JPWO2022239657A1 - - Google Patents

Info

Publication number
JPWO2022239657A1
JPWO2022239657A1 JP2023520971A JP2023520971A JPWO2022239657A1 JP WO2022239657 A1 JPWO2022239657 A1 JP WO2022239657A1 JP 2023520971 A JP2023520971 A JP 2023520971A JP 2023520971 A JP2023520971 A JP 2023520971A JP WO2022239657 A1 JPWO2022239657 A1 JP WO2022239657A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023520971A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022239657A1 publication Critical patent/JPWO2022239657A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B32B2255/205—Metallic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
JP2023520971A 2021-05-12 2022-04-27 Pending JPWO2022239657A1 (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021080980 2021-05-12
PCT/JP2022/019095 WO2022239657A1 (ja) 2021-05-12 2022-04-27 樹脂フィルムおよびその製造方法、ならびに金属化樹脂フィルム、プリント配線板

Publications (1)

Publication Number Publication Date
JPWO2022239657A1 true JPWO2022239657A1 (enExample) 2022-11-17

Family

ID=84028307

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023520971A Pending JPWO2022239657A1 (enExample) 2021-05-12 2022-04-27

Country Status (5)

Country Link
JP (1) JPWO2022239657A1 (enExample)
KR (1) KR20240006611A (enExample)
CN (1) CN117279782A (enExample)
TW (1) TW202302716A (enExample)
WO (1) WO2022239657A1 (enExample)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI296569B (en) * 2003-08-27 2008-05-11 Mitsui Chemicals Inc Polyimide metal laminated matter
JP3977790B2 (ja) 2003-09-01 2007-09-19 古河サーキットフォイル株式会社 キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板
JP5037168B2 (ja) * 2007-02-23 2012-09-26 株式会社カネカ 無電解めっき用材料、積層体及びプリント配線板
CN105339416B (zh) * 2013-06-28 2017-07-14 新日铁住金化学株式会社 聚酰亚胺、树脂膜及金属包覆层叠体
WO2015094848A1 (en) * 2013-12-17 2015-06-25 E. I. Du Pont Nemours And Company A multilayer film
CN107000369B (zh) * 2014-12-10 2019-05-14 E.I.内穆尔杜邦公司 多层膜
CN108136755B (zh) * 2015-10-15 2021-06-29 日铁化学材料株式会社 聚酰亚胺层叠体及其制造方法
JP7122162B2 (ja) * 2018-06-01 2022-08-19 株式会社カネカ 熱可塑性ポリイミドフィルム、多層ポリイミドフィルム、およびフレキシブル金属張積層板
JP6706013B1 (ja) 2019-10-02 2020-06-03 住友金属鉱山株式会社 銅張積層板および銅張積層板の製造方法
JP7405560B2 (ja) * 2019-10-29 2023-12-26 日鉄ケミカル＆マテリアル株式会社 樹脂組成物、樹脂フィルム及び金属張積層板

Also Published As

Publication number Publication date
TW202302716A (zh) 2023-01-16
CN117279782A (zh) 2023-12-22
WO2022239657A1 (ja) 2022-11-17
KR20240006611A (ko) 2024-01-15

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20250227