JPWO2022202653A1 - - Google Patents
Info
- Publication number
- JPWO2022202653A1 JPWO2022202653A1 JP2023509120A JP2023509120A JPWO2022202653A1 JP WO2022202653 A1 JPWO2022202653 A1 JP WO2022202653A1 JP 2023509120 A JP2023509120 A JP 2023509120A JP 2023509120 A JP2023509120 A JP 2023509120A JP WO2022202653 A1 JPWO2022202653 A1 JP WO2022202653A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021053518 | 2021-03-26 | ||
| JP2021053518 | 2021-03-26 | ||
| PCT/JP2022/012565 WO2022202653A1 (ja) | 2021-03-26 | 2022-03-18 | ウエハの処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022202653A1 true JPWO2022202653A1 (https=) | 2022-09-29 |
| JP7640675B2 JP7640675B2 (ja) | 2025-03-05 |
Family
ID=83395832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023509120A Active JP7640675B2 (ja) | 2021-03-26 | 2022-03-18 | ウエハの処理方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7640675B2 (https=) |
| WO (1) | WO2022202653A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118119507A (zh) * | 2021-10-27 | 2024-05-31 | 东洋纺株式会社 | 附有保护膜的无机基板与耐热高分子膜的层叠体 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014024861A1 (ja) * | 2012-08-10 | 2014-02-13 | 積水化学工業株式会社 | ウエハの処理方法 |
| JP2014072445A (ja) * | 2012-09-28 | 2014-04-21 | Nitto Denko Corp | 半導体装置の製造方法 |
| JP2017079245A (ja) * | 2015-10-19 | 2017-04-27 | 信越化学工業株式会社 | ウエハ加工体、ウエハ加工用仮接着材、及び薄型ウエハの製造方法 |
| JP2019186470A (ja) * | 2018-04-16 | 2019-10-24 | 信越化学工業株式会社 | 回路付基板加工体及び回路付基板加工方法 |
| JP2020038866A (ja) * | 2018-09-03 | 2020-03-12 | 信越化学工業株式会社 | 薄型ウエハの製造方法 |
-
2022
- 2022-03-18 JP JP2023509120A patent/JP7640675B2/ja active Active
- 2022-03-18 WO PCT/JP2022/012565 patent/WO2022202653A1/ja not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014024861A1 (ja) * | 2012-08-10 | 2014-02-13 | 積水化学工業株式会社 | ウエハの処理方法 |
| JP2014072445A (ja) * | 2012-09-28 | 2014-04-21 | Nitto Denko Corp | 半導体装置の製造方法 |
| JP2017079245A (ja) * | 2015-10-19 | 2017-04-27 | 信越化学工業株式会社 | ウエハ加工体、ウエハ加工用仮接着材、及び薄型ウエハの製造方法 |
| JP2019186470A (ja) * | 2018-04-16 | 2019-10-24 | 信越化学工業株式会社 | 回路付基板加工体及び回路付基板加工方法 |
| JP2020038866A (ja) * | 2018-09-03 | 2020-03-12 | 信越化学工業株式会社 | 薄型ウエハの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022202653A1 (ja) | 2022-09-29 |
| TW202249102A (zh) | 2022-12-16 |
| JP7640675B2 (ja) | 2025-03-05 |
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