JPWO2022202098A1 - - Google Patents
Info
- Publication number
- JPWO2022202098A1 JPWO2022202098A1 JP2023508841A JP2023508841A JPWO2022202098A1 JP WO2022202098 A1 JPWO2022202098 A1 JP WO2022202098A1 JP 2023508841 A JP2023508841 A JP 2023508841A JP 2023508841 A JP2023508841 A JP 2023508841A JP WO2022202098 A1 JPWO2022202098 A1 JP WO2022202098A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials For Photolithography (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Polymerisation Methods In General (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021046929 | 2021-03-22 | ||
PCT/JP2022/007899 WO2022202098A1 (ja) | 2021-03-22 | 2022-02-25 | 感光性樹脂組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022202098A1 true JPWO2022202098A1 (ko) | 2022-09-29 |
Family
ID=83395591
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023508841A Pending JPWO2022202098A1 (ko) | 2021-03-22 | 2022-02-25 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2022202098A1 (ko) |
KR (1) | KR20230160249A (ko) |
CN (1) | CN116982003A (ko) |
TW (1) | TW202244131A (ko) |
WO (1) | WO2022202098A1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI804086B (zh) | 2021-03-26 | 2023-06-01 | 財團法人工業技術研究院 | 聚醯亞胺、薄膜組合物及其所形成之薄膜 |
CN115626989B (zh) * | 2022-10-28 | 2023-06-13 | 嘉兴瑞华泰薄膜技术有限公司 | 光敏聚酰亚胺、光敏聚酰亚胺薄膜及其制备方法和应用 |
WO2024185652A1 (ja) * | 2023-03-08 | 2024-09-12 | 富士フイルム株式会社 | 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01113748A (ja) * | 1987-10-27 | 1989-05-02 | Hitachi Chem Co Ltd | 感光性樹脂組成物 |
JPH01118514A (ja) * | 1987-11-02 | 1989-05-11 | Hitachi Chem Co Ltd | 感光性樹脂組成物 |
WO1999051662A1 (fr) * | 1998-04-01 | 1999-10-14 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Compositions de polyimides |
JP2000347404A (ja) | 1999-06-02 | 2000-12-15 | Hitachi Chemical Dupont Microsystems Ltd | 感光性重合体組成物並びにこれを用いた電子部品及びその製造法 |
CN114730132A (zh) * | 2019-11-27 | 2022-07-08 | 富士胶片株式会社 | 固化性树脂组合物、固化膜、层叠体、固化膜的制造方法、半导体器件及树脂 |
-
2022
- 2022-02-25 WO PCT/JP2022/007899 patent/WO2022202098A1/ja active Application Filing
- 2022-02-25 KR KR1020237030944A patent/KR20230160249A/ko unknown
- 2022-02-25 CN CN202280019418.XA patent/CN116982003A/zh active Pending
- 2022-02-25 JP JP2023508841A patent/JPWO2022202098A1/ja active Pending
- 2022-03-04 TW TW111107866A patent/TW202244131A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW202244131A (zh) | 2022-11-16 |
KR20230160249A (ko) | 2023-11-23 |
CN116982003A (zh) | 2023-10-31 |
WO2022202098A1 (ja) | 2022-09-29 |