JPWO2022224886A1 - - Google Patents

Info

Publication number
JPWO2022224886A1
JPWO2022224886A1 JP2023515431A JP2023515431A JPWO2022224886A1 JP WO2022224886 A1 JPWO2022224886 A1 JP WO2022224886A1 JP 2023515431 A JP2023515431 A JP 2023515431A JP 2023515431 A JP2023515431 A JP 2023515431A JP WO2022224886 A1 JPWO2022224886 A1 JP WO2022224886A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023515431A
Other versions
JPWO2022224886A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022224886A1 publication Critical patent/JPWO2022224886A1/ja
Publication of JPWO2022224886A5 publication Critical patent/JPWO2022224886A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
JP2023515431A 2021-04-22 2022-04-13 Pending JPWO2022224886A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021072460 2021-04-22
PCT/JP2022/017679 WO2022224886A1 (ja) 2021-04-22 2022-04-13 湿式処理装置およびフレキシブルプリント基板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2022224886A1 true JPWO2022224886A1 (ja) 2022-10-27
JPWO2022224886A5 JPWO2022224886A5 (ja) 2024-02-09

Family

ID=83722954

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023515431A Pending JPWO2022224886A1 (ja) 2021-04-22 2022-04-13

Country Status (3)

Country Link
JP (1) JPWO2022224886A1 (ja)
CN (1) CN117178082A (ja)
WO (1) WO2022224886A1 (ja)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59181870U (ja) * 1983-05-18 1984-12-04 三菱電機株式会社 条材の連続電気メツキ装置の回収槽
JP4212081B2 (ja) * 2001-11-09 2009-01-21 日陽エンジニアリング株式会社 連続湿式処理方法及び装置並びに液シール方法及び装置

Also Published As

Publication number Publication date
WO2022224886A1 (ja) 2022-10-27
CN117178082A (zh) 2023-12-05

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