JPWO2023038146A1 - - Google Patents

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Publication number
JPWO2023038146A1
JPWO2023038146A1 JP2022579049A JP2022579049A JPWO2023038146A1 JP WO2023038146 A1 JPWO2023038146 A1 JP WO2023038146A1 JP 2022579049 A JP2022579049 A JP 2022579049A JP 2022579049 A JP2022579049 A JP 2022579049A JP WO2023038146 A1 JPWO2023038146 A1 JP WO2023038146A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022579049A
Other languages
Japanese (ja)
Other versions
JP7249473B1 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023038146A1 publication Critical patent/JPWO2023038146A1/ja
Application granted granted Critical
Publication of JP7249473B1 publication Critical patent/JP7249473B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2022579049A 2021-09-13 2022-09-13 Conductive resin composition and cured product thereof Active JP7249473B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021148790 2021-09-13
JP2021148790 2021-09-13
PCT/JP2022/034155 WO2023038146A1 (en) 2021-09-13 2022-09-13 Electroconductive resin composition and cured product thereof

Publications (2)

Publication Number Publication Date
JPWO2023038146A1 true JPWO2023038146A1 (en) 2023-03-16
JP7249473B1 JP7249473B1 (en) 2023-03-30

Family

ID=85506512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022579049A Active JP7249473B1 (en) 2021-09-13 2022-09-13 Conductive resin composition and cured product thereof

Country Status (3)

Country Link
JP (1) JP7249473B1 (en)
TW (1) TW202311441A (en)
WO (1) WO2023038146A1 (en)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3727155B2 (en) * 1997-09-29 2005-12-14 スリーエム カンパニー Conductive epoxy resin composition, anisotropic conductive adhesive film, and electrical connection method between conductors
JPH1160899A (en) * 1997-08-19 1999-03-05 Minnesota Mining & Mfg Co <3M> Conductive epoxy resin composition, anisotropic conductive adhesive film, and electrical connection method
JP2004155957A (en) * 2002-11-07 2004-06-03 Three M Innovative Properties Co Anisotropic conductive adhesive and film
JP5736122B2 (en) * 2010-05-10 2015-06-17 横浜ゴム株式会社 Structural adhesive
JP2013229277A (en) * 2012-03-31 2013-11-07 Aica Kogyo Co Ltd Conductive adhesive film
JP6331013B2 (en) * 2014-05-21 2018-05-30 株式会社スリーボンド Cationic curable resin composition
JP6967726B2 (en) * 2018-01-31 2021-11-17 パナソニックＩｐマネジメント株式会社 Solder paste and mounting structure
US11332645B2 (en) * 2018-02-14 2022-05-17 Threebond Co., Ltd. Conductive adhesive and cured product thereof
JP7125907B2 (en) * 2019-03-19 2022-08-25 タツタ電線株式会社 conductive composition

Also Published As

Publication number Publication date
JP7249473B1 (en) 2023-03-30
TW202311441A (en) 2023-03-16
WO2023038146A1 (en) 2023-03-16

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