JPWO2022239806A1 JP2022560161A JP2022560161A JPWO2022239806A1 JP WO2022239806 A1 JPWO2022239806 A1 JP WO2022239806A1 JP 2022560161 A JP2022560161 A JP 2022560161A JP 2022560161 A JP2022560161 A JP 2022560161A JP WO2022239806 A1 JPWO2022239806 A1 JP WO2022239806A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
- H01L23/49513—Lead-frames or other flat leads characterised by the die pad having bonding material between chip and die pad
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Conductive Materials (AREA)
- Die Bonding (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021082513 | 2021-05-14 | ||
JP2021082513 | 2021-05-14 | ||
PCT/JP2022/019958 WO2022239806A1 (en) | 2021-05-14 | 2022-05-11 | Silver-containing paste |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2022239806A1 true JPWO2022239806A1 (en) | 2022-11-17 |
JP7201139B1 JP7201139B1 (en) | 2023-01-10 |
JPWO2022239806A5 JPWO2022239806A5 (en) | 2023-04-19 |
Family
ID=84029671
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022560161A Active JP7201139B1 (en) | 2021-05-14 | 2022-05-11 | Silver-containing paste |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7201139B1 (en) |
KR (1) | KR20230165351A (en) |
CN (1) | CN117321757B (en) |
TW (1) | TW202302802A (en) |
WO (1) | WO2022239806A1 (en) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2278593A4 (en) * | 2008-04-30 | 2013-08-28 | Hitachi Chemical Co Ltd | Connecting material and semiconductor device |
JP6603989B2 (en) * | 2015-01-09 | 2019-11-13 | 日立化成株式会社 | COMPOSITE PARTICLE AND ITS MANUFACTURING METHOD, ELECTRIC CONDUCTIVE PASTE, SINTERED BODY AND SEMICONDUCTOR DEVICE |
JP6675155B2 (en) * | 2015-05-20 | 2020-04-01 | 京セラ株式会社 | Die attach paste for semiconductor and semiconductor device |
KR102040529B1 (en) * | 2016-08-19 | 2019-11-06 | 스미또모 베이크라이트 가부시키가이샤 | Die attach pastes and semiconductor devices |
JP6455630B2 (en) * | 2016-10-31 | 2019-01-23 | 住友ベークライト株式会社 | Thermally conductive paste and electronic device |
JP6950175B2 (en) | 2016-12-08 | 2021-10-13 | 住友ベークライト株式会社 | Paste-like adhesive composition and electronics |
JP7156831B2 (en) * | 2017-09-20 | 2022-10-19 | 矢崎総業株式会社 | Conductive composition and wiring board using the same |
JP6502606B1 (en) | 2018-04-19 | 2019-04-17 | ニホンハンダ株式会社 | Paste-like silver particle composition, bonding method and method of manufacturing electronic device |
WO2020013250A1 (en) * | 2018-07-11 | 2020-01-16 | 日立化成株式会社 | Method for manufacturing semiconductor device, heat-curable resin composition, and dicing-die attach film |
-
2022
- 2022-05-11 JP JP2022560161A patent/JP7201139B1/en active Active
- 2022-05-11 WO PCT/JP2022/019958 patent/WO2022239806A1/en active Application Filing
- 2022-05-11 KR KR1020237039751A patent/KR20230165351A/en not_active Application Discontinuation
- 2022-05-11 CN CN202280035057.8A patent/CN117321757B/en active Active
- 2022-05-13 TW TW111117962A patent/TW202302802A/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN117321757A (en) | 2023-12-29 |
TW202302802A (en) | 2023-01-16 |
JP7201139B1 (en) | 2023-01-10 |
WO2022239806A1 (en) | 2022-11-17 |
CN117321757B (en) | 2024-09-17 |
KR20230165351A (en) | 2023-12-05 |
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