JPWO2022202080A1 - - Google Patents

Info

Publication number
JPWO2022202080A1
JPWO2022202080A1 JP2022542044A JP2022542044A JPWO2022202080A1 JP WO2022202080 A1 JPWO2022202080 A1 JP WO2022202080A1 JP 2022542044 A JP2022542044 A JP 2022542044A JP 2022542044 A JP2022542044 A JP 2022542044A JP WO2022202080 A1 JPWO2022202080 A1 JP WO2022202080A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022542044A
Other languages
Japanese (ja)
Other versions
JPWO2022202080A5 (en
JP7153167B1 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022202080A1 publication Critical patent/JPWO2022202080A1/ja
Application granted granted Critical
Publication of JP7153167B1 publication Critical patent/JP7153167B1/en
Publication of JPWO2022202080A5 publication Critical patent/JPWO2022202080A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/34—Applying different liquids or other fluent materials simultaneously
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2022542044A 2021-03-25 2022-02-24 Manufacturing method of flexible printed circuit board Active JP7153167B1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2021050881 2021-03-25
JP2021050882 2021-03-25
JP2021050882 2021-03-25
JP2021050881 2021-03-25
PCT/JP2022/007678 WO2022202080A1 (en) 2021-03-25 2022-02-24 Method for manufacturing flexible printed circuit board

Publications (3)

Publication Number Publication Date
JPWO2022202080A1 true JPWO2022202080A1 (en) 2022-09-29
JP7153167B1 JP7153167B1 (en) 2022-10-13
JPWO2022202080A5 JPWO2022202080A5 (en) 2023-02-21

Family

ID=83397044

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022542044A Active JP7153167B1 (en) 2021-03-25 2022-02-24 Manufacturing method of flexible printed circuit board

Country Status (4)

Country Link
JP (1) JP7153167B1 (en)
KR (1) KR102516437B1 (en)
CN (1) CN115918275B (en)
WO (1) WO2022202080A1 (en)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1065348A (en) * 1996-08-21 1998-03-06 Ibiden Co Ltd Manufacture of multi-layer printed wiring board
JP2000156556A (en) * 1998-11-20 2000-06-06 Kansai Paint Co Ltd Method for forming resist layer on substrate having through hole part and production of printed wiring board
EP1009206A3 (en) * 1998-12-02 2003-01-15 Ajinomoto Co., Inc. Method of vacuum-laminating adhesive film
JP2002306998A (en) * 2001-04-16 2002-10-22 Sumitomo Chem Co Ltd Method for manufacturing plate like coated material and coating apparatus therefor
JP2004071825A (en) * 2002-08-06 2004-03-04 Taiyo Ink Mfg Ltd Method for manufacturing multilayer printed wiring board
CN100342983C (en) * 2005-03-18 2007-10-17 叶步章 Drum apparatus capable of limiting printing ink cloak bound (PCB)
TWI507479B (en) * 2010-12-14 2015-11-11 Kaneka Corp Novel photosensitive resin composition and use thereof
TW201524288A (en) 2013-12-11 2015-06-16 Microcosm Technology Co Ltd Coating device and coating method
JP6345947B2 (en) 2014-02-27 2018-06-20 株式会社タムラ製作所 Photosensitive resin composition
US11402754B2 (en) 2016-11-18 2022-08-02 Arisawa Mfg. Co., Ltd. Photosensitive resin composition, solder resist film using said photosensitive resin composition, flexible printed wiring board, and image display device
JPWO2019160126A1 (en) * 2018-02-19 2021-02-25 株式会社カネカ Photosensitive resin composition, cured film, printed wiring board and its manufacturing method, and photosensitive resin composition manufacturing kit
JP2020148971A (en) 2019-03-14 2020-09-17 株式会社タムラ製作所 Photosensitive resin composition

Also Published As

Publication number Publication date
KR20230005409A (en) 2023-01-09
KR102516437B1 (en) 2023-03-31
WO2022202080A1 (en) 2022-09-29
CN115918275A (en) 2023-04-04
CN115918275B (en) 2023-10-27
JP7153167B1 (en) 2022-10-13

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